Design Analysis Nokia FBBC GSM/W-CDMA/HSPA+/FDD LTE Flexi Multiradio 10 Base Station Capacity Expansion Unit

  • ID: 4308306
  • Report
  • 36 pages
  • EJL Wireless Research
1 of 5

FEATURED COMPANIES

  • Analog Devices
  • Fairchild Semiconductor
  • NXP Semiconductors
  • Pulse Electronics
  • STMicroelectronics
  • TDK-Epcos
  • MORE

This report covers the design analysis of a Nokia FBBC GSM/UMTS/FDD LTE Flexi Multiradio 10 Base Station Capacity Expansion Unit. This unit is part of the Flexi Multiradio 10 FSMF base station system. The unit was manufactured in Q3 of 2014.

Key Findings:

  • New Flexi Signal Processing Architecture
  • New Advanced Switching Architecture
  • Advanced 2nd Generation Nokia ASIC for OBSAI/CPRI Fronthaul Link
  • Advanced power management for ASIC, DSPs, Network Processor and FPGAs

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Cavium, Fairchild Semiconductor, Integrated Device Technology, Kemet, NXP Semiconductors, Panasonic, Pulse Electronics, SK hynix, STMicroelectronics, Tatien, TDK-Epcos, Texas Instruments, Vishay Semiconductors and Xilinx.

Note: Product cover images may vary from those shown
2 of 5

FEATURED COMPANIES

  • Analog Devices
  • Fairchild Semiconductor
  • NXP Semiconductors
  • Pulse Electronics
  • STMicroelectronics
  • TDK-Epcos
  • MORE

EXECUTIVE SUMMARY
Active/Passive Component Summary
Important Note:

CHAPTER 1: NOKIA FLEXI MULTIRADIO 10 SYSTEM
Overview of Flexi Multiradio 10

CHAPTER 2: FBBC MECHANICAL ANALYSIS
Mechanical Analysis
FBBC Core Lid
FBBC Core Chassis

CHAPTER 3: FBBC PCB
Area A Analysis
Area B Analysis
Area C Analysis
Area D Analysis

APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS
 
LIST OF TABLES
Table 1: FBBC PCB Top Area A Bill of Materials
Table 2: FBBC PCB Top Area B Bill of Materials
Table 3: FBBC PCB Top Area B Passives Bill of Materials
Table 4: FBBC PCB Bottom Area C Bill of Materials
Table 5: FBBC PCB Bottom Area D Bill of Materials
Table 6: Passive Component Case Size Distribution by System Subsection
Table 7: Identified Passive Component Supplier Distribution by System Subsection
Table 8: Active/Passive Component Distribution by System Subsection
Table 9: Active Semiconductor/Component Vendor Distribution by System Subsection

LIST OF EXHIBITS
Exhibit 1: Flexi Multiradio 10 FSMF Site Solution Example
Exhibit 2: Nokia FSMF with FBBx, FTIF, FPFD Modules
Exhibit 3: Nokia FBBC System Block Diagram
Exhibit 4: FBBC Core Unit, Top View
Exhibit 5: FBBC Core Unit, Bottom View
Exhibit 6: FBBC Core Unit, Right Side View
Exhibit 7: FBBC Core Unit, Left Side View
Exhibit 8: FBBC Core Lid, Internal View
Exhibit 9: FBBC Core Chassis with Lid Removed
Exhibit 10: FBBC Core Chassis with PCB Removed
Exhibit 11: FBBC Core Chassis with EMI Shielding Plate Removed
Exhibit 12: FBBC PCB Top View
Exhibit 13: FBBC PCB Bottom View
Exhibit 14: FBBC PCB Top Area A Component Diagram
Exhibit 15: FBBC PCB Top Area B Component Diagram
Exhibit 16: FBBC PCB Top Area B Component Passives Diagram
Exhibit 17: FBBC PCB Top Area B test Header Component Diagram
Exhibit 18: FBBC PCB Bottom Area C Component Diagram
Exhibit 19: FBBC PCB Bottom Area D Component Diagram
Exhibit 20: FBBC PCB Bottom Area D Test Header Component Diagram
Exhibit 21: Passive Component Case Size Distribution
Exhibit 22: Identified Passive Component Market Share by Vendor
Exhibit 23: Active Semiconductor Component Share
Exhibit 24: High Pin Count IC vs Discretes
Exhibit 25: Active Semiconductor Market Share by Vendor
Exhibit 26: High Pin Count (64+) Active Semiconductor Market Share by Vendor

Note: Product cover images may vary from those shown
3 of 5

Loading
LOADING...

4 of 5
  • Analog Devices
  • Cavium
  • Fairchild Semiconductor
  • Integrated Device Technology
  • Kemet
  • NXP Semiconductors
  • Panasonic
  • Pulse Electronics
  • SK hynix
  • STMicroelectronics
  • TDK-Epcos
  • Tatien
  • Texas Instruments
  • Vishay Semiconductors
  • Xilinx
Note: Product cover images may vary from those shown
5 of 5
Note: Product cover images may vary from those shown
Adroll
adroll