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Recap and Outlook of Worldwide IC Packaging and Testing Industry in 2016

  • ID: 3938997
  • Report
  • Region: Global
  • 14 pages
  • Market Intelligence & Consulting Institute (MIC)
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The worldwide IC packaging and testing industry, worldwide and Taiwanese companies alike, suffered weak growth momentum in 2015 due to declines in the global PC market and a slowdown in mobile device sales. Despite the new opportunities contributed by non-3C segments such as automobile and IoT (Internet of Things), growth of these segments has remained limited as they are still in the early stages of development. Therefore, 3C products will continue to be a key driving force to fuel growth. In response to changes in the industry, foreign and Taiwanese IC packaging and testing vendors have introduced many new strategies and deployments. This report reviews the business performance of the worldwide IC packaging and testing industry in 2015 and analyzes its development in 2016.

List of Topics:

- Overview of the worldwide IC packaging and testing industry, including OSAT industry's shipment value and share by country from 2014 to 2017

- Summary of the development of key players, including Amkor and UTAC, leading Chinese vendors, Jiangsu Changjiang Electronics Technology, Tianshui Huatian Technology, and Nantong Fujitsu Microelectronics, as well as leading Taiwanese vendors ASE, SPIL, and PTI; also included are vendors' strategic alliance with upstream wafer foundries in China

Note: Product cover images may vary from those shown
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1. Worldwide IC Packaging and Testing Industry Shipment Value
1.1 OSAT Industry Shipment Value Declines in 2015 on Weak Market Demand
1.2 Taiwan Boasts Largest Shipment Value Share in 2015, Followed by China

2. Leading International Vendors' Development
2.1 Amkor Acquires J-Device for Automotive IC Market; UTAC Focuses on Product Diversification
2.2 China Eyes on High-end Technology and Turn-key Solutions

3. Leading Taiwanese Vendors' Development
3.1 ASE Develops Diversified Technologies in Multiple Industries
3.2 SPIL Develops SiP with Foxconn; PTI Enhances Deployment in China with Micron

4. Conclusion
4.1 China's Horizontal Integration Poses Threats to Taiwanese Vendors
4.2 Taiwan can Maintain Competitiveness via Horizontal and Vertical Integration


Glossary of Terms

List of Companies

List of Figures
Figure 1: Worldwide OSAT Industry Shipment Value and Growth Rates, 2014 - 2017
Figure 2: OSAT Industry Shipment Value Share by Country, 2014 - 2017
Figure 3:Leading International IC Packaging and Testing Vendors' Milestones
Figure 4: Leading Chinese Packaging and Testing Vendors' Acquisition of Advanced Technologies and Provisioning of Turn-key Solutions
Figure 5: ASE's Technology Development and Industrial Deployment
Figure 6: Recent Developments of SPIL and PTI

Note: Product cover images may vary from those shown
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- Amkor
- ASE Embedded Electronics Incorporated
- Foxconn
- Infineon
- Inotera Memories
- J-Devices
- Jiangsu Changjiang Electronics
- Micron
- Nantong Fujitsu Microelectronics
- ProMOS Technologies
- Shanghai Huahong Grace
- Shanghai Huali Microelectronics
- SJsemi
- Tianshui Huatian Technology
- XM

Note: Product cover images may vary from those shown
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Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:


  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases


  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis