The system integrates two electronic boards, including NXP Semiconductor and STMicroelectronics microcontrollers and Bosch power management ICs. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
Infineon 77GHz SiGe Monolithic Microwave Integrated Circuits (MMICs) are used as high-frequency transmitter and receiver. The two RF dies are packaged in the latest version of the eWLB Fan-Out Wafer Level Package developed and manufactured by Infineon.
Based on a complete teardown analysis of the Bosch radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor as well as a comparison with Continental’s ARS4-A and Bosch’s MRR1Plus modules.
A complete physical analysis and manufacturing cost estimation of the Infineon MMICs is available in a separate report.