Global Wafer Inspection Equipment Market 2017-2021 - Product Image

Global Wafer Inspection Equipment Market 2017-2021

  • ID: 4268116
  • Report
  • Region: Global
  • 70 pages
  • TechNavio
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FEATURED COMPANIES

  • Applied Materials
  • Hitachi High-Technologies
  • KLA-Tencor
  • Lasec Corporation
  • Nikon
  • Rudolph Technologies
  • MORE
About Wafer Inspection Equipment
Semiconductor wafer inspection equipment is part of semiconductor capital equipment. These systems are essential in the semiconductor manufacturing process as they help maintain the performance of semiconductor ICs by identifying the impurities or defects in the wafers during the manufacturing process. Semiconductor device manufacturers — foundries, memory device manufacturers, and integrated device manufacturer (IDMs) — are the principal customers for the semiconductor capital equipment vendors.

The analysts forecast the global wafer inspection equipment market to grow at a CAGR of 12.49% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global wafer inspection equipment market for 2017-2021. To calculate the market size, the report considers the latest installations and sales volume of wafer inspection systems.

The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

The report, Global Wafer Inspection Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Applied Materials
- Hermes Microvision (ASML)
- KLA-Tencor
- Lasec Corporation

Other prominent vendors
- Zeiss Global
- FEI (Thermo Fisher Scientific)
- Hitachi High-Technologies
- JEOL
- Lam Research
- Nanometrics
- Nikon
- Planar Corporation
- Rudolph Technologies
- Tokyo Seimitsu
- Toray Engineering
Market drivers
- Incentives and discounts for long-term customers
- For a full, detailed list, view the full report

Market challenges
- Need for high initial capital investment
- For a full, detailed list, view the full report

Market trends
- Growing requirement for memory devices
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2021 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Applied Materials
  • Hitachi High-Technologies
  • KLA-Tencor
  • Lasec Corporation
  • Nikon
  • Rudolph Technologies
  • MORE
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Market outline
PART 05: Market landscape
  • Market overview
  • Market size and forecast
  • Five forces analysis
PART 06: Market segmentation by technology type
  • Global wafer inspection equipment market by technology
  • Optical technology
  • E-beam technology
PART 07: Market segmentation by wafer type
  • Global wafer inspection equipment market by wafer type
  • Patterned wafer inspection equipment
  • Unpatterned wafer inspection equipment
PART 08: Market segmentation end-user
  • Global wafer inspection equipment market by end-user
PART 09: Geographical segmentation
  • Global wafer inspection equipment market by geography
PART 10: Key leading countries
  • Key leading countries
  • Taiwan
  • South Korea
  • Japan
  • China
PART 11: Decision framework

PART 12: Drivers and challenges
  • Market drivers
  • Market challenges
PART 13: Market trends
  • Growing requirement for memory devices
  • Change in wafer size
  • Development of multi-beam e-beam inspection
  • Advent of FOWLP technology
  • Continuous decrease in lithography wavelength
PART 14: Vendor landscape
  • Competitive landscape
  • Key vendors
List of Exhibits
Exhibit 01: Overview of global wafer inspection equipment market
Exhibit 02: Global wafer inspection equipment market 2016-2021 ($ billions)
Exhibit 03: Five forces analysis
Exhibit 04: Global wafer inspection equipment market by technology 2016-2021 (% share of revenue)
Exhibit 05: Revenue trend-line of global wafer inspection equipment market by technology 2016-2021 ($ billions)
Exhibit 06: Global optical wafer inspection equipment market 2016-2021 ($ billions)
Exhibit 07: Global e-beam wafer inspection equipment market 2016-2021 ($ billions)
Exhibit 08: Global wafer inspection equipment market by wafer type 2016-2021 (% share of revenue)
Exhibit 09: Global wafer inspection equipment market by wafer type 2016-2021 ($ billions)
Exhibit 10: Global patterned wafer inspection equipment market 2016-2021 ($ billions)
Exhibit 11: E-beam wafer inspection process chart
Exhibit 12: Patterned wafer inspection equipment market share based on technology (%)
Exhibit 13: Comparison between optical and e-beam wafer inspection equipment
Exhibit 14: Global unpatterned wafer inspection equipment market 2016-2021 ($ billions)
Exhibit 15: Strengths and limitations of unpatterned wafer inspection equipment
Exhibit 16: Global wafer inspection equipment market by end-user 2016-2021 (% share of revenue)
Exhibit 17: Revenue trend-line global wafer inspection equipment market by end-user 2016-2021 ($ billions)
Exhibit 18: Global wafer inspection equipment market for foundries 2016-2021 ($ billions)
Exhibit 19: Global wafer inspection equipment market for memory manufacturers 2016-2021 ($ billions)
Exhibit 20: Global wafer inspection equipment market for IDMs 2016-2021 ($ billions)
Exhibit 21: Global wafer inspection equipment market by geography 2016-2021 (% share of revenue)
Exhibit 22: Revenue trend-line of global wafer inspection equipment by geography 2016-2021 ($ billions)
Exhibit 23: Wafer inspection equipment market in APAC 2016-2021 ($ billions)
Exhibit 24: Wafer inspection equipment market in Americas 2016-2021 ($ billions)
Exhibit 25: Wafer inspection equipment market in EMEA 2016-2021 ($ billions)
Exhibit 26: Key leading countries
Exhibit 27: Percentage share of key leading countries during the forecast period
Exhibit 28: Global NAND flash market 2016-2021 (% share)
Exhibit 29: Global semiconductor Market trend 1990-2016 ($ billions)
Exhibit 30: CAGR of 3D NAND and DRAM for the forecast period
Exhibit 31: Timeline for semiconductor wafer size advances
Exhibit 32: Node transition in the semiconductor industry
Exhibit 33: Market share of key vendors in the global semiconductor wafer inspection equipment market 2016 (%)
Exhibit 34: Other prominent vendors
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FEATURED COMPANIES

  • Applied Materials
  • Hitachi High-Technologies
  • KLA-Tencor
  • Lasec Corporation
  • Nikon
  • Rudolph Technologies
  • MORE
New Report Released: – Global Wafer Inspection Equipment Market 2017-2021

The author of the report recognizes the following companies as the key players in the global wafer inspection equipment market: Applied Materials, Hermes Microvision (ASML), KLA-Tencor, and Lasec Corporation.

Other Prominent Vendors in the market are: Zeiss Global, FEI (Thermo Fisher Scientific), Hitachi High-Technologies, JEOL, Lam Research, Nanometrics, Nikon, Planar Corporation, Rudolph Technologies, Tokyo Seimitsu, and Toray Engineering.

Commenting on the report, an analyst from the research team said: “The latest trend gaining momentum in the market is growing requirement for memory devices. Semiconductor device manufacturers are shifting focus from logic, analog, and discrete devices to memory devices such as 3D NAND and DRAM. The main reason for this change is the high growth potential of the semiconductor memory devices market. This increasing need is also complemented by the market dynamics of the consumer electronics market, which offers sufficient new opportunities to the vendors. For instance, initially, smartphones and notebooks used HDD for data storage but have migrated to flash memory now.”

According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $1,000,000-10,000,000. Therefore, manufacturers look to develop long-standing relations with customers. The outlook is to build long-term relationships with the customers by offering incentives and discounts for future purchases. The targeted segments are the ones that have a tendency to procure equipment in bulk and account for around 5%-10% of the equipment manufacturers global sales.

Further, the report states that one of the major factors hindering the growth of this market is need for high initial capital investment. Wafer inspection equipment eases the semiconductor manufacturing process and ensures high-efficiency semiconductor devices by identifying defects on the wafer at the initial stages, which reduces the possibility of defective ICs.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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  • Applied Materials
  • Hermes Microvision (ASML)
  • KLA-Tencor
  • Lasec Corporation
  • Zeiss Global
  • FEI (Thermo Fisher Scientific)
  • Hitachi High-Technologies
  • JEOL
  • Lam Research
  • Nanometrics
  • Nikon
  • Planar Corporation
  • Rudolph Technologies
  • Tokyo Seimitsu
  • Toray Engineering
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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