Global Wire Bonder Equipment Market 2017-2021

  • ID: 4268133
  • Report
  • Region: Global
  • 70 pages
  • TechNavio
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FEATURED COMPANIES

  • ASM Pacific Technology
  • Besi
  • DIAS Automation
  • F&K Delvotec Bondtechnik
  • Hesse
  • Hybond
  • MORE
About Wire Bonder Equipment
Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.

The analysts forecast the global wire bonder equipment market to grow at a CAGR of 2.88% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global wire bonder equipment market for 2017-2021. To calculate the market size, the report considers the new installations, shipments, and sales of wire bonding systems in the semiconductor market.

The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

The report, Global Wire Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- ASM Pacific Technology
- Kulicke& Soffa
- Palomar Technologies

Other prominent vendors
- Besi
- DIAS Automation
- F&K Delvotec Bondtechnik
- Hesse
- Hybond
- SHINKAWA Electric
- Toray Engineering
- West Bond

Market drivers
- Incentives and discounts for long-term customers
- For a full, detailed list, view the full report

Market challenges
- High investment market
- For a full, detailed list, view the full report

Market trends
- Growing use of 3D chip packaging
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2021 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • ASM Pacific Technology
  • Besi
  • DIAS Automation
  • F&K Delvotec Bondtechnik
  • Hesse
  • Hybond
  • MORE
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Key market highlights
PART 05: Market landscape
  • Overview of semiconductor packaging and assembly equipment
  • Ecosystem of semiconductor IC packaging industry
  • Wire bonder market overview
  • Market size and forecast
  • Five forces analysis
PART 06: Market segmentation by product
  • Global wire bonder equipment market by product
  • Ball bonders
  • Stud-bump bonders
  • Wedge bonders
PART 07: Market segmentation by end-user
  • Global wire bonder equipment market by end-user
  • OSATs
  • Market size and forecast
PART 08: Geographical segmentation
  • Global wire bonder equipment market by geography
  • APAC
  • Americas
  • EMEA
PART 09: Key leading countries
  • Key leading countries
  • Taiwan
  • South Korea
  • Japan
  • China
PART 10: Decision framework

PART 11: Drivers and challenges
  • Market drivers
  • Impact of drivers on key customer segments
  • Market challenges
  • Impact of challenges on key customer segments
PART 12: Market trends
  • Growing use of 3D chip packaging
  • Increase in number of OSAT vendors
  • Trend of M&A in the packaging and assembly market
  • Advent of FOWLP technology
  • Automation in automobiles
PART 13: Vendor landscape
  • Competitive scenario
  • Key vendors
  • Other prominent vendors
PART 14: Appendix
  • List of abbreviations
List of Exhibits
Exhibit 01: Comparison of wire bonding techniques
Exhibit 02: Comparison of the three types of wire bonds
Exhibit 03: Steps involved in back-end chip formation
Exhibit 04: Supply chain of traditional semiconductor IC packaging industry
Exhibit 05: Supply chain of new semiconductor IC packaging industry
Exhibit 06: Overview of global wire bonder equipment market
Exhibit 07: Global wire bonder equipment market 2016-2021 ($ millions)
Exhibit 08: Five forces analysis
Exhibit 09: Global wire bonder equipment market by product 2016-2021 (% share of revenue)
Exhibit 10: Revenue trend line of global wire bonder equipment market by product 2016-2021 ($ millions)
Exhibit 11: Global ball bonder equipment market by ball bonders 2016-2021 ($ millions)
Exhibit 12: Global wire bonder equipment market by stud-bump bonders 2016-2021 ($ millions)
Exhibit 13: Global wedge bonder equipment market by wedge bonders 2016-2021 ($ millions)
Exhibit 14: Global wire bonder equipment market by end-user 2016-2021 (% share of revenue)
Exhibit 15: Revenue trend line of the global wire bonder equipment market by end-user 2016-2021 ($ millions)
Exhibit 16: Global wire bonder equipment market by OSATs 2016-2021 ($ millions)
Exhibit 17: Global wire bonder equipment market by IDMs 2016-2021 ($ millions)
Exhibit 18: Global wire bonder equipment market by geography 2016-2021 (% share of revenue)
Exhibit 19: Global wire bonder equipment market by geography ($ millions)
Exhibit 20: Wire bonder equipment market in APAC 2016-2021 ($ millions)
Exhibit 21: Wire bonder equipment market in Americas 2016-2021 ($ millions)
Exhibit 22: Wire bonder equipment market in EMEA 2016-2021 ($ millions)
Exhibit 23: Key leading countries
Exhibit 24: Percentage share of key leading countries 2016-2021
Exhibit 25: Forecast by application of semiconductor devices 2016 and 2021 (% share of unit shipments)
Exhibit 26: Impact of drivers
Exhibit 27: Global semiconductor Market trend 1990-2016 ($ billions)
Exhibit 28: Impact of challenges
Exhibit 29: Other prominent vendors
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • ASM Pacific Technology
  • Besi
  • DIAS Automation
  • F&K Delvotec Bondtechnik
  • Hesse
  • Hybond
  • MORE
New Report Released: – Global Wire Bonder Equipment Market 2017-2021

The author of the report recognizes the following companies as the key players in the global wire bonder equipment market: ASM Pacific Technology, Kulicke& Soffa, and Palomar Technologies.

Other Prominent Vendors in the market are: Besi, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, and West Bond.

Commenting on the report, an analyst from the research team said: “The latest trend gaining momentum in the market is growing use of 3D chip packaging. Foundries have resorted to 3D packaging technology to meet the demands of electronic product manufacturers. EDMs are looking to cut down the space occupied by ICs in their devices, without compromising the power-saving capability. 3D packaging encompasses, stacking multiple chips in a single stack, thereby utilizing the least possible space in a device. The emergence of new types of chip packaging will offer OSATs and IDMs with new business and growth opportunities in the coming years, thereby propelling the growth of the semiconductor packaging equipment such as wire bonder equipment during the forecast period.”

According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Therefore, manufacturers look to develop long-standing relations with customers buying their product offerings. The outlook of building such relations is to ensure repeat purchases by offering discounts and incentives for future orders. This is mostly practiced on those customers who account for around 5-10% of the equipment manufacturers sales.

Further, the report states that one of the major factors hindering the growth of this market is high investment market. The advent of new packaging solutions based on 3D technology such as flip-chip packaging, TSV stacked packaging, and MEMs packaging has changed the manufacturing landscape of the semiconductor industry. These technologies are being utilized to keep pace with the growing demand for compact semiconductor devices in the market. Equipment manufacturers have to undertake significant investments to ensure their devices are up-to-date with the latest technologies. These advances in technology have increased the complexity of the production process, consuming additional time while also increasing the probability of defects.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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  • ASM Pacific Technology
  • Kulicke& Soffa
  • Palomar Technologies
  • Besi
  • DIAS Automation
  • F&K Delvotec Bondtechnik
  • Hesse
  • Hybond
  • SHINKAWA Electric
  • Toray Engineering
  • West Bond
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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