Interposer and Fan-Out WLP Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (TSV, Interposer, and Fan-Out WLP), End-User Industry, and Region - Global Forecast to 2022

  • ID: 4211652
  • Report
  • Region: Global
  • 172 Pages
  • Markets and Markets
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The Interposer and Fan-Out WLP Market has Entered the Growth Phase and is Expected to be Valued at USD 13.42 Billion in 2022, Growing at a CAGR of 28.09%

FEATURED COMPANIES

  • Amkor Technology (U.S.)
  • ASE Group (Taiwan)
  • Broadcom Ltd. (Singapore)
  • Intel Corporation (U.S.)
  • Texas Instruments (U.S.)
  • Toshiba Corp. (Japan)
  • MORE

The interposer and fan-out WLP market has entered the growth phase and is expected to be valued at USD 13.42 billion in 2022, growing at a CAGR of 28.09% between 2016 and 2022. The major factors driving the growth of the market include rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of interposers and fan-out wafer level packaging (FOWLP) technology in MEMS and sensors. The main restraint for this market is the thermal-related issues caused by higher level of integration.

The market for through-silicon vias (TSVs) is expected to grow at a high rate between 2016 and 2022. The major factors driving the growth of the interposer and fan-out WLP market for TSVs include high interconnect density and space efficiencies. Also, the compact structure of TSVs has led to the increase in its demand for use in various smart technologies, including wearable and connected devices.

The demand for interposer and fan-out WLP for use in imaging and optoelectronics is growing as chip-scaled opto-electronic packaging is a cost- and size-effective packaging for image sensors. The increasing need for miniaturization and integration of optical and electronic components used in automotive imaging applications is generating huge demand for interposers and FOWLP, which offers high-performance packaging and occupies less space.

The major factors driving the growth of the market in APAC include the presence of major semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan); proximity to major downstream electronics manufacturing operations; government-sponsored infrastructure support; tax incentives; and availability of skilled engineers and labor at a relatively low cost.

Breakdown of Profile of Primary Participants:

  • By Company: Tier 1 - 45 %, Tier 2 - 32%, and Tier 3 - 23%
  • By Designation: C-Level Executives - 25%, Directors - 32%, and Others - 43%
  • By Region: North America - 25%, Europe - 37%, APAC - 28%, and RoW - 10%

The Major Players Profiled in this Report Include:

  • Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
  • Samsung Electronics Co., Ltd. (South Korea)
  • Toshiba Corp. (Japan)
  • ASE Group (Taiwan)
  • Amkor Technology (U.S.)
  • Qualcomm Incorporated (U.S.)
  • Texas Instruments (U.S.)
  • United Microelectronics Corp. (Taiwan)
  • STMicroelectronics NV (Switzerland)
  • Broadcom Ltd. (Singapore)
  • Intel Corporation. (U.S.)
  • Jiangsu Changing Electronics Technology Co., Ltd. (China)
  • Infineon Technologies AG (Germany)

Research Coverage

In this report, the interposer and fan-out WLP market has been segmented on the basis of packaging technology into through silicon vias  (TSVs), interposers, and fan-out WLP; and on the basis of application into logic, imaging and optoelectronics, memory, MEMS/sensors, LED, power, analog & mixed signal, RF, and photonics. The market has also been segmented on the basis of end-user industry, and geography. On the basis of geography, the market has been segmented into-Asia Pacific, North America, Europe, and RoW.

Reasons to buy the report

The report would help the market leaders/new entrants in this market in the following ways:

1. This report segments the interposer and fan-out WLP market comprehensively and provides the closest approximations of the overall market size and those of the subsegments across different applications and regions.
2. The report gives the detailed analysis of interposer and fan-out WLP market with the help of porters five forces analysis, business model analysis, and value chain analysis including key companies in the market and their relations in the ecosystem.
3. The report would help stakeholders understand the pulse of the market and provide them with information on key market drivers, restraints, challenges, and opportunities.
4. This report would help stakeholders understand their competitors better and gain more insights to enhance their position in the market. The competitive landscape section includes competitor ecosystem, new product developments, partnerships, and mergers and acquisitions in the interposer and fan-out WLP market.

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FEATURED COMPANIES

  • Amkor Technology (U.S.)
  • ASE Group (Taiwan)
  • Broadcom Ltd. (Singapore)
  • Intel Corporation (U.S.)
  • Texas Instruments (U.S.)
  • Toshiba Corp. (Japan)
  • MORE
1 Introduction
1.1 Objectives of the Study
1.2 Market Definition
1.3 Market Scope
1.4 Market Segmenttion
1.5 Stakeholders

2 Research Methodology
2.1 Research Methodology
2.2 Market Size Estimation
2.2.1 Top Down Approch
2.2.2 Bottom Up Approach
2.3 Market Breakdown and Data Triangulation
2.4 Market Share Estimation
2.3.1 Key Data From Secondary Sources
2.3.2 Key Data From Primary Sources
2.5 Assumptions

3 Executive Summary

4 Premium Insights
4.1 Market Size: Interposer and Fan-Out WLP Market, By Packaging Technology
4.1.1 Interposer and Fan-Out WLP Market, By Packaging Technology (2015–2022)
4.2 Market Size: Interposer and Fan-Out WLP Market, By Application
4.2.1 Interposer and Fan-Out WLP Market, By Application (2015–2022)

5 Market Overview
5.1 Market Segmentation
5.2 Drivers
5.3 Restraints
5.4 Opprtunities
5.5 Challenges
5.6 Impact Analysis

6 Industry Trends
6.1 Porter’s Five Forces Analysis (2016)
6.1.1 Porter’s Five Forces Analysis (2016)
6.1.2 Threat of New Entrants
6.1.3 Threat 0f Substitutes
6.1.4 Bargaining Power of Buyers
6.1.5 Bargaining Power of Suppliers
6.1.6 Intensity of Competitive Rivalry
6.2 Value Chain Analysis
6.2.1 Value Chain Analysis
6.3 Key Players in the Interposer and Fan-Out WLP Market and Their Customers
6.4 Business Model Analysis

7 Market, By Packaging Technology
7.1 Introduction
7.2 Market for TSV, By End-User Industry
7.3 Market for Fan-Out WLP, By End-User Industry
7.4 Market for Interposers, By End-User Industry

8 Market, By Application
8.1 Introduction
8.2 Interposer and Fan-Out WLP Market, By Application
8.3 Market for Logic Applications, By End-User Industry
8.4 Market for Imaging & Optoelectronics Applications, By End-User Industry
8.5 Market for Memory Applications, By End-User Industry
8.6 Market for MEMS/ Sensors Applications, By End-User Industry
8.7 Market for LED Applications, By End-User Industry
8.8 Market for Power, Analog & Mixed Signal, RF, Photonics Applications, By End-User Industry

9 Market, By End-User Industry
9.1 Introduction
9.2 Interposer and Fan-Out WLP Market, By End-User Industry
9.3 Market for Consumer Electronics Industry
9.4 Market for Telecommunication Industry
9.5 Market for Industrial Sector
9.6 Market for Automotive Industry
9.7 Market for Military & Aerospace Industry
9.8 Market for Smart Technologies Industry
9.9 Market for Medical Devices Industry

10 Market, By Region
10.1 Interposer and Fan-Out WLP Market, By Region
10.1.1 Interposer and Fan-Out WLP Market, By Region, 2015–2022 (USD Million)
10.2 Interposer and Fan-Out WLP Market in APAC, By Country/Region
10.2.1 Interposer and Fan-Out WLP Market in APAC, By Country/Region, 2015–2022 (USD Million))
10.3 Interposer and Fan-Out WLP Market in North America, By Country
10.3.1 Interposer and Fan-Out WLP Market in North America, By Country 2015–2022 (USD Million)
10.4 Interposer and Fan-Out WLP Market in Europe, By Country/Region
10.4.1 Interposer and Fan-Out WLP Market in Europe, By Country/Region, 2015–2022 (USD Million)
10.5 Interposer and Fan-Out WLP Market in RoW, By Region
10.5.1 Interposer and Fan-Out WLP Market in RoW, By Region 2015–2022 (USD Million)

11 Competitive Landscape
11.1 Competitive Situation and Trends
11.1.1 New Product Development and Launches
11.1.2 Partnerships, Agreements, and Collaborations
11.1.3 Acquisitions
11.1.4 Investments and Expansions
11.2 Ranking Analysis

12 Company Profiles
(Company at A Glance, Recent Financials, Products & Services, Strategies & Insights, & Recent Developments) -
12.1 Introduction
12.2 Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
12.3 Samsung Electronics Co., Ltd. (South Korea)
12.4 Toshiba Corp. (Japan)
12.5 ASE Group (Taiwan)
12.6 Qualcomm Incorporated (U.S.)
12.7 Texas Instruments (U.S.)
12.8 Amkor Technology (U.S.)
12.9 United Microelectronics Corp. (Taiwan)
12.10 Stmicroelectronics NV (Switzerland)
12.11 Broadcom Ltd. (Singapore)
12.12 Intel Corporation (U.S.)
12.13 Jiangsu Changjiang Electronics Technology Co., Ltd. (China)
12.14 Infineon Technologies AG (Germany)
  • Details on Company at A Glance, Recent Financials, Products & Services, Strategies & Insights, & Recent Developments Might Not Be Captured in Case of Unlisted Companies.
13 Appendix
13.1 Discussion Guide

List of Tables

Table 7.2.1 Market for TSV, By End-User Industry, 2015–2022 (USD Million)
Table 7.3.1 Market for Fan-Out WLP, By End-User Industry, 2015–2022 (USD Million)
Table 7.4.1 Market for Interposer, By End-User Industry, 2015–2022 (USD Million)
Table 8.2.1 Interposer and Fan-Out WLP Market, By Application, 2015–2022 (USD Million)
Table 8.3.1 Market for Logic Applications, By End-User Industry, 2015–2022 (USD Million)
Table 8.4.1 Market for Imaging & Optoelectronics Applications, By End-User Industry (USD Million)
Table 8.5.1 Market for Memory Applications, By End-User Industry (USD Million)
Table 8.6.1 Market for MEMS/ Sensors Applications, By End-User Industry (USD Million)
Table 8.7.1 Market for LED Applications, By End-User Industry (USD Million)
Table 8.8.1 Market for Power, Analog & Mixed Signal, Rf, Photonics Applications, By End-User Industry (USD Million)
Table 9.2.1 Interposer and Fan-Out WLP Market, By End-User Industry, 2015–2022 (USD Million)
Table 9.3.1 Market for Consumer Electronics Industry, By Application, 2015–2022 (USD Million)
Table 9.3.2 Market for Consumer Electronics Industry, By Region, 2015–2022 (USD Million)
Table 9.4.1 Market for Telecommunication Industry, By Application, 2015–2022 (USD Million)
Table 9.4.2 Market for Telecommunication Industry, By Region, 2015–2022 (USD Million)
Table 9.5.1 Market for Industrial Sector, By Application, 2015–2022 (USD Million)
Table 9.5.2 Market for Industrial Sector, By Region, 2015–2022 (USD Million)
Table 9.6.1 Market for Automotive Industry, By Application, 2015–2022 (USD Million)
Table 9.6.2 Market for Automotive Industry, By Region, 2015–2022 (USD Million)
Table 9.7.1 Market for Military & Aerospace Industry, By Application, 2015–2022 (USD Million)
Table 9.7.2 Market for Military & Aerospace Industry, By Region, 2015–2022 (USD Million)
Table 9.8.1 Market for Smart Technologies Industry, By Application, 2015–2022 (USD Million)
Table 9.8.2 Market for Smart Technologies Industry, By Region, 2015–2022 (USD Million)
Table 9.9.1 Market for Medical Devices Industry, By Application, 2015–2022 (USD Million)
Table 9.9.2 Market for Medical Devices Industry, By Region, 2015–2022 (USD Million)

List of Figures

Figure 4.1.1 Interposer and Fan-Out WLP Market, By Packaging Technology (2015-2022)
Figure 4.2.1 Interposer and Fan-Out WLP Market, By Application (2015-2022)
Figure 6.1.1 Porter’s Five Forces Analysis (2016)
Figure 6.1.2 Intensity of Competitive Rivalry
Figure 6.1.3 Threat of Substitutes
Figure 6.1.4 Bargaining Power of Buyers
Figure 6.1.5 Bargaining Power of Suppliers
Figure 6.1.6 Threat of New Entrants
Figure 6.2.1 Value Chain Analysis
Figure 7.1.1 Interposer and Fan-Out WLP Market, By Packaging Technology ( USD Billion)
Figure 7.1.2 Interposer and Fan-Out WLP Wafer Shipment (12" Eq.), By Packaging Technology, 2015–2022 (Million Units)
Figure 7.2.1 TSV Market, By End-User Industry, 2015–2022 (USD Million)
Figure 7.3.1 Fan-Out WLP Market, By End-User Industry, 2015–2022 (USD Million)
Figure 7.4.1 Interposer Market, By End-User Industry, 2015–2022 (USD Million)
Figure 8.2.1 Interposer and Fan-Out WLP Market, By Application, 2016–2022 (USD Million)
Figure 8.2.2 Interposer and Fan-Out WLP Wafer Shipment (12" Eq.), By Application, 2015–2022 (Million Units)
Figure 8.3.1 Market for Logic Applications, By End-User Industry (USD Million)
Figure 8.4.1 Market for Imaging & Optoelectronics Applications, By End-User Industry (USD Million)
Figure 8.5.1 Market for Memory Applications, By End-User Industry (USD Million)
Figure 8.6.1 Market for MEMS/ Sensors Applications, By End-User Industry (USD Million)
Figure 8.7.1 Market for LED Applications, By End-User Industry (USD Million)
Figure 8.8.1 Market for Power, Analog & Mixed Signal, Rf, Photonics Applications, By End-User Industry (USD Million)
Figure 9.2.1 Interposer and Fan-Out WLP Market, By End-User Industry, 2016–2022 (USD Million)
Figure 9.3.1 Market for Consumer Electronics Industry, By Application, 2016–2022 (USD Million)
Figure 9.3.2 Market for Consumer Electronics Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.4.1 Market for Telecommunication Industry, By Application, 2016–2022 (USD Million)
Figure 9.4.2 Market for Telecommunication Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.5.1 Market for Industrial Sector, By Application, 2016–2022 (USD Million)
Figure 9.5.2 Market for Industrial Sector, By Application, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.6.1 Market for Automotive Industry, By Application, 2016–2022 (USD Million)
Figure 9.6.2 Market for Automotive Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.7.1 Market for Military & Aerospace Industry, By Application, 2016–2022 (USD Million)
Figure 9.7.2 Market for Military & Aerospace Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.8.1 Market for Smart Technologies Industry, By Application, 2016–2022 (USD Million)
Figure 9.8.2 Market for Smart Technologies Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.9.1 Market for Medical Devices Industry, By Application, 2016–2022 (USD Million)
Figure 9.9.2 Market for Medical Devices Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 10.1.1 Interposer and Fan-Out WLP Market, By Region, 2015–2022 (USD Million)
Figure 10.2.1 Interposer and Fan-Out WLP Market in APAC, By Country, 2015–2022 (USD Million)
Figure 10.3.1 Interposer and Fan-Out WLP Market in North America, By Country, 2015–2022 (USD Million)
Figure 10.4.1 Interposer and Fan-Out WLP Market in Europe, By Country, 2015–2022 (USD Million)
Figure 10.5.1 Interposer and Fan-Out WLP Market in RoW, By Region, 2015–2022 (USD Million)
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology (U.S.)
  • ASE Group (Taiwan)
  • Broadcom Ltd. (Singapore)
  • Intel Corporation (U.S.)
  • Texas Instruments (U.S.)
  • Toshiba Corp. (Japan)
  • MORE

The interposer and fan-out WLP market has entered the growth phase and is expected to be valued at USD 13.42 Billion in 2022, growing at a CAGR of 28.09% between 2016 and 2022. The major factors driving the growth of the market include rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of advanced wafer level packaging technologies in MEMS and sensors.

The market for through-silicon vias (TSVs) is expected to grow at a high rate between 2016 and 2022. The major factors driving the growth of the interposer and fan-out WLP market for TSVs include high interconnect density and space efficiencies. Also, the compact structure of TSVs has led to the increase in its demand for use in various smart technologies, including wearable and connected devices.

The market for memory applications is expected to grow at a high rate between 2016 and 2022. The use of interposer and fan-out WLP is expected to provide a cost-effective solution and drive the wide-scale adoption of this technology in potential end products. The average number of stacked dice in memory modules is likely to grow with the increasing usage of interposers. Moreover, innovations in advanced data storage such as flash memory, hybrid memory cube, and so on are creating a demand for interposer and fan-out WLP to develop high-performing compact memory solutions. In addition, the advent of complex device designs has brought new challenges in interconnections such as need for higher I/O density and performance requirements, which are efficiently addressed by interposer and fan-out WLP.

Among all the major end-user industries, the consumer electronics industry accounted the largest share of the interposer and fan-out WLP market in 2015. The growth of the market for the consumer electronics is mainly driven by the increasing demand for smartphones, tablets, and other portable computing devices, which can be developed using advanced packaging to provide small form factors and improved performance at relatively lower cost.

APAC accounted for the largest share of the interposer and fan-out WLP market in 2015. The major factors driving the growth of the market in APAC include the presence of major semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan); proximity to major downstream electronics manufacturing operations; government-sponsored infrastructure support; tax incentives; and availability of skilled engineers and labor at a relatively low cost.

Thermal-related issues due to higher level of integration are the major retraining factor for the growth of the interposer and fan-out WLP market.

Taiwan Semiconductor Manufacturing Company Limited (Taiwan) is one of the leading companies operating in the interposer and fan-out WLP market, followed by Samsung Electronics Co., Ltd. (South Korea) that provides advanced packages consisting fan-out WLP and TSV integration to address the need for high-performance and miniaturized products. Companies in the market are strengthening their product portfolio by launching new launches and investing more in R&D; they are increasingly undertaking partnerships and collaborations to develop new technologies.

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  • ASE Group (Taiwan)
  • Amkor Technology (U.S.)
  • Broadcom Ltd. (Singapore)
  • Infineon Technologies AG (Germany)
  • Intel Corporation (U.S.)
  • Jiangsu Changjiang Electronics Technology Co., Ltd. (China)
  • Qualcomm Incorporated (U.S.)
  • Samsung Electronics Co., Ltd. (South Korea)
  • Stmicroelectronics NV (Switzerland)
  • Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
  • Texas Instruments (U.S.)
  • Toshiba Corp. (Japan)
  • United Microelectronics Corp. (Taiwan)
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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