Global System-in-Package Market 2016-2020 - Product Image

Global System-in-Package Market 2016-2020

  • ID: 3941015
  • Report
  • Region: Global
  • 67 pages
  • TechNavio
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FEATURED COMPANIES

  • Amkor Technology
  • ASE
  • ChipMOS Technology
  • ChipSiP Technology
  • JCET
  • NANIUM
  • MORE
About SiP

A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.

The analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.

The market is divided into the following segments based on geography:

- Americas
- APAC
- EMEA

The report, Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Amkor Technology
- ASE
- JCET
- SPIL
- UTAC

Other prominent vendors
- ChipMOS Technology
- ChipSiP Technology
- NANIUM
- Octavo Systems
- Samsung Electro-Mechanics

Market drivers
- Need to control rising costs

Market challenges
- High inventory levels in supply chain

Market trends
- Growth of OSAT vendors

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology
  • ASE
  • ChipMOS Technology
  • ChipSiP Technology
  • JCET
  • NANIUM
  • MORE
PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Definition
  • Source year and forecast period
  • Market overview
  • Segmentation
  • Geographical coverage
  • Vendor segmentation
  • Common currency conversion rates
  • Top-vendor offerings
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
PART 04: Introduction
  • Key market highlights
PART 05: Technology overview
  • Back-end chip formation
  • Wafer-level versus die-level packaging and assembly
  • Evolution of semiconductor packaging industry
  • Eco-system of semiconductor IC packaging industry
PART 06: Market landscape
  • Market overview
  • Comparison between SoC, SiP, and chip-on-board (CoB)
  • Market size and forecast
  • Five forces analysis
PART 07: Market segmentation by application
  • Communications sector
  • Consumer electronics sector
  • Computers sector
  • Automotive sector
  • Medical sector
PART 08: Market segmentation by interconnect technology
  • Wire bond packaging
  • Flip-chip packaging
PART 09: Market segmentation by end-user
  • Foundries
  • IDMs
PART 10: Geographical segmentation
  • APAC
  • Americas
  • EMEA
PART 11: Market drivers
  • Need to control rising costs
  • Emergence of advanced and compact consumer electronic devices
  • Rise in number of fabs
  • Increasing number of IoT devices
  • Design complexities in SoC
PART 12: Impact of drivers

PART 13: Market challenges
  • High inventory levels in supply chain
  • Fluctuation of foreign exchange rates
  • High investment market
PART 14: Impact of drivers and challenges

PART 15: Market trends
  • Growth of OSAT vendors
  • Emergence of FOWLP technology
  • Automation in automobiles
PART 16: Vendor landscape
  • Competitive scenario
  • Key vendors
  • Other prominent vendors
PART 17: Appendix
  • List of abbreviations
PART 18: About the Author

List of Exhibits

Exhibit 01: Global SiP market segmentation
Exhibit 02: List of countries in key geographies
Exhibit 03: Market vendors
Exhibit 04: Currency conversions
Exhibit 05: Product offerings
Exhibit 06: Back-end chip formation steps
Exhibit 07: 5D IC block diagram
Exhibit 08: 5D IC block diagram
Exhibit 09: Old semiconductor IC packaging industry supply chain
Exhibit 10: New semiconductor IC packaging industry supply chain
Exhibit 11: SoC, SiP, and CoB ranking on functioning parameters
Exhibit 12: Global SiP market 2015-2020 ($ billions)
Exhibit 13: Five forces analysis
Exhibit 14: Percentage share of SiP usage in applications (2015-2020)
Exhibit 15: Percentage share of SiP usage in applications 2015-2020 ($ billions)
Exhibit 16: Global SiP market for communications sector 2015-2020 ($ billions)
Exhibit 17: Global SiP market for consumer electronics sector 2015-2020 ($ billions)
Exhibit 18: Global SiP market for computer sector 2015-2020 ($ billions)
Exhibit 19: Global SiP market for automotive sector 2015-2020 ($ billions)
Exhibit 20: Expected automotive shipment forecast y-o-y (%)
Exhibit 21: Global SiP market for medical sector 2015-2020 ($ billions)
Exhibit 22: Bonding technologies for SiP, 2015-2020 (% share)
Exhibit 23: Bonding technologies for SiP, 2015-2020 ($ billions)
Exhibit 24: Global SiP market for wire bond packaging 2015-2020 ($ billions)
Exhibit 25: Global SiP market for flip-chip packaging 2015-2020 ($ billions)
Exhibit 26: Global SiP market by end-user 2015-2020 (% share)
Exhibit 27: Global SiP market by end-user 2015-2020 ($ billions)
Exhibit 28: Global SiP market of foundries 2015-2020 ($ billions)
Exhibit 29: Global SiP market for IDMs 2015-2020 ($ billions)
Exhibit 30: Global SiP market by geography 2015-2020 (% share)
Exhibit 31: Global SiP market by geography 2015-2020 (% share)
Exhibit 32: SiP market in APAC 2015-2020 ($ billions)
Exhibit 33: SiP market in Americas 2015-2020 ($ billions)
Exhibit 34: SiP market in EMEA 2015-2020 ($ billions)
Exhibit 35: Impact of drivers
Exhibit 36: Global semiconductor market trend 1992-2015 ($ billions)
Exhibit 37: Impact of drivers and challenges
Exhibit 38: Other vendors in global SiP market
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FEATURED COMPANIES

  • Amkor Technology
  • ASE
  • ChipMOS Technology
  • ChipSiP Technology
  • JCET
  • NANIUM
  • MORE
New Report Released: - Global SiP Market 2016-2020

The author of the report recognizes the following companies as the key players in the global SiP market: Amkor Technology, ASE, JCET, SPIL, and UTAC

Other prominent vendors in the market are: ChipMOS Technology, ChipSiP Technology, NANIUM, Octavo Systems, and Samsung Electro-Mechanics.

Commenting on the report, an analyst from the research team said: “One trend gaining traction in this market is growth of OSAT vendors. The number of OSATs in APAC, especially China, is growing at a considerable pace, as these companies have strong liquidity and financial backing. This enables OSATs to have adequate funds for R&D and capacity expansion. Moreover, governmental support toward the development of the semiconductor industry from major APAC countries such as South Korea, China, and Japan is propelling the growth of these facilities.”

According to the report, the increasing requirement in the semiconductor market to offer cost-effective and efficient semiconductor products is driving the demand for SiP packaging technology. The utilization of copper wires instead of the conventional gold wires for the connections within the chips in 3D semiconductor packaging is allowing vendors to reduce their costs significantly.

Further, the report states that the semiconductor packaging vendors are affected by the fluctuating foreign exchange rates due to the need of importing and exporting raw material across the globe. The instability of the world economy such as the slowdown of the Chinese economy and Britain's exit from the EU has led to volatile and unpredictable exchange rates. As a result, global players in the market are not able to anticipate future conditions and are likely to incur significant monetary losses in international trade.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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- Amkor Technology
- ASE
- JCET
- SPIL
- UTAC
- ChipMOS Technology
- ChipSiP Technology
- NANIUM
- Octavo Systems
- Samsung Electro-Mechanics
Note: Product cover images may vary from those shown
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