Global Phase Change Memory Market 2017-2021

  • ID: 4201982
  • Report
  • Region: Global
  • 70 pages
  • TechNavio
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until May 31st 2018
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FEATURED COMPANIES

  • HP BAE Systems
  • IBM
  • Micron Technology
  • Samsung Electronics
  • MORE
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About Phase Change Memory

Phase change memory (PCM) stores data by changing the state of matter from which the device is fabricated. It can exist in two states and is a reversible structural phase. PCM is known to have a fast read access time, good data retention, and high data density. The design of phase changing materials consists of narrow electrodes called the heater, which is placed between the two electrodes. Chalcogenide is a widely-used material in PCM. When chalcogenide is heated and cooled, it retains an amorphous state. This state is highly resistive and represents a logical 0. When amorphous chalcogenide is heated and then cooled rapidly, it changes to a crystalline state, which is less resistive and is represented as logical 1.

The analysts forecast the global phase change memory market to grow at a CAGR of 83.98% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global phase change memory market for 2017-2021. To calculate the market size, the report considers the revenue generated from the sales of different PCM technologies.

The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

The report, Global Phase Change Memory Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the Key vendors operating in this market.

Key vendors
- IBM
- Micron Technology
- Samsung Electronics

Other prominent vendors
- HP
- BAE Systems

Market drivers
- Increasing demand for data centers and cloud database.
- For a full, detailed list, view the full report

Market challenges
- Need for high programming current density.
- For a full, detailed list, view the full report

Market trends
- Emergence of low power consumption memory modules.
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2021 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the Key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.
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FEATURED COMPANIES

  • HP BAE Systems
  • IBM
  • Micron Technology
  • Samsung Electronics
  • MORE
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Speak directly to the analyst to clarify any post sales queries you may have.

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Key market highlights
PART 05: Market landscape
  • Market size and forecast
  • Five forces analysis
PART 06: Market segmentation by application
  • Global PCM market by enterprise storage
  • Global PCM market by cell phones
  • Global PCM market by smart cards
PART 07: Market segmentation by technology
  • Global PCM market by PCM as SRAM
  • Global PCM market by PCM as DRAM
  • Global PCM market by PCM as flash memory
  • Global PCM market by PCM as SCM
PART 08: Geographical segmentation
  • Global PCM market by geography
  • PCM market in Americas
  • PCM market in APAC
  • PCM market in EMEA
PART 09: Decision framework

PART 10: Drivers and challenges
  • Market drivers
  • Impact of drivers on key customer segments
  • Market challenges
  • Impact of challenges on key customer segments
PART 11: Market trends

PART 12: Vendor landscape
  • Competitive scenario
PART 13: Key vendor analysis
  • Micron Technology
  • Samsung Electronics
  • IBM
PART 14: Appendix
  • List of abbreviations
List of Exhibits
Exhibit 01: Architecture of PCM
Exhibit 02: Global PCM market: Overview
Exhibit 03: Global PCM market 2016-2021 ($ millions)
Exhibit 04: Five forces analysis
Exhibit 05: Global PCM market by application 2016-2021 (% revenue share)
Exhibit 06: Global PCM market by enterprise storage 2016-2021 ($ millions)
Exhibit 07: Global PCM market by cell phones 2016-2021 ($ millions)
Exhibit 08: Global PCM market by smart cards 2016-2021 ($ millions)
Exhibit 09: Global PCM market by technology 2016 and 2021 (% share)
Exhibit 10: Comparison of memory types
Exhibit 11: Global PCM market by PCM as SRAM 2016-2021 ($ millions)
Exhibit 12: PCM as DRAM architecture
Exhibit 13: Global PCM market by PCM as DRAM 2016-2021 ($ millions)
Exhibit 14: Advantages of PCM as DRAM
Exhibit 15: Global PCM market by PCM as flash memory 2016-2021 ($ millions)
Exhibit 16: Global PCM market by PCM as SCM 2016-2021 ($ millions)
Exhibit 17: Comparison of PCM with PCM-S and PCM-M
Exhibit 18: Global PCM market by geography 2016 (% share)
Exhibit 19: PCM market in Americas 2016-2021 ($ millions)
Exhibit 20: PCM market in APAC 2016-2021 ($ millions)
Exhibit 21: PCM market in EMEA 2016-2021 ($ millions)
Exhibit 22: Global smartphone penetration: Top five countries
Exhibit 23: Global enterprise spending on cloud storage 2011-2016 ($ billions)
Exhibit 24: Impact of drivers
Exhibit 25: Next-generation memories
Exhibit 26: Impact of challenges
Exhibit 27: Competitive features of PCM
Exhibit 28: Other prominent vendors
Exhibit 29: Recent developments: Micron Technology
Exhibit 30: Recent developments: Samsung Electronics
Exhibit 31: Recent developments: IBM
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FEATURED COMPANIES

  • HP BAE Systems
  • IBM
  • Micron Technology
  • Samsung Electronics
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

New Report Released: – Global Phase Change Memory Market 2017-2021

The author of the report recognizes the following companies as the key players in the global phase change memory market: IBM, Micron Technology, and Samsung Electronics.

Other Prominent Vendors in the market are: HP and BAE Systems.

Commenting on the report, an analyst from the research team said: “One trend in market is emergence of low power consumption memory modules. Semiconductor technology, which has driven the computer industry, is improving every year. The new computer architecture includes memory and computer elements that merge in a novel way so that the memory and CPU ecosystem are closer physically and operationally.”

According to the report, one driver in market is high scalability and low power consumption. PCM memory modules are more scalable and non-volatile compared with memory modules such as DRAM and MRAM. PCM scalability implies greater write endurance. Non-volatile memories fundamentally change the landscape of computing as they are able to change the physical state from amorphous to crystalline. Another feature of PCM is its low power consumption. These modules use phase change material such as germanium-antimony-tellurium (Ge2Sb2Te5) to change the state from amorphous to crystalline. The low power consumption of PCMs increases the battery life of electronic devices. This allows electronic devices to function for a longer period. It also increases their operating life cycles and reduces their overall maintenance costs. PCM also acts as a hybrid memory module, which combines PCM and flash memory. PCM has a fast cache memory module so that it can retain data. System boot using PCM will be instantaneous, application checkpoint will be inexpensive, and the system will provide stronger safety guarantees. This is expected to lead to the increase in the demand for PCM.

Further, the report states that one challenges in market is need for high programming current density. There is an increased demand for high programming current density (i.e., >107 A/cm² compared with 105-106 A/cm² for a typical transistor). PCM has high write latency and energy, which act as challenges for the operation of the PCM memory module. Phase change is a thermally driven process rather than an electronic process. Thermal conditions that allow for fast crystallization in a PCM material cannot be the same as the standby conditions of the material (at room). This can result in a decrease in data retention. In addition, the contact between the hot phase change region and the adjacent dielectric region of a phase change material begins to leak current at higher temperatures and may also lose adhesion when expanding at a different rate. A PCM material requires proper activation energy for crystallization. It achieves fast crystallization in programming conditions and slow crystallization in normal conditions.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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  • IBM
  • Micron Technology
  • Samsung Electronics
  • HP BAE Systems
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