The ICM-30630 is the latest version of InvenSense’s 6-axis device (3-axis gyroscope + 3-axis accelerometer), based on the same technology used in smartphones like the Apple iPhone, with a MCU included in the package. Compared with the stand-alone sensor hub, this approach eliminates a package and reduces system-level power.
In competition with Bosch Sensortec and STMicroelectronics, InvenSense provides a low-power, highly programmable device for consumer electronics.
ICM-30360 MEMS sensors are fabricated with a low number of masks and are directly assembled on the ASIC by eutectic bonding. The device is shipped in a 3x3x1mm LGA package whose footprint is the same as the previous generation IMU.
Using knowledge obtained from previous acquisitions, InvenSense was able to design its own MCU, which provides a fully open platform.
This report also features a detailed technology and cost comparison with the leading-edge sensor hub from Bosch Sensortec, highlighting the different choices made by the two designers, and InvenSense’s incredibly smart design.
Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation
Comparison with Capacitive Fingerprint Sensor