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Melexis Time of Flight Imager for Automotive Applications: Comparison and Cost Analysis

  • ID: 4335308
  • Report
  • Region: Global
  • 80 pages
  • System Plus Consulting
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Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition. Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For automotive applications, Sony/Softkinetic has licensed its technology to Melexis, which has worked on the pixel design to provide a ToF imager for gesture recognition.
Note: Product cover images may vary from those shown
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1. Overview/Introduction
Melexis Company Profile and Time of Flight Technology
Physical Analysis
Physical analysis methodology

2. View and dimensions
Package opening
Package cross-section: optical filter, RDL, bump
Image Sensor Die
View, dimensions and marking
Die overview: active area, CPAD technology
Die delayering, main block ID and process
Cross-section: metal layers, pixel
Process characteristics
Physical Comparison with Infineon’s ToF Image Sensor, STMicroelectronics’ SPAD technology and Texas Instruments’ Industrial ToF Image Sensor
Package, Pixels, Filters
Manufacturing Process Flow

3. Overview
CIS Front-End Process
CIS Wafer Fabrication Unit
Packaging Process Flow
Final Assembly Unit

4. Cost Analysis
Cost Analysis Overview
The Main Steps Used in the Economic Analysis
Yield Hypotheses
CIS Die Cost
Front-end cost
Back-end: tests and dicing
Wafer and die cost
Packaging cost
Packaging cost by process step
Component cost

5. Estimated Price Analysis
Note: Product cover images may vary from those shown
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