Copper Wire Bonding ICs Market: By Bond Type, By Packaging Technology, By End-User & By Region - Forecast 2016-2021

  • ID: 3974161
  • Report
  • 155 pages
  • IndustryARC
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The ever increasing gold prices led to the transition of replacing gold with copper bond wires in semiconductor devices. Copper wire bonded ICs begin to be adopted in production consumer grade ICs in 2009 & 2010. Nowadays, copper wire bonded ICs have started being used in harsh environment applications, by replacing complex ICs, owing to process optimization. Globally, rising gold prices, growing global consumer electronics industry, and increasing adoption in automotive industry are the prime growth drivers of global copper wire bonding ICs market. In addition, growing consumer electronics and automotive industry in emerging economies such as China, India and others, will create new opportunities for global copper wire bonding ICs market. However, complex production process requiring improved designs and equipment, and lack of reliability for harsh environment applications and long life are the key restraints for global copper wire bonding ICs market.

This report identifies the global copper wire bonding ICs market size in for the year 2014-2016, and forecast of the same for year 2021. It also highlights the potential growth opportunities in the coming years, while also reviewing the market drivers, restraints, growth indicators, challenges, market dynamics, competitive landscape, and other key aspects with respect to global copper wire bonding ICs market.

Geographically North America dominated global copper wire bonding ICs market, and Asia Pacific is projected to have fastest growth, owing to rapidly increasing mobile user, consumer electronics and growing automotive industry in this region. Among all the end-users, consumer electronics segment has the highest market share in global copper wire bonding ICs market.

This report segments global copper wire bonding ICs market on the basis of bond type, packaging technology, end-user, and regional market as follows:

Copper Wire Bonding ICs Market, By Bond Type: Ball-Ball Bonds, Wedge-Wedge Bonds, and Ball-Wedge Bonds
Copper Wire Bonding ICs Market, By Packaging Technology: Small Outline Package (SOP), Grid Array (GA), Quad Flat No-Leads (QFN) Package, Dual Flat No-Leads (Dfn) Package, Quad Flat Package (QFP), Dual In-Line Package (DIP), and Others
The report has focused study on copper wire bonding ICs market by basis of end-user such as: Consumer Electronics, Automotive, Aviation, Defence, Infrastructure, and Others
This is report has been further segmented into major regions, which includes detailed analysis of each region such as: North America, Europe, Asia-Pacific (APAC), and Rest of the World (RoW) covering all the major country level markets in each of the region

This report identifies all the major companies operating in the copper wire bonding ICs market. Some of the major companies’ profiles in detail are as follows:

Freescale Semiconductor Inc.

Cirrus Logic Inc.

Fairchild Semiconductor International, Inc.

Integrated Silicon Solution Inc.

Infineon Technologies AG
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1. Copper Wire Bonding ICs – Market Overview

2. Executive Summary

3. Copper Wire Bonding ICs Market Landscape
3.1. Market Share Analysis
3.2. Comparative Analysis
3.3. Product Benchmarking
3.4. End User Profiling
3.5. Top 5 Financials Analysis

4. Copper Wire Bonding ICs – Market Forces
4.1. Drivers
4.1.1. Rising gold prices
4.1.2. Growing global consumer electronics industry
4.1.3. Increasing adoption in automotive industry
4.2. Restraints
4.2.1. Complex production process requiring improved designs and equipment
4.2.2. Lack of reliability for harsh environment applications and long life
4.3. Opportunities
4.3.1. Emerging economies
4.4. Challenges
4.5. Porter’s Five Forces Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Degree of Competition

5. Copper Wire Bonding ICs Market, By Bond Type
5.1. Ball-Ball Bonds
5.2. Wedge-Wedge Bonds
5.3. Ball-Wedge Bonds

6. Copper Wire Bonding ICs Market, By Packaging Technology
6.1. Small Outline Package (SOP)
6.2. Grid Array (GA)
6.3. Quad Flat No-Leads (QFN) Package
6.4. Dual Flat No-Leads (Dfn) Package
6.5. Quad Flat Package (QFP)
6.6. Dual In-Line Package (DIP)
6.7. Others

7. Copper Wire Bonding ICs Market, By End-User
7.1. Consumer Electronics
7.2. Automotive
7.3. Aviation
7.4. Defence
7.5. Infrastructure
7.6. Others

8. Global Copper Wire Bonding ICs Market, By Geography
8.1. Europe
8.1.1. Germany
8.1.2. France
8.1.3. Italy
8.1.4. Spain
8.1.5. Russia
8.1.6. U.K.
8.1.7. Rest of Europe
8.2. Asia Pacific
8.2.1. China
8.2.2. India
8.2.3. Japan
8.2.4. South Korea
8.2.5. Rest of Asia-Pacific
8.3. North America
8.3.1. U.S.
8.3.2. Canada
8.3.3. Mexico
8.4. Rest of the World (RoW)
8.4.1. Brazil
8.4.2. Rest of RoW

9. Copper Wire Bonding ICs – Market Entropy
9.1. Expansion
9.2. Technological Developments
9.3. Merger & Acquisitions, and Joint Ventures
9.4. Supply- Contract

10. Company Profiles
10.1. Freescale Semiconductor Inc.
10.1.1. Introduction
10.1.2. Financials
10.1.3. Key Insights
10.1.4. Key Strategy
10.1.5. Product Portfolio
10.1.6. SWOT Analysis
10.2. Cirrus Logic Inc.
10.2.1. Introduction
10.2.2. Financials
10.2.3. Key Insights
10.2.4. Key Strategy
10.2.5. Product Portfolio
10.2.6. SWOT Analysis
10.3. Fairchild Semiconductor International, Inc.
10.3.1. Introduction
10.3.2. Financials
10.3.3. Key Insights
10.3.4. Key Strategy
10.3.5. Product Portfolio
10.3.6. SWOT Analysis
10.4. Integrated Silicon Solution Inc.
10.4.1. Introduction
10.4.2. Financials
10.4.3. Key Insights
10.4.4. Key Strategy
10.4.5. Product Portfolio
10.4.6. SWOT Analysis
10.5. Infineon Technologies AG
10.5.1. Introduction
10.5.2. Financials
10.5.3. Key Insights
10.5.4. Key Strategy
10.5.5. Product Portfolio
10.5.6. SWOT Analysis
10.6. Fujitsu Ltd.
10.6.1. Introduction
10.6.2. Financials
10.6.3. Key Insights
10.6.4. Key Strategy
10.6.5. Product Portfolio
10.6.6. SWOT Analysis
10.7. KEMET Corporation
10.7.1. Introduction
10.7.2. Financials
10.7.3. Key Insights
10.7.4. Key Strategy
10.7.5. Product Portfolio
10.7.6. SWOT Analysis
10.8. Lattice Semiconductor Corporation
10.8.1. Introduction
10.8.2. Financials
10.8.3. Key Insights
10.8.4. Key Strategy
10.8.5. Product Portfolio
10.8.6. SWOT Analysis
10.9. Maxim Integrated
10.9.1. Introduction
10.9.2. Financials
10.9.3. Key Insights
10.9.4. Key Strategy
10.9.5. Product Portfolio
10.9.6. SWOT Analysis
10.10. Micron Technology, Inc.
10.10.1. Introduction
10.10.2. Financials
10.10.3. Key Insights
10.10.4. Key Strategy
10.10.5. Product Portfolio
10.10.6. SWOT Analysis
*More than 40 Companies are profiled in this Research Report, Complete List available on Request*
"*Financials would be provided on a best efforts basis for private companies"

11. Appendix
11.1. Abbreviations
11.2. Sources
11.3. Research Methodology
11.4. Expert Insights
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