Embedded Die Packaging Technology Market by Platform: Global Opportunity Analysis and Industry Forecast, 2017-2023

  • ID: 4333248
  • Report
  • Region: Global
  • 168 pages
  • Allied Analytics LLP
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FEATURED COMPANIES

  • Amkor Technology
  • Ase Group
  • At & S
  • Fujikura
  • General Electric
  • Infineon
  • MORE
The global embedded die packaging technology was valued at $26 million in 2016, and is projected to reach $68 million by 2023, growing at a CAGR of 14.8% from 2017 to 2023. Embedded die packaging technology is a native 3D-compatible packaging solution, offering nearly 70% size reduction in system in package (SiP) solution. The advantages of this technology include miniaturization, improved electrical & thermal performance, heterogeneous integration, prospect for reduction in cost, and efficient logistics for OEM. In addition, it offers flexible system integration, fast turnaround for custom design, high robustness, and enhanced reliability of the package.

Embedded die packaging technology was anticipated to grow rapidly with the development in smartphones; however, this technology showed limited success in smartphones due to competition from faster developing Flip Chip and especially WLP platforms. However, in automotive, healthcare, aerospace, and industrial sectors, numerous products utilizing embedded die packaging technology are expected to arrive in the market during the next four to five years.

The factors that drive the market are impending need for circuit miniaturization in microelectronic devices, increase in number of portable electronic devices, rise in application in healthcare and automotive devices, and advantages over other advanced packaging technologies. However, requirement of high cost of these chips restrains the market growth restrains the market growth. Moreover, rapid adoption of IoT globally is expected to present new opportunities in the market.

The global embedded die packaging technology market is segmented based on platform, industry vertical, and geography. Based on platform, it is classified into embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board. Based on industry vertical, it is categorized into consumer electronics, IT & telecommunication, automotive, healthcare, and others. Geographically, it is analyzed across North America (U.S., Mexico, and Canada), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

The major companies profiled in the report include Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer.

KEY BENEFITS FOR STAKEHOLDERS

The study provides an in-depth analysis of the global embedded die packaging technology market to elucidate the prominent investment pockets from 2016 to 2023.
Current trends and future estimations are outlined to determine the overall market scenario.
The report provides information about the key drivers, restraints, and opportunities with a detailed impact analysis.

KEY MARKET SEGMENTS

BY PLATFORM

Embedded Die in IC Package Substrate
Embedded Die in Rigid Board
Embedded Die in Flexible Board

BY INDUSTRY VERTICAL

Consumer Electronics
IT & Telecommunication
Automotive
Healthcare
Others

BY GEOGRAPHY

North America
U.S.
Mexico
Canada
Europe
UK
Germany
France
Rest of Europe
Asia-Pacific
China
Japan
Taiwan
South Korea
Rest of Asia-Pacific
LAMEA
Latin America
Middle East
Africa
Key players

Amkor Technology
Taiwan Semiconductor Manufacturing Company
ASE Group
AT & S
General Electric
Infineon
Fujikura
MicroSemi
TDK-Epcos
Schweizer
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology
  • Ase Group
  • At & S
  • Fujikura
  • General Electric
  • Infineon
  • MORE
CHAPTER 1 INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools and models

CHAPTER 2 EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3 MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top winning strategies
3.2.3. Top investment pockets

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Porters five forces analysis

3.4. MARKET DYNAMICS

3.4.1. Drivers
3.4.2. Restraint
3.4.3. Opportunity

CHAPTER 4 EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM TYPE

4.1. OVERVIEW

4.1.1. Market size and forecast

4.2. EMBEDDED DIE IN IC PACKAGE SUBSTRATE

4.2.1. Introduction
4.2.2. Key market trends, growth factors, and opportunities
4.2.3. Market size and forecast

4.3. EMBEDDED DIE IN RIGID BOARD

4.3.1. Introduction
4.3.2. Key market trends, growth factors, and opportunities
4.3.3. Market size and forecast

4.4. EMBEDDED DIE IN FLEXIBLE BOARD

4.4.1. Introduction
4.4.2. Key market trends, growth factors, and opportunities
4.4.3. Market size and forecast

CHAPTER 5 EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL

5.1. OVERVIEW

5.1.1. Market size and forecast

5.2. CONSUMER ELECTRONICS

5.2.1. Introduction
5.2.2. Key market trends, growth factors, and opportunities
5.2.3. Market size and forecast

5.3. IT & TELECOMMUNICATION

5.3.1. Introduction
5.3.2. Key market trends, growth factors, and opportunities
5.3.3. Market size and forecast

5.4. AUTOMOTIVE

5.4.1. Introduction
5.4.2. Key market trends, growth factors, and opportunities
5.4.3. Market size and forecast

5.5. HEALTHCARE

5.5.1. Introduction
5.5.2. Key market trends, growth factors, and opportunities
5.5.3. Market size and forecast

5.6. OTHERS

5.6.1. Introduction
5.6.2. Key market trends, growth factors, and opportunities
5.6.3. Market size and forecast

CHAPTER 6 EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY GEOGRAPHY

6.1. OVERVIEW

6.1.1. Market size and forecast

6.2. NORTH AMERICA

6.2.1. Introduction
6.2.2. Key market trends, growth factors, and opportunities
6.2.3. Market size and forecast
6.2.4. U.S.

6.2.4.1. Market size and forecast

6.2.5. Canada

6.2.5.1. Market size and forecast

6.2.6. Mexico

6.2.6.1. Market size and forecast

6.3. EUROPE

6.3.1. Introduction
6.3.2. Key market trends, growth factors, and opportunities
6.3.3. Market size and forecast
6.3.4. UK

6.3.4.1. Market size and forecast

6.3.5. Germany

6.3.5.1. Market size and forecast

6.3.6. France

6.3.6.1. Market size and forecast

6.3.7. Rest of Europe

6.3.7.1. Market size and forecast

6.4. ASIA-PACIFIC

6.4.1. Introduction
6.4.2. Key market trends, growth factors and opportunities
6.4.3. Market size and forecast
6.4.4. China

6.4.4.1. Market size and forecast

6.4.5. Japan

6.4.5.1. Market size and forecast

6.4.6. Taiwan

6.4.6.1. Market size and forecast

6.4.7. South Korea

6.4.7.1. Market size and forecast

6.4.8. Rest of Asia-Pacific

6.4.8.1. Market size and forecast

6.5. LAMEA

6.5.1. Introduction
6.5.2. Key market trends, growth factors, and opportunities
6.5.3. Market size and forecast
6.5.4. Latin America

6.5.4.1. Market size and forecast

6.5.5. Middle East

6.5.5.1. Market size and forecast

6.5.6. Africa

6.5.6.1. Market size and forecast

CHAPTER 7 RELATED INDUSTRY INSIGHTS

7.1. WORLD 3D SEMICONDUCTOR PACKAGING MARKET

7.1.1. Executive Summary

7.2. WORLD FLIP CHIP MARKET

7.2.1. Executive Summary

CHAPTER 8 COMPANY PROFILES

8.1. AMKOR TECHNOLOGY

8.1.1. Company overview
8.1.2. Operating business segments
8.1.3. Business performance
8.1.4. Key strategic moves and developments

8.2. ASE GROUP

8.2.1. Company overview
8.2.2. Operating business segments
8.2.3. Business performance
8.2.4. Key strategic moves and developments

8.3. AT & S

8.3.1. Company overview
8.3.2. Operating business segments
8.3.3. Business performance
8.3.4. Key strategic moves and developments

8.4. FUJIKURA LTD.

8.4.1. Company overview
8.4.2. Operating business segments
8.4.3. Business performance
8.4.4. Key strategic moves and developments

8.5. GENERAL ELECTRIC

8.5.1. Company overview
8.5.2. Operating business segments
8.5.3. Business performance
8.5.4. Key strategic moves and developments

8.6. INFINEON TECHNOLOGIES AS

8.6.1. Company overview
8.6.2. Operating business segments
8.6.3. Business performance
8.6.4. Key strategic moves and developments

8.7. MICROSEMI CORPORATION

8.7.1. Company overview
8.7.2. Operating business segments
8.7.3. Business performance
8.7.4. Key strategic moves and developments

8.8. SCHWEIZER ELECTRONICS AG

8.8.1. Company overview
8.8.2. Operating business segments
8.8.3. Business performance
8.8.4. Key strategic moves and developments

8.9. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

8.9.1. Company overview
8.9.2. Operating business segments
8.9.3. Business performance
8.9.4. Key strategic moves and developments

8.10. TDK CORPORATION

8.10.1. Company overview
8.10.2. Operating business segments
8.10.3. Business performance
8.10.4. Key strategic moves and developments
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology
  • Ase Group
  • At & S
  • Fujikura
  • General Electric
  • Infineon
  • MORE
According to a new report titled, "Embedded Die Packaging Technology Market by Platform and Industry Vertical: Global Opportunity Analysis and Industry Forecast, 2017-2023," the global embedded die packaging technology market was valued at $26 million in 2016, and is projected to reach $68 million by 2023, growing at a CAGR of 14.8% from 2017 to 2023. The embedded die in IC package substrate segment contributed nearly 47% share to the global market in 2016.

Increase in number of portable electronic devices, impending need for circuit miniaturization in microelectronic devices, rise in application for healthcare and automotive devices, and advantages over other advanced packaging technologies are some of the factors that drive market. However, high cost of these chips restrains the market growth. Moreover, growth in trend of Internet of Things (IoT) globally is expected to provide new opportunities for the players operating in the market.
In 2016, embedded die in IC package substrate is expected to maintain its dominant position throughout the analysis period, owing to its wide-scale adoption for DCDC converters and camera modules used in smartphones.
Moreover, Asia-Pacific is the major revenue contributor, owing to the market contribution of countries, such as China, Japan, and Taiwan, which claim most of the share of the overall semiconductor market globally. High population base and rise in demand for portable electronics industry boost the growth of the market in Asia-Pacific.
Consumer electronics and IT & Telecommunication segments collectively dominated with over 60% share in 2016. The use of embedded die packaging technology in consumer electronics is attributed to the rapid growth of wireless portable electronics devices in smartphones and other mobile devices.

Key Findings of the Embedded Die Packaging Technology Market:
In terms of revenue, consumer electronics and IT & telecommunication collectively contributed the maximum market share in 2016, and are expected to maintain their dominance throughout the forecast period.
The embedded die in flexible board segment is expected to grow at the highest CAGR during the forecast period.
In 2016, the embedded die in IC package substrate platform held nearly half of the market share, which was the highest among all the platform types.
In 2016, Asia-Pacific accounted for over 50% share globally, and is expected to dominate the market in the near future.
In 2016, in terms of revenue, Asia-Pacific accounted for over half of the market, and is expected to maintain its dominant position, owing to the presence of the developing countries, high growth in IT & telecommunication sector, well-established semiconductor market, government initiatives, and rise in trend of IoT.
The major companies profiled in the report include Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer.
Note: Product cover images may vary from those shown
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  • Amkor Technology
  • Taiwan Semiconductor Manufacturing Company
  • Ase Group
  • At & S
  • General Electric
  • Infineon
  • Fujikura
  • Microsemi
  • Tdk-Epcos
  • Schweizer
Note: Product cover images may vary from those shown
6 of 5
Note: Product cover images may vary from those shown
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