Next Biometrics NB-1010-U Fingerprint Sensor: Structure and Cost Analysis

  • ID: 4316347
  • Report
  • Region: Global
  • 105 pages
  • System Plus Consulting
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This reverse costing study provides insight into technological data, manufacturing cost, and selling price of the NEXT Biometrics NB-1010-U and NB-2020-U Fingerprint Sensor Assembly.

The same fingerprint sensor die was found in two different products: a DELL Laptop and the NEXT Biometrics Oyster, an access-control peripheral. Supported by PCB, the fingerprint sensor’s dimensions are 25.2 x 19.0 mm, it is driven by a NEXT Biometrics ASIC, and it is protected by a metal cover. The sensor has a resolution of 46,080 pixels, with a pixel density of 385ppi, and it uses the NEXT Active Thermal™ sensing principle to take an image of the fingerprint.

The sensor die is manufactured on glass with LTPS technology and uses a very specific coating to ensure the device’s functionality. The sensor is connected by wire bonding to the rigid PCB. The assembly, including a rigid and a flex PCB to rigidify the structure, is a very particular process designed by NEXT Biometrics.

This report includes comparisons with the latest Huawei, Samsung, and Apple fingerprint buttons.
Note: Product cover images may vary from those shown
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Detailed Photos

Precise Measurements

Material Analysis

Manufacturing Process Flow

Supply Chain Evaluation

Manufacturing Cost Analysis

Selling Price Estimation

Comparison with Capacitive Fingerprint Sensor
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown