Global Flip Chip Technology Market - Growth, Trends and Forecasts (2016 - 2021)

  • ID: 3971013
  • Report
  • Region: Global
  • 117 pages
  • Mordor Intelligence
1 of 3
Market Insights

The global flip chip technology packaging market estimated at USD 18.77 billion in 2015 is projected to reach USD 27.02 billion by 2020, at a CAGR of 7.56% over the forecast period. The rapid growth of this market is propelled by its numerous advantages like smaller-size, higher-performance, and greatest I/O flexibility over the competitive methodologies.

Market Dynamics

The major driving forces of the flip chip technology market have been the developments in the packaging of electronics like improving performance, maintaining high packaging density and increasing the reliability of circuits. However, the high cost associated with the implementation of the flip chip technology is impeding the growth of the market.

Market Segmentation

The global flip chip technology market can be segmented by the wafer bumping process (copper pillar, tin-lead eutectic solder, lead-free solder, gold stud bumping); by packaging process (2D IC, 2.5D IC, 3D IC), by products (memory, high brightness light-emitting diode, RF, power and analog ICs, imaging and 2D logic sol); by application (medical devices, industrial application, automotive, GPUs and chipsets, smart technologies and electronic devices) and by geography.

Key Market Players

The report also considers key trends that will impact the industry and profiles of leading companies with majority shares in the global flip chip technology market, such as:

- Amkor Technology
- IBM Corp.
- Taiwan Semiconductor Manufacturing Co.
- Intel Corp.
- Samsung Electronics Co. Ltd.
- Texas Instruments Inc.
- Global Foundries U.S Inc.
- Stats Chippac Ltd.
- Nepes Pte. Ltd.
- Powertech Technology

Report Offerings

- Market definition for global flip chip market along with identification of key drivers and restraints for the market.
- Market analysis for the global flip chip market, with region specific assessments and competition analysis on a global and regional scale.
- Identification of factors instrumental in changing the market scenarios, rising prospective opportunities and identification of key companies which can influence the market on global and regional scales.
- Extensively researched competitive landscape section with profiles of major companies along with their strategic initiatives and market shares.
- Identification and analysis of the macro and micro factors that affect the global flip chip market on both global and regional scales.
- A comprehensive list of key market players along with the analysis of their current strategic interests and key financial information.

Please note: As this product is updated at the time of order, dispatch will be 72 hours from the date the order and full payment is received.
Note: Product cover images may vary from those shown
2 of 3
1. Introduction

1.1 Study Deliverables

1.2 Market Definition

1.3 Market Scope

2. Research Methodology

2.1 Introduction

2.2 Analysis Methodology

3. Executive Summary

4. Market Overview

4.1 Current Market Scenario

4.2 Market Drivers

4.2.1 High Packaging Density

4.2.2 Ease of Integration

4.3 Market Restraints

4.4 Industry Attractiveness- Porter's Five Forces

4.4.1 Bargaining Power of Suppliers

4.4.2 Bargaining Power of Consumers

4.4.3 Threat of New Entrants

4.4.4 Threat of Substitute Products and Services

4.4.5 Competitive Rivalry within the Industry

4.5 Industry Value Chain Analysis

5. Market Segmentation

6. By Wafer Bumping Process

6.1 Copper Pillar

6.2 Tin-Lead Eutectic Solder (Sn-Pb Eutectic Solder)

6.3 Lead Free Solder

6.4 Gold Stud Bumping

7. By Packaging Process

7.1 2D IC

7.2 2.5D IC

7.3 3D IC

8. By Products

8.1 Memory

8.2 High Brightness, Light-Emitting Diode (LED)

8.3 RF, Power and Analog ICs

8.4 Imaging

8.5 2D Logic Soc

9. By Application

9.1 Medical Devices

9.2 Industrial Applications

9.3 Automotive

9.4 GPUs and Chipsets

9.5 Smart Technologies

9.6 Robotics

9.7 Electronic Devices

10. By Geography

10.1 North America

10.1.1 US

10.1.2 Canada

10.2 Europe

10.2.1 Germany

10.2.2 UK

10.2.3 France

10.2.4 Spain

10.2.5 Italy

10.2.6 Others

10.3 Asia-Pacific

10.3.1 China

10.3.2 Japan

10.3.3 India

10.3.4 Australia

10.3.5 Indonesia

10.3.6 Malaysia

10.3.7 Singapore

10.3.8 South Korea

10.3.9 Others

10.4 Middle East & Africa

10.5 Latin America

11. Competitive Analysis - Company Profiles

11.1 Amkor Technology

11.2 IBM Corp.

11.3 Intel Corp.

11.4 Taiwan Semiconductor Manufacturing Co.

11.5 Samsung Electronics Co. Ltd.

11.6 Texas Instruments Inc.

11.7 Global Foundries U.S Inc.

11.8 Stats Chippac Ltd.


11.10 Powertech Technology

12. Competitive Landscape

12.1 Market Share Analysis

12.2 Analysis of Development Trends

12.3 Oppurtunities for Investments in Flip Chip Technology

13. Future of the Flip Chip Technology
Note: Product cover images may vary from those shown
3 of 3


4 of 3
Note: Product cover images may vary from those shown