The same fingerprint sensor die was found in two different products: a DELL Laptop and the NEXT Biometrics Oyster, an access-control peripheral. Supported by PCB, the fingerprint sensor’s dimensions are 25.2 x 19.0 mm, it is driven by a NEXT Biometrics ASIC, and it is protected by a metal cover. The sensor has a resolution of 46,080 pixels, with a pixel density of 385ppi, and it uses the NEXT Active Thermal™ sensing principle to take an image of the fingerprint.
The sensor die is manufactured on glass with LTPS technology and uses a very specific coating to ensure the device’s functionality. The sensor is connected by wire bonding to the rigid PCB. The assembly, including a rigid and a flex PCB to rigidify the structure, is a very particular process designed by NEXT Biometrics.
This report includes comparisons with the latest Huawei, Samsung, and Apple fingerprint buttons.
Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation
Comparison with Capacitive Fingerprint Sensor