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Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP: Comparison and Cost Analysis

  • ID: 4335307
  • Report
  • 130 pages
  • System Plus Consulting
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This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Bosch BME680 Environmental Sensor.

Bosch’s BME680 environmental sensor is the evolution of its BME280 environmental sensor, adding gas sensor functionality. Assembled in an 8-pin, metal-lid 3.0mm x 3.0mm x 0.95mm land grid array package, this System-in-Package integrates a digital humidity, pressure, temperature sensor and a separate gas sensor. It is equipped with only two MEMS dies and an amplification application-specific integrated circuit, the same number of dies as the previous BME280 device, but with an additional feature. Bosch has integrated humidity, pressure and temperature sensors on one single MEMS die, using a new technology for the humidity sensor. The BME680 can detect a broad range of gases, including volatile organic compounds, using a smaller gas sensor die compared to competitors like ams.

This ‘combo’ sensor shows Bosch's control of sensor integration, with technologies 100% internally developed and manufactured. The MEMS pressure sensor is manufactured with Bosch’s Advanced Porous Silicon Membrane process, integrating the flexible pressure membrane and temperature diodes on a silicon substrate with the humidity sensor.

The device is a real System-in-Package, with a combination of four sensors in one small package, mixing wire bonding and flip-chip connections. An exhaustive package analysis is performed in the report.

The report includes deep technological and cost analyses of the BME680, and a technical comparison with Bosch’s environmental sensors, the BMP280 and BME280 devices. Also, it features a comparison with the ams/Cambridge CMOS Sensors gas sensor.
Note: Product cover images may vary from those shown
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1. Overview/Introduction

2. Company Profile and Supply Chain
Sony Xperia™ XZs Teardown
Physical Analysis
Physical Analysis Methodology
Camera Module Analysis
Module view and dimensions
Module opening: AF driver including hall sensor, lenses, filter
Module cross-section: lenses, filter
CIS Die analysis
CIS die view and dimensions: pixels, pads
CIS deprocessing
CIS die cross-section: TSVs, pixels
Die process

3. Physical Analysis Comparison
Module: Samsung Galaxy S7, Apple iPhone 7 Plus, Huawei P9
CIS die area: Samsung Galaxy S7 (IMX260), Apple iPhone 7 Plus, Huawei P9 (IMX286)
Pixels, TSVs, PDAF technology: Samsung Galaxy S7 (IMX260), Apple iPhone 7 Plus, Huawei P9 (IMX286)
Manufacturing Process Flow
Wafer Fabrication Unit: Pixel Array, Logic Circuit, DRAM Circuit
CIS, BSI and TSV Process Flow

4. Cost Analysis
Overview of the Cost Analysis
Supply Chain Description
Yield Hypotheses
Wafer Cost Analyses: Pixel Array with Microlenses, Color Filters, and Spacer, Logic Circuit, DRAM Circuit
Front-end cost
BSI & TSVs Cost Analysis
BSI & TSVs wafer front-end cost
BSI & TSVs cost by process step
CIS Die Cost

5. Estimated Price Analysis
Note: Product cover images may vary from those shown
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