Flip Chip Market by Packaging Technology, Bumping Technology, Industry - Global Opportunity Analysis and Industry Forecast, 2014 - 2022

  • ID: 3934608
  • Report
  • Region: Global
  • 204 pages
  • Allied Analytics LLP
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FEATURED COMPANIES

  • 3M
  • AMD, Inc.
  • Amkor Technology, Inc.
  • Apple, Inc.
  • Fujitsu Ltd.
  • IBM
  • MORE
Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, 2D IC), Bumping Technology (Copper Pillar, Solder Bumping, Tin-lead eutectic solder, Lead-free solder, Gold Bumping), Industry (Electronics, Industrial, Automotive & Transport) - Global Opportunity Analysis and Industry Forecast, 2014 - 2022

Flip chip, also known as controlled collapse chip connection (C4), consist of conductive bumps deposited on the chip pads on the top side of the wafer and then semiconductor devices are mounted by flipping the chip. It is an advanced semiconductor interconnecting device extensively used in different electronic products such as smartphones, PCs, and medical devices among others due to its advantages such as lower cost, increased packaging density, improved performance and reduced size & thickness of the chip. Further, flip chip has enabled the dramatic improvement of portable electronics and electric vehicles by providing better means for electrical interconnections.

Flip chip market is mainly driven by the emerging internet of things: a network of physical devices, vehicles, buildings, and other items that include embedded electronics, software, sensors, actuators, and network connectivity. In addition, its technological superiority over the traditional wire bond electrical connection makes it the exceptional alternative. However, the technology is still in mutation. The rate of flip chip is propelled by bumping cost and assembly process cost.

The market is segmented on the basis of flip chip packaging technology, bumping technology, industry vertical, and geography. Based on bumping technology, the market comprises copper pillar, solder bumping, gold bumping and others including aluminum & conductive polymer bumping. The copper pillar segment dominates the market as it is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future electronic device requirements. It is an excellent interconnect choice for applications such as transceivers, embedded processors, and application processors.

Based on packaging technology, the market is segmented into 3D IC, 2.5D IC, and 2D IC. Among the three, 2.5D IC packaging dominated the market in 2015 owing to its several advantages such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption. Based on industry vertical, the market is segmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others. The market is analyzed on the basis of four regions—North America, Europe, Asia-Pacific, and LAMEA.

The key players operating in flip chip market are IBM Corporation, Intel Corporation, Fujitsu Ltd, 3M, Samsung electronics Co., Ltd, Amkor Technology, Inc., TSMC, Ltd, Apple, Inc., Texas Instruments, Inc., and AMD, Inc. among others.

POTENTIAL BENEFITS FOR STAKEHOLDERS:

This report provides an in-depth analysis of the world flip chip market along with current trends and future estimations to identify lucrative investment opportunities.
This report identifies the key drivers, opportunities, and restraints that shape the market along with their impact analysis.
Porter’s Five Forces analysis highlights the potency of buyers and suppliers participating in this market to facilitate better business decisions for stakeholders and strengthen their supplier and buyer networks.
Market estimation of geographical regions is based on the current market scenario and future trends.

MARKET SEGMENTATION

The market is segmented on the basis of packaging technology, bumping technology, industry vertical, and geography.

BY PACKAGING TECHNOLOGY

3D IC
2.5D IC
2D IC

BY BUMPING TECHNOLOGY

Copper Pillar
Solder Bumping
Tin-Lead Eutectic Solder
Lead-Free Solder
Gold Bumping
Others (Aluminum & Conductive Polymer)

BY INDUSTRY

Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace and Defense
Others (Renewable Energy and Media & Entertainment )

BY GEOGRAPHY

North America
U.S.
Canada
Mexico
Europe
Germany
France
Italy
Rest of Europe
Asia-Pacific
China
Japan
Taiwan
Korea
India
Rest of Asia-Pacific
LAMEA
Latin America
Middle East
Africa
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FEATURED COMPANIES

  • 3M
  • AMD, Inc.
  • Amkor Technology, Inc.
  • Apple, Inc.
  • Fujitsu Ltd.
  • IBM
  • MORE
CHAPTER 1 Introduction

1.1 Report Description
1.2 Key benefits
1.3 Key Market Segments
1.4 Research Methodology

1.4.1 Secondary research
1.4.2 Primary research
1.4.3 Analyst tools and models

CHAPTER 2 EXECUTIVE SUMMARY

2.1 CXO Perspective

CHAPTER 3 MARKET OVERVIEW

3.1 Market Definition and Scope
3.2 Key findings

3.2.1 Top investment pockets
3.2.2 Top winning strategies

3.3 Porters five force analysis

3.3.1 Bargaining power of suppliers
3.3.2 Bargaining power of buyers
3.3.3 Threats from the new entrants
3.3.4 Threats of substitutes
3.3.5 Competitive rivalry

3.4 Value chain analysis
3.5 Market share analysis
3.6 Drivers

3.6.1 Thriving portable electronic market and increasing popularity of internet of things (IoT)
3.6.2 Usage in graphic cards and processors used in real world gaming
3.6.3 Impending need for circuit miniaturization in microelectronic devices
3.6.4 Technological superiority over wire bonding

3.7 Restraints

3.7.1 Higher cost and less customization options available in comparison to wire bonding

3.8 Opportunities

3.8.1 Impending need of high frequency in electronic gadgets

CHAPTER 4 WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY

4.1 Overview
4.2 3D IC

4.2.1 Key market trends
4.2.2 Key growth factors and opportunities
4.2.3 Market size and forecast

4.3. 5D IC

4.3.1 Key market trends
4.3.2 Key growth factors and opportunities
4.3.3 Market size and forecast

4.4 2D IC

4.4.1 Key market trends
4.4.2 Key growth factors and opportunities
4.4.3 Market size and forecast

CHAPTER 5 WORLD FLIP CHIP MARKET, BY INDUSTRY

5.1 Overview
5.2 Electronics

5.2.1 Key market trends
5.2.2 Key growth factors and opportunities
5.2.3 Market size and forecast

5.3 Industrial

5.3.1 Key market trends
5.3.2 Key growth factors and opportunities
5.3.3 Market size and forecast

5.4 Automotive & Transport

5.4.1 Key market trends
5.4.2 Key growth factors and opportunities
5.4.3 Market size and forecast

5.5 Healthcare

5.5.1 Key market trends
5.5.2 Key growth factors and opportunities
5.5.3 Market size and forecast

5.6 IT & Telecommunication

5.6.1 Key market trends occupied
5.6.2 Key growth factors and opportunities
5.6.3 Market size and forecast

5.7 Aerospace & Defense

5.7.1 Key market trends
5.7.2 Key growth factors and opportunities
5.7.3 Market size and forecast

5.8 Others

5.8.1 Key market trends
5.8.2 Key growth factors and opportunities
5.8.3 Market size and forecast

CHAPTER 6 WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY

6.1 Overview
6.2 Copper pillar

6.2.1 Key market trends
6.2.2 Key growth factors and opportunities
6.2.3 Market size and forecast

6.3 Solder bumping

6.3.1 Market size and forecast
6.3.2 Tin-Lead solder

6.3.2.1 Key market trends
6.3.2.2 Key growth factors and opportunities
6.3.2.3 Market size and forecast

6.3.3 Lead free solder

6.3.3.1 Key market trends
6.3.3.2 Key growth factors and opportunities
6.3.3.3 Market size and forecast

6.4 Gold bumping

6.4.1 Key market trends
6.4.2 Key growth factors and opportunities
6.4.3 Market size and forecast

6.5 Others

6.5.1 Key market trends
6.5.2 Key growth factors and opportunities
6.5.3 Market size and forecast

CHAPTER 7 WORLD FLIP CHIP MARKET BY GEOGRAPHY

7.1 Overview
7.2 North America

7.2.1 Key market trends
7.2.2 Market size and forecast
7.2.3 U.S.
7.2.4 Canada
7.2.5 Mexico

7.3 Europe

7.3.1 Key market trends
7.3.2 Market size and forecast
7.3.3 U.K.
7.3.4 Germany
7.3.5 Turkey
7.3.6 Spain
7.3.7 Rest of Europe

7.4 Asia-Pacific

7.4.1 Key market trends
7.4.2 Market size and forecast
7.4.3 Australia
7.4.4 China
7.4.5 Japan
7.4.6 India
7.4.7 Rest of Asia-Pacific

7.5 LAMEA

7.5.1 Key market trends
7.5.2 Market size and forecast
7.5.3 Africa
7.5.4 Middle East
7.5.5 Latin America

CHAPTER 8 COMPANY PROFILES

8.1 International Business Machines Corporation (IBM)

8.1.1 Company overview
8.1.2 Company snapshot
8.1.3 Operating business segments
8.1.4 Business performance
8.1.5 Key strategic moves and developments

8.2 3M

8.2.1 Company overview
8.2.2 Company snapshot
8.2.3 Operating business segments
8.2.4 Business performance
8.2.5 Key strategic moves and developments

8.3 Texas Instruments, Inc.

8.3.1 Company overview
8.3.2 Company snapshot
8.3.3 Operating business segments
8.3.4 Business performance
8.3.5 Key strategic moves and developments

8.4 Taiwan Semiconductor Manufacturing Company Ltd.

8.4.1 Company overview
8.4.2 Company snapshot
8.4.3 Operating business segments
8.4.4 Business performance
8.4.5 Key strategic moves and developments

8.5 Apple Inc.

8.5.1 Company overview
8.5.2 Company snapshot
8.5.3 Operating business segments
8.5.4 Business performance
8.5.5 Key strategic moves and developments

8.6 Fujitsu

8.6.1 Company overview
8.6.2 Company snapshot
8.6.3 Operating business segments
8.6.4 Business performance
8.6.5 Key strategic moves and developments

8.7 Intel Corporation

8.7.1 Company overview
8.7.2 Company snapshot
8.7.3 Operating Business Segments:-
8.7.4 Business performance
8.7.5 Key strategic moves and developments

8.8 Advanced Micro Devices, Inc.

8.8.1 Company overview
8.8.2 Company snapshot
8.8.3 Operating business segments
8.8.4 Business performance
8.8.5 Key strategic moves and developments

8.9 Amkor Technology, Inc.

8.9.1 Company overview
8.9.2 Company snapshot
8.9.3 Operating business segments
8.9.4 Business performance
8.9.5 Key strategic moves and developments

8.10 Samsung Electronics Co. Ltd.

8.10.1 Company overview
8.10.2 Operating Business Segments
8.10.3 Business performance
8.10.4 Key Strategic Moves and Developments
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FEATURED COMPANIES

  • 3M
  • AMD, Inc.
  • Amkor Technology, Inc.
  • Apple, Inc.
  • Fujitsu Ltd.
  • IBM
  • MORE
A new report titled, "Flip Chip Market - Global Opportunity Analysis and Industry Forecast, 2014 - 2022", the flip chip market is expected to garner $46 billion by 2022, growing at a CAGR of 9% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global flip chip market and contributed over half of the market share owing to thriving market for semiconductors and electronic devices.

Flip chips majorly differ from each other on the basis of bumping technology used in them. Currently, copper bumping is extensively used in market owing to its advantages such as considerably low cost than other methods, high efficiency and compatibility with bond pads. Furthermore, impending need of circuit miniaturization, thriving portable devices industry and technological superiority over wire bond connections are major factors expected to propel the growth in global flip chip market. However, availability of less customization options as well as high capital investment requirements for setting up a new plant are the limitations that restrict the market growth.

2.5D IC packaging technology dominated the overall market in 2015 owing to its several advantages such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption. 3D IC is expected to register highest CAGR as it is equipped with all the advantages of 2.5D IC as well as some additional advantages.

In bumping technology segment, copper bumping held over 50% in the year 2015 due to its exclusive advantages of low cost, compatibility with bond pads and applications in technologies such as transceivers, embedded processors, application processors, power management, baseband, ASICs and SOCs. However, Tin-lead eutectic solder is expected to witness low growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.

Electronics industry contributed over 45% of the overall flip chip market in the year 2015. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed and improvement in efficiency collectively thrust the replacement of wire bond with flip chips in electronics industry, hence making it dominant in the overall market. However, IT and telecommunication would be the fastest growing segment and is expected to register highest CAGR 12.3% during the forecast period. This is due to the increasing reach of telecommunication services in remote areas as well as introduction of new players in IT industry where flip chips are used in large scale in servers, host systems and data centers.

Asia-pacific dominated the market in the year 2015 by accounting over 50% of the total market revenue and it is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities in the region, high consumption and production of electronic products where flip chip is steadily replacing wire bond and ongoing research and development in the region.

Key Findings of Flip Chip Market:

In 2015, copper pillar led the overall flip chip market revenue, and is projected to grow at a CAGR of 9.8% during the forecast period.
Tin-lead eutectic solder is expected to witness low growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.
Electronics industry constituted significant share in the overall flip chip market in the year 2015 due to imminent need of size reduction in electronics devices, requirement of higher data transmission speed and improvement in efficiency.
In packaging technology of flip chips, 2.5D IC packaging dominated the market in 2015.
Asia-Pacific dominated the market in the year 2015 by accounting over 50% of the total market revenue.
The key players in the flip chip market are focused on expanding their business operations in the emerging countries with new product launches through various research and development facilities. The major players profiled in this report include IBM, Intel Corporation, Fujitsu Ltd., 3M, Samsung electronics Co., Ltd., Amkor Technology, Inc., TSMC, Ltd., Apple, Inc., Texas Instruments, Inc., and AMD, Inc. among others.
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IBM
Intel Corporation
Fujitsu Ltd.
3M
Samsung electronics Co., Ltd.
Amkor Technology, Inc.
TSMC, Ltd.
Apple, Inc.
Texas Instruments, Inc.
AMD, Inc.
Note: Product cover images may vary from those shown
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