The global hybrid memory cube market estimated at USD 65.17 million in 2015 is projected to reach USD 475.06 million by 2020, at a CAGR of 48.78% over the forecast period. Hybrid memory cube promises energy efficient, high-bandwidth and high-density memory, which combines stacks of DRAM (Dynamic RAM) with logic.
Moore's law states that â€œover the history of computing hardware, the number of transistors in a dense integrated circuit has doubled approximately every two yearsâ€. There are only so many transistors you can fit on a small motherboard meant for a mobile device which brings to light the limitations of the DRAM technology. Hence, the need for a new memory technology is driving the market for HMC's. Due to the rapid proliferation of electronic devices, managing data systems is becoming increasingly complex. A new memory type with X15 times performance speed as compared to traditional DRAM is the need of the hour.
An increasing demand for mobility is putting a lot of emphasis on cloud-based storage solutions, positively impacting the market. Hybrid Memory Cube Consortium (HPCC), an initiative of Micron Technologies and Samsung is fiercely promoting the use and development of these memory systems, creating more awareness about the technology. However, competition from recently announced DDR4 and lack of a body recognizing the standards of HMC, constrain the market. Further, market trends indicate a decrease in average selling price of traditional DRAM memories, limiting the current HMC market.
The market is segmented on the basis of the type of technology used, RAM density, end-industry and by region. Currently, North America is the biggest market in the world, followed by Europe. Future predictions indicate the Asia-Pacific region to become a strong market in the upcoming years.
Key Market Players
Increasing adoption of cloud-based technologies and surge of big data provide ample opportunities for the technology to dominate the market in the future. The companies dominating the market in terms of products and technology development are:
- Micron Technologies
- Samsung Electronics
- SK Hynix
Key Deliverables of the Study
- Market analysis for the global hybrid memory cube market, with region specific assessments and competition analysis on global and regional scales.
- Market definition along with the identification of key drivers and restraints.
- Identification of factors instrumental in changing the market scenarios, rising prospective opportunities, and identification of key companies that can influence this market on a global and regional scale.
- Extensively researched competitive landscape section with profiles of major companies along with their market.
- Identification and analysis of the macro and micro factors that affect the global hybrid memory cube market on both global and regional scales.
- A comprehensive list of key market players along with the analysis of their current strategic interests and key financial information.
- A wide-ranging knowledge and insights into the major players in this industry and the key strategies adopted by them to sustain and grow in the studied market.
- Insights into the major countries/regions in which this industry is growing and identifying the regions which are still untapped.
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1.1 Market Definition
1.2 Market Scope
1.3 Market Constraints
2. Research Methodology
3. Executive Summary ( Market Shares as of 2016)
3.2 Overall Market Shares (Current)
3.3 Future Predictions
4. Market Overview
4.2 Market Size and Forecast
4.3 Industry Value Chain Analysis
4.4 Industry Attractiveness - Porter's Five Forces of Analysis
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Consumers
4.4.3 Threat from New Entrants
4.4.4 Threat from Substitute Products
4.4.5 Competitive Rivalry within the Industry
5. Market Dynamics
5.2.1 Increasing Global Demand for Mobility and Connectivity
5.2.2 DRAM Technology Hitting a Wall
5.2.3 Exponential Data Growth due to Device Proliferation
5.2.4 Cloud Services Streching Present Day Netwroking and Storage
5.2.5 Moore's Law Running Out of Gas
5.2.6 Establishment of HMC Consortium ( Led by Micron and Samsung)
5.3.1 Public Apprehension to Embrace New Technology
5.3.2 Average Selling Price of DRAM Going Down
5.3.3 No Recognition from Standard Bodies
5.3.4 Competetion from Recently Announced DDR4
5.4.1 Cloud Based Services being Adopted
5.4.2 Surge in Big-Data Market
6. Market Segmentation
6.1 By Technology
6.1.1 Near Memory
6.1.2 Far Memory
6.2 By Density
6.2.1 2 GB
6.2.2 4 GB
6.4 By Industry
6.4.1 Consumer Electronics
126.96.36.199 Laptops and Mobile
6.4.3 Cloud Computing
6.4.4 Networking and Telecommunication
6.5 By Geography
6.3.1 North America
6.3.4 Latin America
6.3.5 Africa and Middle East
7. Vendor Market Share
8. Competitive Analysis - Company Profiles
8.1 Micron Technologies
8.2 Samsung Electronics
8.5 SK Hynix
8.6 Open Silicon
9. Future of Global Hybrid Memory Cube