Taiwanese IC Packaging & Testing Industry, 2Q 2017

  • ID: 4316257
  • Report
  • Region: Taiwan
  • 15 pages
  • Market Intelligence & Consulting Institute (MIC)
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FEATURED COMPANIES

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • MORE

The report finds that Taiwanese IC packaging and testing industry still manged to grow year-on-year but declined sequentially in the first quarter of 2017, the traditionally weak season. Shipment value of the industry in the first quarter stood at approximately USD 3.25 billion. Affected by the deferred demand in the second quarter in anticipation of the new iPhone rollout, it is the industry is forecast to start to pick up momentum in the third quarter of 2017.

List of Topics:

  • This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
  • Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
  • The content of this report is based on primary data obtained from interviews, and publicly available information.
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • MORE

Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2015 - 3Q 2017

Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 4Q 2014 - 3Q 2017

Taiwanese IC Packaging Industry Shipment Value , 1Q 2015 - 3Q 2017

Taiwanese IC Testing Industry Shipment Value , 1Q 2015 - 3Q 2017

Taiwanese IC Packaging Industry's Shipment Value Rankings, 1Q 2015 - 1Q 2017

Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2015 - 1Q 2017

Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2015 - 1Q 2017

Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2015 - 1Q 2017

Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 1Q 2015 - 1Q 2017

Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 4Q 2014 - 1Q 2017

Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 4Q 2014 - 1Q 2017

Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 4Q 2014 - 1Q 2017

Exchange Rate, 4Q 2014 - 1Q 2017

Research Scope & Definitions

Note: Product cover images may vary from those shown
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  • ASE
  • Ardentec
  • ChipMOS
  • Chipbond
  • FATC
  • KYEC
  • OSE
  • PTI
  • SPIL
  • Sigurd
  • Walto
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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