Flip chip, also known as controlled collapse chip connection (C4), consist of conductive bumps deposited on the chip pads on the top side of the wafer and then semiconductor devices are mounted by flipping the chip. It is an advanced semiconductor interconnecting device extensively used in different electronic products such as smartphones, PCs, and medical devices among others due to its advantages such as lower cost, increased packaging density, improved performance and reduced size & thickness of the chip. Further, flip chip has enabled the dramatic improvement of portable electronics and electric vehicles by providing better means for electrical interconnections.
Flip chip market is mainly driven by the emerging internet of things: a network of physical devices, vehicles, buildings, and other items that include embedded electronics, software, sensors, actuators, and network connectivity. In addition, its technological superiority over the traditional wire bond electrical connection makes it the exceptional alternative. However, the technology is still in mutation. The rate of flip chip is propelled by bumping cost and assembly process cost.
The market is segmented on the basis of flip chip packaging technology, bumping technology, industry vertical, and geography. Based on bumping technology, the market comprises copper pillar, solder bumping, gold bumping and others including aluminum & conductive polymer bumping. The copper pillar segment dominates the market as it is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future electronic device requirements. It is an excellent interconnect choice for applications such as transceivers, embedded processors, and application processors.
Based on packaging technology, the market is segmented into 3D IC, 2.5D IC, and 2D IC. Among the three, 2.5D IC packaging dominated the market in 2015 owing to its several advantages such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption. Based on industry vertical, the market is segmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others. The market is analyzed on the basis of four regions—North America, Europe, Asia-Pacific, and LAMEA.
The key players operating in flip chip market are IBM Corporation, Intel Corporation, Fujitsu Ltd, 3M, Samsung electronics Co., Ltd, Amkor Technology, Inc., TSMC, Ltd, Apple, Inc., Texas Instruments, Inc., and AMD, Inc. among others.
POTENTIAL BENEFITS FOR STAKEHOLDERS:
This report provides an in-depth analysis of the world flip chip market along with current trends and future estimations to identify lucrative investment opportunities.
This report identifies the key drivers, opportunities, and restraints that shape the market along with their impact analysis.
Porter’s Five Forces analysis highlights the potency of buyers and suppliers participating in this market to facilitate better business decisions for stakeholders and strengthen their supplier and buyer networks.
Market estimation of geographical regions is based on the current market scenario and future trends.
The market is segmented on the basis of packaging technology, bumping technology, industry vertical, and geography.
BY PACKAGING TECHNOLOGY
BY BUMPING TECHNOLOGY
Tin-Lead Eutectic Solder
Others (Aluminum & Conductive Polymer)
Automotive & Transport
IT & Telecommunication
Aerospace and Defense
Others (Renewable Energy and Media & Entertainment )
Rest of Europe
Rest of Asia-Pacific
1.1 Report Description
1.2 Key benefits
1.3 Key Market Segments
1.4 Research Methodology
1.4.1 Secondary research
1.4.2 Primary research
1.4.3 Analyst tools and models
CHAPTER 2 EXECUTIVE SUMMARY
2.1 CXO Perspective
CHAPTER 3 MARKET OVERVIEW
3.1 Market Definition and Scope
3.2 Key findings
3.2.1 Top investment pockets
3.2.2 Top winning strategies
3.3 Porters five force analysis
3.3.1 Bargaining power of suppliers
3.3.2 Bargaining power of buyers
3.3.3 Threats from the new entrants
3.3.4 Threats of substitutes
3.3.5 Competitive rivalry
3.4 Value chain analysis
3.5 Market share analysis
3.6.1 Thriving portable electronic market and increasing popularity of internet of things (IoT)
3.6.2 Usage in graphic cards and processors used in real world gaming
3.6.3 Impending need for circuit miniaturization in microelectronic devices
3.6.4 Technological superiority over wire bonding
3.7.1 Higher cost and less customization options available in comparison to wire bonding
3.8.1 Impending need of high frequency in electronic gadgets
CHAPTER 4 WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY
4.2 3D IC
4.2.1 Key market trends
4.2.2 Key growth factors and opportunities
4.2.3 Market size and forecast
4.3. 5D IC
4.3.1 Key market trends
4.3.2 Key growth factors and opportunities
4.3.3 Market size and forecast
4.4 2D IC
4.4.1 Key market trends
4.4.2 Key growth factors and opportunities
4.4.3 Market size and forecast
CHAPTER 5 WORLD FLIP CHIP MARKET, BY INDUSTRY
5.2.1 Key market trends
5.2.2 Key growth factors and opportunities
5.2.3 Market size and forecast
5.3.1 Key market trends
5.3.2 Key growth factors and opportunities
5.3.3 Market size and forecast
5.4 Automotive & Transport
5.4.1 Key market trends
5.4.2 Key growth factors and opportunities
5.4.3 Market size and forecast
5.5.1 Key market trends
5.5.2 Key growth factors and opportunities
5.5.3 Market size and forecast
5.6 IT & Telecommunication
5.6.1 Key market trends occupied
5.6.2 Key growth factors and opportunities
5.6.3 Market size and forecast
5.7 Aerospace & Defense
5.7.1 Key market trends
5.7.2 Key growth factors and opportunities
5.7.3 Market size and forecast
5.8.1 Key market trends
5.8.2 Key growth factors and opportunities
5.8.3 Market size and forecast
CHAPTER 6 WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY
6.2 Copper pillar
6.2.1 Key market trends
6.2.2 Key growth factors and opportunities
6.2.3 Market size and forecast
6.3 Solder bumping
6.3.1 Market size and forecast
6.3.2 Tin-Lead solder
18.104.22.168 Key market trends
22.214.171.124 Key growth factors and opportunities
126.96.36.199 Market size and forecast
6.3.3 Lead free solder
188.8.131.52 Key market trends
184.108.40.206 Key growth factors and opportunities
220.127.116.11 Market size and forecast
6.4 Gold bumping
6.4.1 Key market trends
6.4.2 Key growth factors and opportunities
6.4.3 Market size and forecast
6.5.1 Key market trends
6.5.2 Key growth factors and opportunities
6.5.3 Market size and forecast
CHAPTER 7 WORLD FLIP CHIP MARKET BY GEOGRAPHY
7.2 North America
7.2.1 Key market trends
7.2.2 Market size and forecast
7.3.1 Key market trends
7.3.2 Market size and forecast
7.3.7 Rest of Europe
7.4.1 Key market trends
7.4.2 Market size and forecast
7.4.7 Rest of Asia-Pacific
7.5.1 Key market trends
7.5.2 Market size and forecast
7.5.4 Middle East
7.5.5 Latin America
CHAPTER 8 COMPANY PROFILES
8.1 International Business Machines Corporation (IBM)
8.1.1 Company overview
8.1.2 Company snapshot
8.1.3 Operating business segments
8.1.4 Business performance
8.1.5 Key strategic moves and developments
8.2.1 Company overview
8.2.2 Company snapshot
8.2.3 Operating business segments
8.2.4 Business performance
8.2.5 Key strategic moves and developments
8.3 Texas Instruments, Inc.
8.3.1 Company overview
8.3.2 Company snapshot
8.3.3 Operating business segments
8.3.4 Business performance
8.3.5 Key strategic moves and developments
8.4 Taiwan Semiconductor Manufacturing Company Ltd.
8.4.1 Company overview
8.4.2 Company snapshot
8.4.3 Operating business segments
8.4.4 Business performance
8.4.5 Key strategic moves and developments
8.5 Apple Inc.
8.5.1 Company overview
8.5.2 Company snapshot
8.5.3 Operating business segments
8.5.4 Business performance
8.5.5 Key strategic moves and developments
8.6.1 Company overview
8.6.2 Company snapshot
8.6.3 Operating business segments
8.6.4 Business performance
8.6.5 Key strategic moves and developments
8.7 Intel Corporation
8.7.1 Company overview
8.7.2 Company snapshot
8.7.3 Operating Business Segments:-
8.7.4 Business performance
8.7.5 Key strategic moves and developments
8.8 Advanced Micro Devices, Inc.
8.8.1 Company overview
8.8.2 Company snapshot
8.8.3 Operating business segments
8.8.4 Business performance
8.8.5 Key strategic moves and developments
8.9 Amkor Technology, Inc.
8.9.1 Company overview
8.9.2 Company snapshot
8.9.3 Operating business segments
8.9.4 Business performance
8.9.5 Key strategic moves and developments
8.10 Samsung Electronics Co. Ltd.
8.10.1 Company overview
8.10.2 Operating Business Segments
8.10.3 Business performance
8.10.4 Key Strategic Moves and Developments
Flip chips majorly differ from each other on the basis of bumping technology used in them. Currently, copper bumping is extensively used in market owing to its advantages such as considerably low cost than other methods, high efficiency and compatibility with bond pads. Furthermore, impending need of circuit miniaturization, thriving portable devices industry and technological superiority over wire bond connections are major factors expected to propel the growth in global flip chip market. However, availability of less customization options as well as high capital investment requirements for setting up a new plant are the limitations that restrict the market growth.
2.5D IC packaging technology dominated the overall market in 2015 owing to its several advantages such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption. 3D IC is expected to register highest CAGR as it is equipped with all the advantages of 2.5D IC as well as some additional advantages.
In bumping technology segment, copper bumping held over 50% in the year 2015 due to its exclusive advantages of low cost, compatibility with bond pads and applications in technologies such as transceivers, embedded processors, application processors, power management, baseband, ASICs and SOCs. However, Tin-lead eutectic solder is expected to witness low growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.
Electronics industry contributed over 45% of the overall flip chip market in the year 2015. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed and improvement in efficiency collectively thrust the replacement of wire bond with flip chips in electronics industry, hence making it dominant in the overall market. However, IT and telecommunication would be the fastest growing segment and is expected to register highest CAGR 12.3% during the forecast period. This is due to the increasing reach of telecommunication services in remote areas as well as introduction of new players in IT industry where flip chips are used in large scale in servers, host systems and data centers.
Asia-pacific dominated the market in the year 2015 by accounting over 50% of the total market revenue and it is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities in the region, high consumption and production of electronic products where flip chip is steadily replacing wire bond and ongoing research and development in the region.
Key Findings of Flip Chip Market:
In 2015, copper pillar led the overall flip chip market revenue, and is projected to grow at a CAGR of 9.8% during the forecast period.
Tin-lead eutectic solder is expected to witness low growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.
Electronics industry constituted significant share in the overall flip chip market in the year 2015 due to imminent need of size reduction in electronics devices, requirement of higher data transmission speed and improvement in efficiency.
In packaging technology of flip chips, 2.5D IC packaging dominated the market in 2015.
Asia-Pacific dominated the market in the year 2015 by accounting over 50% of the total market revenue.
The key players in the flip chip market are focused on expanding their business operations in the emerging countries with new product launches through various research and development facilities. The major players profiled in this report include IBM, Intel Corporation, Fujitsu Ltd., 3M, Samsung electronics Co., Ltd., Amkor Technology, Inc., TSMC, Ltd., Apple, Inc., Texas Instruments, Inc., and AMD, Inc. among others.