Global Semiconductor Assembly Equipment Market 2017-2021

  • ID: 4268125
  • Report
  • Region: Global
  • 70 pages
  • TechNavio
OFF
until May 31st 2018
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

1 of 5

FEATURED COMPANIES

  • ASM Pacific Technology
  • ChipMOS TECHNOLOGIES
  • Greatek Electronics
  • Hybond
  • Shinkawa
  • Tokyo Seimitsu
  • MORE
About Semiconductor Assembly Equipment
Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. Chip assembly basically involves attaching or joining two or more semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used for making interconnects between an IC or any other semiconductor device during assembly. This connection ensures the flow of electricity in the semiconductor device.

The analysts forecast the global semiconductor assembly equipment market to grow at a CAGR of 3.57% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly equipment market for 2017-2021. To calculate the market size, the report considers the sales of assembly equipment to end-users.

The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

The report, Global Semiconductor Assembly Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- ASM Pacific Technology
- Kulicke & Soffa Industries
- Palomar Technologies
- Tokyo Electron
- Tokyo Seimitsu
Other prominent vendors
- Besi
- ChipMOS TECHNOLOGIES
- DIAS Automation
- Greatek Electronics
- Hesse Mechatronics
- Hybond
- Shinkawa
- Toray Engineering
- West - Bond

Market drivers
- Incentives and discounts for long-term customers
- For a full, detailed list, view the full report

Market challenges
- High-investment market
- For a full, detailed list, view the full report

Market trends
- Growing use of 3D packaging technology
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2021 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.
READ MORE
Note: Product cover images may vary from those shown
2 of 5

FEATURED COMPANIES

  • ASM Pacific Technology
  • ChipMOS TECHNOLOGIES
  • Greatek Electronics
  • Hybond
  • Shinkawa
  • Tokyo Seimitsu
  • MORE
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Key market highlights
PART 05: Technology overview
  • Overview of semiconductor assembly equipment
PART 06: Market landscape
  • Semiconductor assembly equipment market: Overview
  • Market size and forecast
  • Five forces analysis
PART 07: Market segmentation by type
  • Global semiconductor assembly equipment market by type
  • Global semiconductor assembly equipment market by die bonding equipment
  • Global semiconductor assembly equipment market by inspection and dicing equipment
  • Global semiconductor assembly equipment market by packaging equipment
  • Global semiconductor assembly equipment market by wire bonding equipment
  • Global semiconductor assembly equipment market by plating equipment
PART 08: Market segmentation by end-user
  • Global semiconductor assembly equipment market by end-user
  • Global semiconductor assembly equipment market by OSATs
  • Global semiconductor assembly equipment market by IDMs
PART 09: Geographical segmentation
  • Global semiconductor assembly equipment market by geography
  • Semiconductor assembly equipment market in APAC
  • Semiconductor assembly equipment market in Americas
  • Semiconductor assembly equipment market in EMEA
PART 10: Key leading countries
  • Global semiconductor assembly market: Key leading countries
  • Taiwan
  • South Korea
  • Japan
  • China
PART 11: Decision framework

PART 12: Drivers and challenges
  • Market drivers
  • Impact of drivers on key customer segments
  • Impact of drivers on key customer segments
  • Market challenges
  • Impact of challenges on key customer segments
PART 13: Market trends
  • Growing use of 3D packaging technology
  • Increase in number of OSAT vendors
  • M&A in packaging and assembly market
  • Advent of FOWLP technology
  • Automation in automobiles
  • Increased need for semiconductor memory devices
PART 14: Vendor landscape
  • Competitive scenario
  • Major vendors
  • Other prominent vendors
PART 15: Appendix
  • List of abbreviations
List of Exhibits
Exhibit 01: Steps in back-end chip formation
Exhibit 02: Supply chain in traditional semiconductor IC packaging industry
Exhibit 03: Supply chain in new semiconductor IC packaging industry
Exhibit 04: Global semiconductor assembly equipment market: Overview
Exhibit 05: Global semiconductor assembly equipment market 2016-2021 ($ billions)
Exhibit 06: Five forces analysis
Exhibit 07: Global semiconductor assembly equipment market by type 2016-2021 (% share)
Exhibit 08: Global semiconductor assembly equipment market by type: Revenue trend line 2016-2021 ($ billions)
Exhibit 09: Global semiconductor assembly equipment market by die bonding equipment 2016-2021 ($ billions)
Exhibit 10: Global semiconductor assembly equipment market by inspection and dicing equipment 2016-2021 ($ billions)
Exhibit 11: Global semiconductor assembly equipment market by packaging equipment 2016-2021 ($ billions)
Exhibit 12: Global semiconductor assembly equipment market by wire bonding equipment 2016-2021 ($ billions)
Exhibit 13: Global semiconductor assembly equipment market plating equipment 2016-2021 ($ billions)
Exhibit 14: Global semiconductor assembly equipment market by end-user 2016-2021 (% share)
Exhibit 15: Global semiconductor assembly equipment market by end-user: Revenue trend line 2016-2021 ($ billions)
Exhibit 16: Global semiconductor assembly equipment market by OSATs 2016-2021 ($ billions)
Exhibit 17: Global semiconductor assembly equipment market by IDMs 2016-2021 ($ billions)
Exhibit 18: Global semiconductor assembly equipment by geography 2016-2021 (% share)
Exhibit 19: Global semiconductor assembly equipment market by geography: Revenue trend line 2016-2021 ($ billions)
Exhibit 20: Semiconductor assembly equipment market in APAC 2016-2021 ($ billions)
Exhibit 21: Semiconductor assembly equipment market in Americas 2016-2021 ($ billions)
Exhibit 22: Semiconductor assembly equipment market in EMEA 2016-2021 ($ millions)
Exhibit 23: Key leading countries
Exhibit 24: Global semiconductor assembly market: Key leading countries 2016-2021
Exhibit 25: Semiconductor devices by application 2016 and 2021 (% share)
Exhibit 26: Impact of drivers
Exhibit 27: Impact of drivers
Exhibit 28: Global semiconductor Market trend 1992-2016 ($ billions)
Exhibit 29: Impact of challenges
Exhibit 30: CAGR of 3D NAND and DRAM 2016-2021
Exhibit 31: Global semiconductor assembly equipment market: Other prominent vendors
Note: Product cover images may vary from those shown
3 of 5

Loading
LOADING...

4 of 5

FEATURED COMPANIES

  • ASM Pacific Technology
  • ChipMOS TECHNOLOGIES
  • Greatek Electronics
  • Hybond
  • Shinkawa
  • Tokyo Seimitsu
  • MORE
New Report Released: – Global Semiconductor Assembly Equipment Market 2017-2021

The author of the report recognizes the following companies as the key players in the global semiconductor assembly equipment market: ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, and Tokyo Seimitsu.

Other Prominent Vendors in the market are: Besi, ChipMOS TECHNOLOGIES, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, and West Bond.

Commenting on the report, an analyst from the research team said: “The latest trend gaining momentum in the market is growing use of 3D packaging technology. Foundries are using 3D packaging technology to meet the demands of electronic device manufacturers. These manufacturers are focusing on reducing the space occupied by ICs in their devices without compromising on power-saving capabilities. 3D packaging involves the stacking of multiple chips in a single stack, thereby utilizing the least possible space in a device.”

According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is defined by relationship-based sales. The selling price of assembly equipment is usually in the range of $100,000-1,000,000. Therefore, manufacturers look to develop long-standing relations with customers that buy their products. The aim of such relations is to convince their customers to procure equipment from them.

Further, the report states that one of the major factors hindering the growth of this market is high-investment market. The increase in the demand for compact ICs and emergence of new 3D packaging solutions such as stacked packaging, microelectromechanical system packaging, and flip-chip packaging have compelled manufacturers to modify their production processes. Thus, manufacturers have to make significant investments to produce compact, efficient and reliable ICs.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
5 of 5
  • ASM Pacific Technology
  • Kulicke & Soffa Industries
  • Palomar Technologies
  • Tokyo Electron
  • Tokyo Seimitsu
  • Besi
  • ChipMOS TECHNOLOGIES
  • DIAS Automation
  • Greatek Electronics
  • Hesse Mechatronics
  • Hybond
  • Shinkawa
  • Toray Engineering
  • West Bond
Note: Product cover images may vary from those shown
6 of 5
Note: Product cover images may vary from those shown
Adroll
adroll