Bosch BME680 Environmental Sensor with Integrated Gas Sensor: Comparison and Cost Analysis

  • ID: 4335313
  • Report
  • 152 pages
  • System Plus Consulting
1 of 3
The market for environmental MEMS is set to grow at a Compound Annual Growth Rate of 16% between 2017 and 2022. In 2016, it was worth $65 million and is due to reach $148 million in 2022, according to Yole Développement.

Bosch’s BME680 environmental sensor is the evolution of its BME280 environmental sensor, adding gas sensor functionality. Assembled in an 8-pin, metal-lid 3.0mm x 3.0mm x 0.95mm land grid array package, this System-in-Package (SiP) integrates a digital humidity, pressure, temperature sensor and a separate gas sensor. It is equipped with only two MEMS dies and an amplification application-specific integrated circuit, the same number of dies as the previous BME280 device, but with an additional feature. Bosch has integrated humidity, pressure and temperature sensors on one single MEMS die, using a new technology for the humidity sensor. The BME680 can detect a broad range of gases, including volatile organic compounds, using a smaller gas sensor die compared to competitors like ams.

This ‘combo’ sensor shows Bosch’s control of sensor integration, with technologies 100% internally developed and manufactured. The MEMS pressure sensor is manufactured with Bosch’s Advanced Porous Silicon Membrane process, integrating the flexible pressure membrane and temperature diodes on a silicon substrate with the humidity sensor.

The device is a real SiP, with a combination of four sensors in one small package, mixing wire bonding and flip-chip connections. An exhaustive package analysis is performed in the report.

The report includes deep technological and cost analyses of the BME680, and a technical comparison with Bosch’s environmental sensors, the BMP280 and BME280 devices. Also, it features a comparison with the ams/Cambridge CMOS Sensors gas sensor.

Samsung’s iris recognition system is composed of two elements: an infrared camera module and an infrared LED. Compared to fingerprint sensors, iris scanners are cost-effective solutions, due to the reuse of standard CMOS image sensor (CIS) and LED components. Furthermore, Samsung manufactures its own CIS.

The resolution of the Samsung camera module sensor is double the Fujitsu solution. This sensor is combined with the front camera module in one 11.2mm x 12.5mm package.

OSRAM manufactures the scanner’s infrared LED, as it does for the iris recognition system from Fujitsu. However, Samsung’s scanner uses the latest infrared LED from OSRAM, which has better specifications.

This report describes the supply chain of the full system including the IR camera module, CIS and infrared LED. It estimates the manufacturing cost and price for the infrared camera and the infrared LED. It also features a comparison with the Fujitsu iris scanner.
READ MORE
Note: Product cover images may vary from those shown
2 of 3
1. Overview/Introduction

2. Company Profile
Bosch Sensortec
BME680 Characteristics
Physical Analysis
Package
Package views, dimensions and pin out
Package opening
Package cross-section
ASIC
View, dimensions and marking
Delayering
Main blocks identification
Process identification
Cross-section
Process characteristics
MEMS Humidity and Pressure
View, dimensions and marking, sensing area details, cross-section, process characteristics
MEMS Gas Sensor
View, dimensions and marking, sensing area details, cross-section, process characteristics
Bosch Environmental Sensor Evolution and Comparison
Manufacturing Process Flow
Overview
ASIC Process Flow/Fab Unit
MEMS Humidity and Pressure Process Flow/Fab Unit
MEMS Gas Sensor Process Flow/Fab Unit
Packaging Process Flow and Assembly Unit

3. Cost Analysis
Summary of the Cost Analysis
Main Steps of the Economic Analysis
Yield Hypotheses
ASIC
ASIC front-end cost and die cost
MEMS Pressure and Humidity
MEMS front-end cost, front-end cost per process step, probe test and dicing cost, wafer and die cost
MEMS Gas Sensor
MEMS front-end cost, front-end cost per process step, probe test and dicing cost, wafer and die cost
Packaging Cost
Back-end: final test and calibration cost
BME680 component cost

4. Estimated Price Analysis
Manufacturer Financial Ratios
Estimated Selling Price
Note: Product cover images may vary from those shown
3 of 3

Loading
LOADING...

4 of 3
Note: Product cover images may vary from those shown
Adroll
adroll