CSP LEDs are a new market, representing 0.8% of the LED market today, but which will be six times larger in 2021 according to Yole Développement. This component gives Samsung a position in the CSP LED sector.
Samsung has developed CSP LEDs to minimize component area, reducing the footprint on the circuit board by up to 70%. Moreover, without substrates, these LEDs have lower thermal resistance.
Bringing together flip chip LEDs and silicone molding provides a wide beam angle in a very thin device.
The simplicity of the packaging, without substrate and wire bonding, explains the high reliability of the component and the very low cost of the packaging.
The LED die is manufactured with mature technology but some new advances have been observed that reduce the manufacturing cost. The noble metals were replaced by stacking standard metals and a dicing technique has been newly adapted to LEDs in order to increase the number of dies per wafer.
The report presents a deep technology analysis of the packaging and the components, with images of the epitaxial layer stack and electrode structure.