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Autoliv 77GHz Multi Mode Radar SPC: Complete Teardown Analysis

  • ID: 4109885
  • Report
  • January 2017
  • Region: Global
  • System Plus Consulting
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Autoliv, one of the leading automotive radar system suppliers, has developed a new radar configuration. Instead of installing two radar systems, one for long range and another for medium range, the 77GHz Multi Mode Radar combines both. By expanding the detection area of the radar, Autoliv significantly reduces the cost of safety equipment.

The system integrates two electronic boards including Texas Instruments’ microcontroller and automotive vision processor. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.

The radar uses Infineon’s 77GHz SiGe monolithic microwave integrated circuit (MMIC) as its high-frequency transmitter and receiver. The RF dies are packaged in the latest version of eWLB, the fan-out wafer level package developed and manufactured by Infineon. The transmitter and receiver are connected to a dual power amplifier and to a waveform generator from Infineon.

Based on a complete teardown analysis of the Autoliv Multi Mode Radar, the report provides bill-of-material (BOM) and manufacturing cost of the radar sensor and a comparison with the Bosch MRR and Delphi RACam.

Note: Product cover images may vary from those shown
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Overview / Introduction

Executive summary

  • Company profile and main features
  • Reverse costing methodology

Physical Analysis

Overview of the radar

  • Views and dimensions of the radar
  • Radar teardown
  • Electronic boards
  • MCU board
  • Overview
  • High definition photo
  • Component markings and identification
  • RF board
  • Overview
  • High definition photo
  • Components markings and identification
  • RF chipset analysis
  • Comparison with Bosch MMR1 and Delphi RACam

Cost Analysis

RF board cross section and EDX analysis

  • Estimation of the cost of the PCBs
  • BOM cost – MCU board
  • BOM cost – RF board
  • BOM cost – housing
  • Material cost breakdown
  • Accessing the added value (AV) cost
  • MCU board manufacturing flow
  • RF board manufacturing flow
  • Details of the housing assembly and functional test costs
  • Added value cost breakdown
  • Manufacturing cost Breakdown

Estimated Price Analysis

Estimation of the manufacturing price

Note: Product cover images may vary from those shown
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