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Panasonic PGA26C09DV 600V GaN HEMT: Complete Teardown Analysis

  • ID: 4109813
  • Report
  • System Plus Consulting
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Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.

The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.

Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.

Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.

Note: Product cover images may vary from those shown
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Overview / Introduction

  • Executive summary
  • Reverse costing methodology

Company Profile

  • Panasonic

Physical Analysis

  • Synthesis of the physical analysis
  • Package analysis
  • Package opening
  • Package cross-section


  • HEMT die view & dimensions
  • HEMT die process
  • HEMT die cross-section
  • TEM epitaxy  analysis
  • HEMT die process characteristics

HEMT Manufacturing Process

  • HEMT die front-end process
  • HEMT die fabrication unit
  • Final test & packaging fabrication unit

Cost Analysis

  • Synthesis of the cost analysis
  • Yield explanations and hypotheses
  • HEMT die
  • HEMT die front-end cost
  • HEMT die probe test, thinning, and dicing
  • HEMT die wafer cost
  • HEMT die cost
  • Wafer cost evolution
  • Die cost evolution

Complete HEMT

  • Assembly cost
  • Synthesis of the assembly
  • Component cost

Price Analysis

Estimated sales price


  • Comparison between Transphorm and GaN Systems’ HEMT

Company Services

Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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