Located under the inFO-PoP, the Land-Side Capacitor (LSC) is in flip-chip configuration and supported by an extra layer on the printed circuit (PCB). The LSC has been developed by TSMC using trench capacitors to increase the capacitive area without changing the footprint of the component. This can compete with multilayer ceramic capacitor (MLCC) technology.
In this report, we show the differences from ceramic technology and the innovations of this capacitor, including the trench silicon, oxide deposition and electrical performances. The process is compared to IPDiA technology. Detailed comparison with the LSC in the Exynos 8 and the Snapdragon 820 APs will explain the pros and cons of TSMC’s LSC technology.
This DTC process enables TSMC to offer a very thin capacitor, with high density and the same footprint as a MLCC 0204 component. The result is very cost-effective, as comparisons with ceramic capacitors in this report will show.