Unlike its main competitors, Bosch Sensortec and STMicroelectronics, mCube provides monolithic sensor integration for consumer electronics - the only company to do this for accelerometers.
mCube’s approach fabricates MEMS sensors directly on top of IC electronics, connected using Through-Silicon Vias (TSVs), in a standard CMOS fabrication facility. The MC3635 is shipped in 1.6×1.6mm LGA packaging, which is a 36% footprint reduction compared to traditional 2x2mm LGA packages. Among the third generation of mCube accelerometers, the MC3635’s package is smaller than the MC3400 series, but the die size is slightly larger due to the ultra-low power capability.
The MC3635 is targeted at the ultra-low power and the high-resolution marketplace for applications requiring up to 14-bit resolution.
The report includes a complete overview of mCube’s MEMS accelerometer evolution since its second generation. It also features a detailed technology and cost comparison with leading edge accelerometers from Bosch Sensortec, STMicroelectronics and Analog Devices.
Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation
Comparison with Capacitive Fingerprint Sensor