Located on the smartphone’s main board, the audio codec chip’s presence in the Samsung Galaxy S7 and S7 Edge depends on the smartphone version. The international version, featuring an Exynos chipset, integrates the audio codec chip from Cirrus Logic. The U.S. version, featuring the Snapdragon 820 chipset, integrates the audio codec from Qualcomm.
The Qualcomm WDC9335 is wafer-level packaged with fan-out technology. This is still relatively rare in the smartphone market but is expected to spread quickly. The FOWLP technology used is the eWLB, licensed by Intel/Infineon to several OSATs including ASE Group, Nanium, and STATS ChipPAC.
Thanks to this FOWLP process, Qualcomm is able to propose a very small die independent of the area required by the I/O pads. The result is a very cost-effective component that can compete with a standard fan-in WLP technology.
This report includes a comparison with the audio codec solution from Cirrus Logic for the international version, which uses a standard fan-in WLP technology. It also features comparisons with FOWLP technologies like RCP from NXP/nepes, and eWLB 1st-generation from Infineon.
Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation
Comparison with Capacitive Fingerprint Sensor