Global Fully Depleted Silicon-on-insulator (FD-SOI) Technology Market 2017-2021

  • ID: 4372358
  • Report
  • Region: Global
  • 83 pages
  • TechNavio
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FEATURED COMPANIES

  • Dream Chip Technologies
  • GLOBALFOUNDRIES
  • INVECAS
  • SAMSUNG
  • SOITEC
  • STMicroelectronics
  • MORE
About Fully Depleted Silicon-on-insulator (FD-SOI) Technology

Fully depleted silicon-on-insulator (FD-SOI) is a planar process technology that provides an ideal platform for the development of planner transistor architecture on a SOI substrate. FD-SOI helps in delivering low power, improved performance, and reduced silicon geometries. The FD-SOI technology is based on two innovations: an ultra-thin insulator layer known as buried oxide, which is placed at the top of the silicon base, and a thin layer of silicon, which is used for creating a transistor channel. Owing to this thin layer, the doping of the channel is removed. This means that the impurity atoms that lie in the semiconductor are completely removed, making it fully depleted.

The combination of these two innovations is called the ultra-thin body and buried oxide (UTBB)-FD-SOI technology. The FD-SOI structure has evolved from the bulk CMOS process. The FD-SOI technology helps in providing a balance between cost, digital performance, power consumption, and mixed-signal compatibility.

The analysts forecast the global fully depleted silicon-on-insulator (FD-SOI) technology market to grow at a CAGR of 43.37% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global fully depleted silicon-on-insulator (FD-SOI) technology market for 2017-2021. To calculate the market size, the report considers the revenue generated from FD-SOI technology.

The market is divided into the following segments based on geography:
  • Americas
  • APAC
  • EMEA
The report, Global Fully Depleted Silicon-on-insulator (FD-SOI) Technology Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • GLOBALFOUNDRIES
  • SAMSUNG
  • STMicroelectronics
  • SOITEC
Other prominent vendors
  • Dream Chip Technologies
  • INVECAS
  • VERISILICON
Market drivers
  • Smaller die sizes
  • For a full, detailed list, view the full report
Market challenges
  • Challenges associated with 10-nm FD-SOI design
  • For a full, detailed list, view the full report
Market trends
  • Emergence of IoT
  • For a full, detailed list, view the full report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Dream Chip Technologies
  • GLOBALFOUNDRIES
  • INVECAS
  • SAMSUNG
  • SOITEC
  • STMicroelectronics
  • MORE
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Market outline
  • Use of FD-SOI in chips
  • Advantages of FD-SOI
  • Comparison between FinFET and FD-SOI
PART 05: Market landscape
  • Market overview
  • Market size and forecast
  • Five forces analysis
PART 06: Market segmentation by node
  • Market overview
  • Global FD-SOI technology market by 28-nm FD-SOI technology
  • Global FD-SOI technology market by 22-nm FD-SOI technology
  • Global FD-SOI technology market by 14-nm FD-SOI technology
  • Global FD-SOI technology market by 12-nm/10-nm FD-SOI technology
PART 07: Geographical segmentation
  • FD-SOI technology market in Americas
  • FD-SOI technology market in APAC
  • FD-SOI technology market in EMEA
PART 08: Key leading countries

PART 09: Decision framework

PART 10: Drivers and challenges
  • Market drivers
  • Market challenges
PART 11: Market trends
  • Emergence of IoT
  • Decrease in lithography wavelength
  • Growth of AR and VR technologies
PART 12: Vendor landscape
  • Competitive scenario
PART 13: Key vendor analysis
  • GLOBALFOUNDRIES
  • SAMSUNG
  • STMicroelectronics
  • SOITEC
  • Other prominent vendors
PART 14: Appendix
  • List of abbreviations
List of Exhibits
Exhibit 01: Advantages of FD-SOI at application level
Exhibit 02: Comparison between FinFET and FD-SOI
Exhibit 03: Global FD-SOI technology market: Overview
Exhibit 04: Global FD-SOI technology market 2016-2021 ($ billions)
Exhibit 05: FD-SOI vs FinFET
Exhibit 06: Five forces analysis
Exhibit 07: Global FD-SOI technology market by node 2016-2021 (% share)
Exhibit 08: Global FD-SOI technology market by node 2016-2021 ($ billions)
Exhibit 09: Components of 28-nm FD-SOI platform
Exhibit 10: Global FD-SOI technology market by 28-nm FD-SOI technology 2016-2021 ($ billions)
Exhibit 11: Global FD-SOI technology market by 22-nm FD-SOI technology 2016-2021 ($ billions)
Exhibit 12: Global FD-SOI technology market by 14-nm FD-SOI technology 2016-2021 ($ billions)
Exhibit 13: Global FD-SOI technology market by 12-nm FD-SOI technology 2016-2021 ($ billions)
Exhibit 14: Global FD-SOI technology market by geography 2016 (% share)
Exhibit 15: Global FD-SOI technology market by geography 2016-2021 ($ billions)
Exhibit 16: FD-SOI technology market in Americas 2016-2021 ($ billions)
Exhibit 17: Semiconductor IC companies in Americas
Exhibit 18: FD-SOI technology market in APAC 2016-2021 ($ billions)
Exhibit 19: Semiconductor companies in APAC
Exhibit 20: FD-SOI technology market in EMEA 2016-2021 ($ billions)
Exhibit 21: Semiconductor companies in EMEA
Exhibit 22: Key leading countries 2016
Exhibit 23: Node transition in FD-SOI industry
Exhibit 24: GLOBALFOUNDRIES: Product portfolio
Exhibit 25: SOITEC: Product portfolio
Exhibit 26: Other prominent vendors
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FEATURED COMPANIES

  • Dream Chip Technologies
  • GLOBALFOUNDRIES
  • INVECAS
  • SAMSUNG
  • SOITEC
  • STMicroelectronics
  • MORE
New Report Released: - Global Fully Depleted Silicon-on-insulator (FD-SOI) Technology Market 2017-2021

The author of the report recognizes the following companies as the key players in the global fully depleted silicon-on-insulator (FD-SOI) technology market: GLOBALFOUNDRIES, SAMSUNG, STMicroelectronics, and SOITEC.

Other Prominent Vendors in the market are: Dream Chip Technologies, INVECAS, and VERISILICON.

Commenting on the report, an analyst from the research team said: “The latest trend gaining momentum in the market is Emergence of IoT. IoT can be defined as a network of physical objects or things embedded with electronics, software, sensors, and network connectivity. IoT involves M2M communication that enables devices to exchange information and act upon information, thereby eliminating the need for human-to-computer or human-to-human interactions.

In node-to-node communication, each device would function as a smart node by sensing information, bandwidth reduction, and filtering the noise by low-level signal processing. These nodes help to communicate and protect information with the help of a centralized system called the cloud. The information is then sent to people. The number of IoT devices is expected to reach more than 25 billion by 2021. IoT integrates machine learning systems and big data technology and harnesses sensor and actuator data.”

According to the report, one of the major drivers for this market is Smaller die sizes. A wafer is diced into a number of pieces, and each piece is called a die. A die is a semiconductor material on which a circuit is fabricated. To cut down on costs, vendors are opting for die shrinking. Die shrinking is a process in which an identical circuit is designed using an advanced fabrication process. The process involves the production of many dies from the same wafer, thereby decreasing the cost per product.

Further, the report states that one of the major factors hindering the growth of this market is Challenges associated with 10-nm FD-SOI design. Most of the foundry customers are scaling below 28-nm FD-SOI, which makes the process more expensive and difficult. The lithography wavelength is at its peak at 20 nm. Nodes below 20 nm require double patterning, leading to an increase in wafer cost that impacts the overall chip cost. At lower nodes, the major concerns are lower power consumption and higher speed. Both 16-nm and

14-nm FinFET can provide these two functionalities, which is difficult in other technology nodes. The physical structures of these technology nodes are designed in such a way that they reduce the time consumed and uncertain iterations.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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  • GLOBALFOUNDRIES
  • SAMSUNG
  • STMicroelectronics
  • SOITEC
  • Dream Chip Technologies
  • INVECAS
  • VERISILICON
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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