3D Semiconductor Packaging Market by Technology, by Material, and Industry Vertical - Global Opportunity Analysis and Industry Forecast, 2014-2022

  • ID: 4033351
  • Report
  • Region: Global
  • 228 pages
  • Allied Analytics LLP
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FEATURED COMPANIES

  • Amkor Technology
  • ASE Group
  • Intel Corporation
  • STMicroelectronics
  • SÜSS MicroTec AG.
  • MORE
3D Semiconductor Packaging Market by Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded, and Others), BY MATERIAL (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material, and Others), and Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others) - Global Opportunity Analysis and Industry Forecast, 2014-2022

Global 3D semiconductor packaging market size is expected to garner $8.9 billion by 2022, growing at a CAGR of 15.7% from 2016 to 2022. 3D semiconductor packaging refers to an advanced packaging technology of semiconductor chips in which two or more layers of active electronic components are stacked together and interconnected vertically as well as horizontally to perform as a single device. This technology possesses various advantages over other advanced packaging technologies such as reduced space consumption, decreased power loss, better overall performance, and enhanced efficiency.

A special feature of 3D packaging design that distinguishes it from other advanced packaging methods is that it mounts the die on top of each other unlike side-by-side mounting of 2D packaging, which consecutively acquires less space, and results in the formation of more compact chips and aids the growing demand for circuit miniaturization. Furthermore, overall less cost of as compared to other advanced packaging technology options gives an edge and fuels its adoption in memory chip stacking, I/O DRAMS, and high bandwidth applications. The need for miniaturization of memory chips, high bandwidth requirements in electronic circuits, and reduced cost than other advanced packaging technologies are prime factors, which foster the demand in 3D packaging industry.

The need to control the chip designing cost, which plays a major role in overall price of electronic devices; increase in demand for miniaturized circuits; and short replacement period of electronics products, which are constituted of integrated circuits manufactured with 3D packaging technology are the major factors that drive the growth in the 3D semiconductor packaging industry. However, high cost required to establish a 3D semiconductor packaging facility hinders the growth opportunities in 3D semiconductor packaging industry and this is anticipated to grow the overall 3D semiconductor packaging market size to three folds of the current value. On the contrary, the growth in trend of Internet of Things (IoT) and increase in number of wireless devices are opening new opportunities which will increase 3D semiconductor packaging market share in overall advanced packaging market. The ongoing 3D semiconductor packaging market trends suggest that the market will witness a double-digit growth in next five to six years.

The global 3D semiconductor packaging market is segmented on the basis of technology, materials, industry vertical, and geography. Based on technology, the 3D semiconductor packaging industry is segmented into 3D through silicon via, 3D package on package, 3D fan out based, 3D wire bonded, and others. BY MATERIALs, the 3D semiconductor packaging market is classified into organic substrate, bonding wire, leadframe, encapsulation resin, ceramic package, die attach material, and others Furthermore, the 3D semiconductor packaging industry is categorized on the basis of industry vertical, which includes electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others. Geographically, it is divided into North America, Europe, Asia-Pacific, and LAMEA.

The key players profiled in the report include Amkor Technology, ASE group, Siliconware Precision Industries Co., Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SÜSS MicroTec AG., International Business Machines Corporation (IBM), Intel Corporation, Qualcomm Technologies, Inc., STMicroelectronics, and Taiwan Semiconductor Manufacturing Company.

POTENTIAL BENEFITS FOR STAKEHOLDERS:

This report provides an in-depth analysis of the global 3D semiconductor packaging market along with current 3D semiconductor packaging market trends and future estimations to identify lucrative investment opportunities
This report identifies the key drivers, opportunities, and restraints that shape the market along with their impact analysis
Porter’s Five Forces analysis highlights the potency of buyers and suppliers that participate in this market to facilitate better business decisions for stakeholders and strengthen their supplier and buyer networks
Market estimation of geographical regions is based on the current market scenario and future trends.

MARKET SEGMENTATION

The market is segmented on the basis of technology, materials, industry vertical, and geography.

BY TECHNOLOGY

3D Through Silicon Via
3D Package on Package
3D Fan Out Based
3D Wire Bonded
Others (Flip Chip and Hybrid)

BY MATERIAL

Organic Substrate
Bonding Wire
Leadframe
Encapsulation Resins
Ceramic Packages
Die Attach Material
Others (Underfill Materials and Solder Balls)

BY INDUSTRY VERTICAL

Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace & Defense
Others (Media & Entertainment and Renewable Energy Resources)

BY GEOGRAPHY

North America
U.S.
Canada
Mexico
Europe
UK
Germany
France
Italy
Rest of Europe
Asia-Pacific
China
Japan
Taiwan
South Korea
India
Rest of Asia-Pacific
LAMEA
Latin America
Middle East
Africa
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FEATURED COMPANIES

  • Amkor Technology
  • ASE Group
  • Intel Corporation
  • STMicroelectronics
  • SÜSS MicroTec AG.
  • MORE
CHAPTER 1 INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools and models

CHAPTER 2 EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3 MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top Impacting Factors

3.2.1.1. Increase in number of portable electronic devices
3.2.1.2. Rise in demand for miniaturized circuits in microelectronic devices
3.2.1.3. Technological superiorities over 2D packaging technology
3.2.1.4. High initial capital investment required to set up a plant works as a restraining factor
3.2.1.5. Thermal issues with devices restrains the growth in the market

3.2.2. Top winning strategies
3.2.3. Top investment pockets

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Bargaining power of suppliers
3.3.2. Bargaining power of buyers
3.3.3. Threat of substitutes
3.3.4. Threat of new entrants
3.3.5. Intensity of competitive rivalry

3.4. MARKET SHARE ANALYSIS, 2015
3.5. 3D SEMICONDUCTOR PACKAGING MARKET: VALUE CHAIN ANALYSIS
3.6. MARKET DYNAMICS

3.6.1. Drivers

3.6.1.1. Increase in number of portable electronic devices
3.6.1.2. Rise in demand of miniaturized circuits in microelectronic devices
3.6.1.3. Technological superiorities over 2D packaging technology

3.6.2. Restraint

3.6.2.1. High initial capital investment required to set up a plant
3.6.2.2. Thermal issues with devices

3.6.3. Opportunities

3.6.3.1. Growing trend of Internet of Things (IoT)

CHAPTER 4 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY

4.1. OVERVIEW

4.1.1. Market size and forecast

4.2. 3D THROUGH SILICON VIA (TSV)

4.2.1. Key market trends
4.2.2. Growth factors and opportunities
4.2.3. Market size and forecast

4.3. 3D PACKAGE ON PACKAGE (POP)

4.3.1. Key market trends
4.3.2. Growth factors and opportunities
4.3.3. Market size and forecast

4.4. 3D FAN OUT

4.4.1. Key market trends
4.4.2. Growth factors and opportunities
4.4.3. Market size and forecast

4.5. 3D WIRE BONDED

4.5.1. Key market trends
4.5.2. Growth factors and opportunities
4.5.3. Market size and forecast

4.6. OTHERS (FLIP CHIP AND HYBRID)

4.6.1. Key market trends
4.6.2. Growth factors and opportunities
4.6.3. Market size and forecast

CHAPTER 5 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL

5.1. OVERVIEW

5.1.1. Market size and forecast

5.2. ORGANIC SUBSTRATE

5.2.1. Key market trends
5.2.2. Growth factors and opportunities
5.2.3. Market size and forecast

5.3. BONDING WIRE

5.3.1. Key market trends
5.3.2. Growth factors and opportunities
5.3.3. Market size and forecast

5.4. LEADFRAME

5.4.1. Key market trends
5.4.2. Growth factors and opportunities
5.4.3. Market size and forecast

5.5. ENCAPSULATION RESIN

5.5.1. Key market trends
5.5.2. Growth factors and opportunities
5.5.3. Market size and forecast

5.6. CERAMIC PACKAGE

5.6.1. Key market trends
5.6.2. Growth factors and opportunities
5.6.3. Market size and forecast

5.7. DIE ATTACH MATERIAL

5.7.1. Key market trends
5.7.2. Growth factors and opportunities
5.7.3. Market size and forecast

5.8. OTHERS

5.8.1. Key market trends
5.8.2. Growth factors and opportunities
5.8.3. Market size and forecast

CHAPTER 6 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL

6.1. OVERVIEW

6.1.1. Market size and forecast

6.2. ELECTRONICS
6.2.1. Key market trends
6.2.2. Growth factors and opportunities
6.2.3. Market size and forecast
6.3. INDUSTRIAL
6.3.1. Key market trends
6.3.2. Growth factors and opportunities
6.3.3. Market size and forecast
6.4. IT & TELECOMMUNICATION

6.4.1. Key market trends
6.4.2. Growth factors and opportunities
6.4.3. Market size and forecast

6.5. HEALTHCARE

6.5.1. Key market trends
6.5.2. Growth factors and opportunities
6.5.3. Market size and forecast

6.6. AUTOMOTIVE & TRANSPORT

6.6.1. Key market trends
6.6.2. Growth factors and opportunities
6.6.3. Market size and forecast

6.7. AEROSPACE & DEFENSE

6.7.1. Key market trends
6.7.2. Growth factors and opportunities
6.7.3. Market size and forecast

6.8. OTHERS (RENEWABLE ENERGY AND MEDIA & ENTERTAINMENT)

6.8.1. Key market trends
6.8.2. Growth factors and opportunities
6.8.3. Market size and forecast

CHAPTER 7 WORLD 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY

7.1. OVERVIEW

7.1.1. Market size and forecast

7.2. NORTH AMERICA

7.2.1. Key market trends
7.2.2. Growth factors and opportunities
7.2.3. Market size and forecast
7.2.4. US

7.2.4.1. Market size and forecast

7.2.5. Canada

7.2.5.1. Market size and forecast

7.2.6. Mexico

7.2.6.1. Market size and forecast

7.3. EUROPE

7.3.1. Key market trends
7.3.2. Growth factors and opportunities
7.3.3. Market size and forecast
7.3.4. UK

7.3.4.1. Market size and forecast

7.3.5. Germany

7.3.5.1. Market size and forecast

7.3.6. France

7.3.6.1. Market size and forecast

7.3.7. Italy

7.3.7.1. Market size and forecast

7.3.8. Rest of Europe

7.3.8.1. Market size and forecast

7.4. ASIA-PACIFIC

7.4.1. Key market trends
7.4.2. Growth factors and opportunities
7.4.3. Market size and forecast
7.4.4. China

7.4.4.1. Market size and forecast

7.4.5. Japan

7.4.5.1. Market size and forecast

7.4.6. South Korea

7.4.6.1. Market size and forecast

7.4.7. India

7.4.7.1. Market size and forecast

7.4.8. Rest of Asia-Pacific

7.4.8.1. Market size and forecast

7.5. LAMEA

7.5.1. Key market trends
7.5.2. Growth factors and opportunities
7.5.3. Market size and forecast
7.5.4. Latin America

7.5.4.1. Market size and forecast

7.5.5. Middle East

7.5.5.1. Market size and forecast

7.5.6. Africa

7.5.6.1. Market size and forecast

CHAPTER 8 COMPANY PROFILES

8.1. AMKOR TECHNOLOGY, INC.

8.1.1. Company overview
8.1.2. Operating business segments
8.1.3. Business performance
8.1.4. Key strategic moves and developments

8.2. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.

8.2.1. Company overview
8.2.2. Operating business segments
8.2.3. Business performance
8.2.4. Key strategic moves and developments

8.3. INTERNATIONAL BUSINESS MACHINES CORPORATION (IBM)

8.3.1. Company overview
8.3.2. Operating business segments
8.3.3. Business performance
8.3.4. Key strategic moves and developments

8.4. QUALCOMM TECHNOLOGIES, INC.

8.4.1. Company overview
8.4.2. Operating business segments
8.4.3. Business performance
8.4.4. Key strategic moves and developments

8.5. INTEL CORPORATION

8.5.1. Company overview
8.5.2. Operating business segments
8.5.3. Business performance
8.5.4. Key strategic moves and developments

8.6. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

8.6.1. Company overview
8.6.2. Operating business segments
8.6.3. Business performance
8.6.4. Key strategic moves and developments

8.7. STMICROELECTRONICS N.V.

8.7.1. Company overview
8.7.2. Operating business segments
8.7.3. Business performance
8.7.4. Key strategic moves and developments

8.8. SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)

8.8.1. Company overview
8.8.2. Operating business segments
8.8.3. Business performance
8.8.4. Key strategic moves and developments

8.9. SUSS MICROTEC AG.

8.9.1. Company overview
8.9.2. Operating business segments
8.9.3. Business performance
8.9.4. Key strategic moves and developments

8.10. ASE GROUP

8.10.1. Company overview
8.10.2. Operating business segments
8.10.3. Business performance
8.10.4. Key strategic moves and developments
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FEATURED COMPANIES

  • Amkor Technology
  • ASE Group
  • Intel Corporation
  • STMicroelectronics
  • SÜSS MicroTec AG.
  • MORE
3D Semiconductor Packaging Market Report, forecasts that the global market is expected to garner $8.9 billion by 2022, registering a CAGR of 15.7% during the forecast period 2014-2022.In the year 2015, Asia-Pacific dominated the global market and contributed over 50% of the overall market and its anticipated to continue this trend during the forecast period.

3D semiconductor packaging is an advanced packaging technology to fabricate high-performance chips such as flash memories, DRAMS, NAND, and others, which are highly used in high-performance computers, image sensors, smartphones, and others. The demand for 3D semiconductor packaging market is globally expected to rise during the forecast period due to increase in demand for miniaturized circuits and short replacement period of electronics products, which are primarily constituted of integrated circuits manufactured with 3D packaging technology. Moreover, surge in the automotive sector and growth in demand for miniature circuits in portable electronic devices provide opportunities in the market. However, establishment of new production facility in 3D semiconductor packaging industry requires high amount of investment, thus restraining the market growth.

3D wire bonded dominated the market in 2015, by contributing for more than 43% of overall technology segment in 3D semiconductor packaging market. This was attributed by its extensive usage in flash memories, and its a traditional approach which has established itself well in the market. Furthermore, extended usage of flash memories in computers, smartphones, industrial robotics, and other consumer electronic devices propel the growth of 3D wire bonded packaging segment.

On the basis of materials used in fabricating these chips, organic substrate garnered the maximum market share and claimed more than 41% market share in 2015 as they are the basic building blocks of the chips and have very high price. This was followed by bonding wire as they are utilized in 3D wire bonded packaging design, which garnered the largest share in the technology segment. Although, with the rise of other technologies, which consume less space than wire bonded chips, require less power and have higher efficiency, the share of the bonding wires in the market will be slightly impacted during the forecast period.

Electronics industry contributed over 48% of the overall 3D semiconductor packaging market in 2015. Increase in penetration of 3D semiconductor packaged chips in devices such as smartphones, laptops, digital cameras, and others drives the growth in market as these chips are majorly used in camera and memory. However, IT & telecom is expected to grow fastest at a CAGR of 19.2% during the forecast period, owing to increased investment by developing nations to increase connectivity and rise in number of wireless devices worldwide.

Asia-Pacific dominated the market in 2015, accounting over 50% of the total market revenue, and is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities, ongoing R&D, high consumption, and production of electronic products where 3D semiconductor packaged chips are steadily utilized. Further, North America and Europe are the second and third leading regions in 3D semiconductor packaging market, and are expected to witness fast paced growth as the market is still in its developing phase.

Increase in trend of miniaturization in portable electronic industry and rise in dependency on these devices worldwide is shifting device manufacturers toward finding new methods of size reduction and overall efficiency enhancement of these devices, thus driving the growth of 3D semiconductor packaging market states Gaurav Shukla, Research Associate, Semiconductor and Electronics at AMR.

KEY FINDINGS OF THE 3D SEMICONDUCTOR PACKAGING MARKET STUDY:

3D wire bonded dominated the market in 2015 with over 43% of market share, however, 3D TSV is expected to witness the highest growth rate of 17%

In 2015, Bonding wire accounted for the second largest share in 3D semiconductor packaging technology segment although it will slowly be replaced by TSV technology in long run

Die attach materials is estimated to be one of the fastest growing segment in coming years, growing at an estimated CAGR of 17.4%, owing to being a basic building block in several 3D packaging techniques

Asia-Pacific dominated the market in 2015, countries such as China, South Korea and Japan supported the growth in the region

In North America, United States accounts for over 70% of the overall market owing to high penetration of 3D TSV technology.
The key players of the global 3D semiconductor packaging market are employing novel concepts & ideas, improving manufacturing techniques, and improving the current set of products, besides enhancing their profitability to gain a competitive edge over the other market players.

The key players profiled in the report include Amkor Technology, ASE group, Siliconware Precision Industries Co., Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SSS MicroTec AG., International Business Machines Corporation (IBM), Intel Corporation, Qualcomm Technologies, Inc., STMicroelectronics, and Taiwan Semiconductor Manufacturing Company.
Note: Product cover images may vary from those shown
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  • Amkor Technology
  • ASE Group
  • Siliconware Precision Industries Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • SÜSS MicroTec AG.
  • International Business Machines Corporation (IBM)
  • Intel Corporation
  • Qualcomm Technologies, Inc.
  • STMicroelectronics
  • Taiwan Semiconductor Manufacturing Company
Note: Product cover images may vary from those shown
6 of 5
Note: Product cover images may vary from those shown
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