Global Wafer Dicing Saws Market 2017-2021 - Product Image

Global Wafer Dicing Saws Market 2017-2021

  • ID: 4328282
  • Report
  • Region: Global
  • 86 pages
  • TechNavio
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FEATURED COMPANIES

  • DISCO Corporation
  • Dynatex International
  • Loadpoint
  • Micross Components
  • TOKYO SEIMITSU
  • MORE
About Wafer Dicing Saws

A dicing saw is a saw that is used to dice, groove, or cut semiconductor wafers by using a high-speed spindle that has been fitted with a diamond blade. A dicing saw is a part of a dicing machine, which cuts these wafers into individual chips. Some of the materials that can be diced using this machine are silicon, silicon carbide, gallium nitride, gallium arsenide, ceramic, sapphire, and glass. Dicing blades of varying thickness are used to saw the wafers based on the material being sawed. Dicing equipment can be categorized into three types, namely sawing equipment, scribing equipment, and sawing accessories. Sawing accessories consist of breaking, mounting, and surface grinding.

The analysts forecast the global wafer dicing saws market to grow at a CAGR of 6.35% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global wafer dicing saws market for 2017-2021. To calculate the market size, the report considers the revenues from major wafer dicing saws vendors..

The market is divided into the following segments based on geography:
  • Americas
  • APAC
  • EMEA
The report, Global Wafer Dicing Saws Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • DISCO Corporation
  • TOKYO SEIMITSU
  • Advanced Dicing Technology
  • Dynatex International
  • Loadpoint
  • Micross Components
Market drivers
  • Growing demand for IoT
  • For a full, detailed list, view the full report
Market challenges
  • Volatile nature of the semiconductor industry
  • For a full, detailed list, view the full report
Market trends
  • Growth of AI
  • For a full, detailed list, view the full report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?
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Note: Product cover images may vary from those shown
2 of 5

FEATURED COMPANIES

  • DISCO Corporation
  • Dynatex International
  • Loadpoint
  • Micross Components
  • TOKYO SEIMITSU
  • MORE
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Market outline
  • Wafer dicing saws
PART 05: Market landscape
  • Market overview
  • Market size and forecast
PART 06: Five forces analysis
  • Five forces analysis
PART 07: Market segmentation by end-user
  • Pureplay foundries
  • IDMs
  • PART 08: Market segmentation by packaging technology
  • BGA
  • QFN
PART 09: Geographical segmentation
  • Market overview
  • APAC
  • Americas
  • EMEA
PART 10: Key leading countries
  • Taiwan
  • China
  • Decision framework
PART 11: Drivers and challenges
  • Market drivers
  • Market challenges
PART 12: Market trends
  • Growth of AI
  • Increase in wafer size
  • Introduction of ultrasonic blade dicing
  • Growth of smart cities
PART 13: Vendor landscape
  • Competitive scenario
PART 14: Key vendor analysis
  • DISCO Corporation
  • TOKYO SEIMITSU
  • Advanced Dicing Technology
  • Dynatex International
  • Loadpoint
  • Micross Components
PART 15: Appendix
  • List of abbreviations
List of Exhibits
Exhibit 01: Types of dicing equipment
Exhibit 02: Global wafer dicing saws market: Overview
Exhibit 03: Global wafer dicing saws market 2016-2021 ($ millions)
Exhibit 04: Five forces analysis
Exhibit 05: Global wafer dicing saws market by end user in 2016 (% share)
Exhibit 06: Global wafer dicing saws market by end user 2016-2021 ($ millions)
Exhibit 07: Global wafer dicing saws market by pureplay foundries 2016-2021 ($ millions)
Exhibit 08: Global wafer dicing saws market by IDMs ($ millions)
Exhibit 09: Global wafer dicing saws market by technology in 2016 ($ millions)
Exhibit 10: Global wafer dicing saws market by technology 2016-2021 ($ millions)
Exhibit 11: Global wafer dicing saws market by BGA 2016-2021 ($ millions)
Exhibit 12: Global wafer dicing saws by QFN 2016-2021 ($ millions)
Exhibit 13: Global wafer dicing saws market: Segmentation by geography in 2016 (% share)
Exhibit 14: Global wafer dicing saws market by geography 2016-2021 ($ millions)
Exhibit 15: Wafer dicing saws market in APAC 2016-2021 ($ millions)
Exhibit 16: Major semiconductor foundries located in the APAC (% share)
Exhibit 17: Wafer dicing saws market in Americas 2016-2021 ($ millions)
Exhibit 18: Wafer dicing saws market in EMEA 2016-2021 ($ millions)
Exhibit 19: Key leading countries (% share)
Exhibit 20: Basic criteria for selecting a dicing blade
Exhibit 21: Die strength comparison between mechanical blade dicing saw and laser dicing saw (Mpa)
Exhibit 22: Timeline for increasing wafer size 1975-2017
Exhibit 23: Partner cities selected in EU and China under PDSF initiative
Exhibit 24: DISCO Corporation: Recent developments
Exhibit 25: TOKYO SEIMITSU: Recent developments
Exhibit 26: Micross Components: Recent developments
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FEATURED COMPANIES

  • DISCO Corporation
  • Dynatex International
  • Loadpoint
  • Micross Components
  • TOKYO SEIMITSU
  • MORE
New Report Released: - Global Wafer Dicing Saws Market 2017-2021

The author of the report recognizes the following companies as the key players in the global wafer dicing saws market: DISCO Corporation, TOKYO SEIMITSU, Advanced Dicing Technology, Dynatex International, Loadpoint, and Micross Components.

Commenting on the report, an analyst from the research team said: “The latest trend gaining momentum in the market is Growth of AI. AI is a technology that allows machines to perform tasks that require human intelligence. Machines that use AI mainly include computer systems. In 2016, many industry participants such as Amazon, Baidu, Google Facebook, IBM, NVIDIA, Tesla Motors, and Microsoft made investments in the field of AI. As of 2017, Google has acquired 16 startups related to AI. In 2017, Facebook announced plans to develop the best AI lab in the world. The company has already developed a personal assistant, dubbed M, which is powered by AI. In 2016, Google announced an investment of $4.5 million over three years to the Montreal Institute for Learning Algorithms, Canada to facilitate research on AI.”

According to the report, one of the major drivers for this market is Growing demand for IoT. IoT is an ecosystem wherein many devices are connected to the Internet. These devices include mobile phones, tablets, and other consumer electronic devices. The business possibilities are numerous with the advent of IoT. These devices are assigned an IP address; they can collect and receive data, eliminating the need for any manual operation of the device.

Further, the report states that one of the major factors hindering the growth of this market is Volatile nature of the semiconductor industry. The demand for wafer dicing saws depends on the overall demand for semiconductors. The current and anticipated demand for the semiconductor industry and products that use semiconductors is highly volatile due to a number of reasons. Products that use semiconductor include mobile devices, computers, consumer electronics, automotive goods, and telecommunication equipment. The fluctuating demand for these goods will impact the overall semiconductor market, thereby impacting the semiconductor equipment market. Significant market downturns can adversely affect such extended businesses.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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  • DISCO Corporation
  • TOKYO SEIMITSU
  • Advanced Dicing Technology
  • Dynatex International
  • Loadpoint
  • Micross Components
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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