The transceiver chipset is scalable for multi-channel operation enabling a single radar platform with electronic beam steering and wide field-of-view for auto safety, communications infrastructure, and industrial systems.
In 2015, Continental announced that its current generation ARS 400 Long Range Radar Sensor incorporates Freescale’s MR2001 77 GHz multichannel radar transceiver and MPC577xK microcontroller with integrated radar signal ADC’s and a dedicated radar DSP.
The entire chipset uses the Fan-Out Wafer Level Package developed by Freescale called RCP. This package has no wire bonding to reduce inductance and a specific design to increase the heat management.
Due to Freescale innovation, the RCP package is robust enough to be installed in front automotive module.
The radar dies are manufactured with the newest and most advanced process from NXP/Freescale merging RF-Transistor SiGe:C xHBT and 0.18 µm CMOS transistor.
The report includes a complete analysis of the entire MR2001 chipset (MR2001RVK Receiver, MR2001TVK transmitter and MR2001VVK VCO components).
The report also features a full comparison with the Infineon 77 GHz radar chipset, included in the Bosch MRR1Plus. In addition, a complete comparison between Infineon’s Fan-Out eWLB and NXP/Freescale’s Fan-Out RCP packaging giving both technical choice and the result on the process flow.
SiGe:C xHBT technology & Fan-Out RCP Wafer-Level Packaging.
Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation
Comparison with Capacitive Fingerprint Sensor