This complete, low-power solution comes with computing, motion sensing, Bluetooth low energy, battery charging, and pattern matching capabilities for optimal sensor data analysis, enabling quick and easy identification of actions and motions. The module is packaged in a tiny form factor and runs a new software platform created especially for the Intel Curie module.
Located on the main board, the system uses non-conventional packaging developed by Intel. The main microcontroller is located at the bottom of the package, with features like Bluetooth and sensors placed on top.
Powered by the Intel Quark™ SE SoC embedded in the 10-layer build-up coreless PCB, the Intel Curie module is extremely power-efficient - ideal for “always-on” applications like health and wellness, sports activities, etc. Its other features are insured by 13 active dies, plus passives components embedded in the 11x8mm package’s top molding. By integrating several dies and offering several functions, Intel® has realized the smallest low-power complete solution.
This report includes a complete analysis of the SiP, featuring die observation, package cross-section, and a function explanation, analyzing all data related to the module’s cost efficiency.
Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation
Comparison with Capacitive Fingerprint Sensor