Global Fan-in Wafer Level Packaging Market 2016-2020

  • ID: 3946596
  • Report
  • Region: Global
  • 62 pages
  • TechNavio
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FEATURED COMPANIES

  • FlipChip International.
  • Rudolph Technologies
  • SEMES
  • STATS ChipPAC
  • STMicroelectronics
  • SUSS MicroTec
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

About Fan-in WLP

Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally.

The analysts forecast the global fan-in WLP market to grow at a CAGR of 9.63% during the period 2016-2020.

Covered in this report
The report covers the present scenario and the growth prospects of the global fan-in WLP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of packaged fan-in WLPs in various application segments such as analog and mixed IC, wireless connectivity, logic and memory IC, micro-electro-mechanical systems (MEMS) and sensors, and complementary metal-oxide-semiconductor (CMOS) image sensor

The market is divided into the following segments based on geography:
- APAC
- North America
- Europe

The report, Global Fan-in WLP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- STATS ChipPAC
- STMicroelectronics
- TSMC
- Texas Instruments

Other prominent vendors
- Rudolph Technologies
- SEMES
- SUSS MicroTec
- Ultratech
- FlipChip International

Market drivers
- High demand for miniaturized electronics
- For a full, detailed list, view the full report

Market challenges
- Cyclical nature of semiconductor industry
- For a full, detailed list, view the full report

Market trends
- Increase in wafer size
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • FlipChip International.
  • Rudolph Technologies
  • SEMES
  • STATS ChipPAC
  • STMicroelectronics
  • SUSS MicroTec
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Market coverage
  • Base year and forecast period
  • Vendor segmentation
  • Market segmentation
  • Geographical segmentation
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
  • PEST analysis
PART 04: Introduction
  • Key market highlights
PART 05: Technology landscape
  • Semiconductor IC manufacturing process
  • WLP versus die-level packaging and assembly
  • Roadmap of semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
  • Market size and forecast
  • Five forces analysis
PART 07: Market segmentation by application
  • Global fan-in WLP market by application
  • Analog and mixed ICs
  • Wireless connectivity
  • Logic and memory ICs
  • MEMS and sensors
  • CMOS image sensors
PART 08: Geographical segmentation
  • Global fan-in WLP market by geography 2015-2020
  • APAC
  • North America
  • Europe
PART 09: Market drivers
  • High demand for miniaturized electronics
  • Growing application of semiconductor ICs in IoT
  • Increasing complexity of semiconductor IC designs
  • Surging demand for semiconductor wafers
PART 10: Impact of drivers

PART 11: Market challenges
  • Cyclical nature of semiconductor industry
  • Rapid technological changes in wafer processing
PART 12: Impact of drivers and challenges

PART 13: Market trends
  • Increase in wafer size
  • High adoption of semiconductor ICs in automobiles
  • Short replacement cycle of mobile devices
PART 14: Vendor landscape
  • Competitive scenario
  • Key vendors
  • Other prominent vendors
PART 15: Market summary

PART 16: Appendix
  • List of abbreviations
PART 17: About the Author

List of Exhibits
Exhibit 01: Global fan-in WLP market segmentation 2015
Exhibit 02: Key regions
Exhibit 03: PEST analysis
Exhibit 04: Semiconductor IC manufacturing process
Exhibit 05: Front-end chip formation steps
Exhibit 06: Back-end chip formation steps
Exhibit 07: Roadmap of semiconductor packaging industry
Exhibit 08:.5D IC block diagram
Exhibit 09:D IC block diagram
Exhibit 10: Old semiconductor IC packaging industry supply chain
Exhibit 11: New semiconductor IC packaging industry supply chain
Exhibit 12: Global fan-in WLP market 2015-2020 ($ billions)
Exhibit 13: Global fan-in WLP market 2015-2020 (billions of units)
Exhibit 14: Five forces analysis
Exhibit 15: Global fan-in WLP market by application 2015-2020 (% share of shipments)
Exhibit 16: Global fan-in WLP market by application 2015-2020 (billions of units)
Exhibit 17: Global fan-in WLP market by analog and mixed IC 2015-2020 (billions of units)
Exhibit 18: Global fan-in WLP market by wireless connectivity 2015-2020 (billions of units)
Exhibit 19: Global fan-in WLP market by logic and memory IC 2015-2020 (billions of units)
Exhibit 20: Global fan-in WLP market by MEMS and sensors 2015-2020 (billions of units)
Exhibit 21: Global fan-in WLP market by CMOS image sensor 2015-2020 (billions of units)
Exhibit 22: Global fan-in WLP market by geography 2015-2020 (% share of shipment)
Exhibit 23: Global fan-in WLP market by geography 2015-2020 (billions of units)
Exhibit 24: Fan-in WLP market in APAC 2015-2020 (billions of units)
Exhibit 25: Fan-in WLP market in North America 2015-2020 (billions of units)
Exhibit 26: Fan-in WLP market in Europe 2015-2020 (billions of units)
Exhibit 27: Global MEMS market 2015-2020 ($ billions)
Exhibit 28: Global smartphone shipment forecast 2015-2020 (millions of units)
Exhibit 29: Impact of drivers
Exhibit 30: Impact of drivers (continued)
Exhibit 31: Global semiconductor market trend 1992-2014 ($ billions)
Exhibit 32: Impact of drivers and challenges
Exhibit 33: Timeline for semiconductor wafer-size advances
Exhibit 34: Growth of car shipments 2015-2020
Exhibit 35: Other prominent vendors in market
Exhibit 36: Market snapshot of global fan-in WLP market 2015-2020
Exhibit 37: CAGR comparison: Application segments
Exhibit 38: CAGR comparison: Geographical segments
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FEATURED COMPANIES

  • FlipChip International.
  • Rudolph Technologies
  • SEMES
  • STATS ChipPAC
  • STMicroelectronics
  • SUSS MicroTec
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

New Report Released: – Global Fan-in WLP Market 2016-2020

The author of the report recognizes the following companies as the key players in the global fan-in WLP market: STATS ChipPAC, STMicroelectronics, TSMC, and Texas Instruments.

Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, and FlipChip International.

Commenting on the report, an analyst from the research team said: “One trend gaining popularity in this market is increase in wafer size. The global semiconductor industry witnessed an increase in the size of silicon wafers, from 100 mm to 300 mm, during the last four decades. The shift to larger diameter wafers reduces the cost of manufacturing semiconductor ICs by 20%-25%. At present, the industry predominantly uses 300-mm wafers to manufacture ICs. This trend is expected to maintain its momentum during the forecast period”

According to the report, the surging demand for compact electronic devices in sectors such as telecommunications, automotive, industrial manufacturing, and healthcare has generated the need for miniaturized semiconductor ICs. With the emergence of products such as 3D ICs and MEMS devices, the electronic equipment is becoming compact and user-friendly, which involves changes in IC designing such as finer patterning.

Further, the report states that rapid technological advances in wafer processing is a major challenge for vendors in the global fan-in WLP market. The transitions such as miniaturization of nodes and an increase in wafer sizes in ultra-large scale integration (ULSI) fabrication technology in the global semiconductor industry instigate semiconductor manufacturers to increase the development and adoption of new technologies, especially in packaging solutions.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

- STATS ChipPAC
- STMicroelectronics
- TSMC
- Texas Instruments
- Rudolph Technologies
- SEMES
- SUSS MicroTec
- Ultratech
- FlipChip International.
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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