The global flip chip technology packaging market estimated at USD 20.19 billion in 2016 is projected to reach USD 31.26 billion by 2022, at a CAGR of 7.56% during the forecast period 2017-2022. The rapid growth of this market is propelled by its numerous advantages like smaller-size, higher-performance, and greatest I/O flexibility over the competitive methodologies.
The major driving forces of the flip chip technology market have been the developments in the packaging of electronics like improving performance, maintaining high packaging density and increasing the reliability of circuits. However, the high cost associated with the implementation of the flip chip technology is impeding the growth of the market.
The global flip chip technology market can be segmented by the wafer bumping process (copper pillar, tin-lead eutectic solder, lead-free solder, gold stud bumping); by packaging process (2D IC, 2.5D IC, 3D IC), by products (memory, high brightness light-emitting diode, RF, power and analog ICs, imaging and 2D logic sol); by application (medical devices, industrial application, automotive, GPUs and chipsets, smart technologies and electronic devices) and by geography.
Key Market Players
The report also considers key trends that will impact the industry and profiles of leading companies with majority shares in the global flip chip technology market, such as:
Market definition for global flip chip market along with identification of key drivers and restraints for the market.
Market analysis for the global flip chip market, with region specific assessments and competition analysis on a global and regional scale.
Identification of factors instrumental in changing the market scenarios, rising prospective opportunities and identification of key companies which can influence the market on global and regional scales.
Extensively researched competitive landscape section with profiles of major companies along with their strategic initiatives and market shares.
Identification and analysis of the macro and micro factors that affect the global flip chip market on both global and regional scales.
A comprehensive list of key market players along with the analysis of their current strategic interests and key financial information.
1.1 Study Deliverables
1.2 Market Definition
1.3 Market Scope
2. Research Methodology
2.2 Analysis Methodology
3. Executive Summary
4. Market Overview
4.1 Current Market Scenario
4.2 Market Drivers
4.2.1 High Packaging Density
4.2.2 Ease of Integration
4.3 Market Restraints
4.4 Industry Attractiveness- Porter's Five Forces
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Consumers
4.4.3 Threat of New Entrants
4.4.4 Threat of Substitute Products and Services
4.4.5 Competitive Rivalry within the Industry
4.5 Industry Value Chain Analysis
5. Market Segmentation
6. By Wafer Bumping Process
6.1 Copper Pillar
6.2 Tin-Lead Eutectic Solder (Sn-Pb Eutectic Solder)
6.3 Lead Free Solder
6.4 Gold Stud Bumping
7. By Packaging Process
7.1 2D IC
7.2 2.5D IC
7.3 3D IC
8. By Products
8.2 High Brightness, Light-Emitting Diode (LED)
8.3 RF, Power and Analog ICs
8.5 2D Logic Soc
9. By Application
9.1 Medical Devices
9.2 Industrial Applications
9.4 GPUs and Chipsets
9.5 Smart Technologies
9.7 Electronic Devices
10. By Geography
10.1 North America
10.3.8 South Korea
10.4 Middle East & Africa
10.5 Latin America
11. Competitive Analysis - Company Profiles
11.1 Amkor Technology
11.2 IBM Corp.
11.3 Intel Corp.
11.4 Taiwan Semiconductor Manufacturing Co.
11.5 Samsung Electronics Co. Ltd.
11.6 Texas Instruments Inc.
11.7 Global Foundries U.S Inc.
11.8 Stats Chippac Ltd.
11.9 NEPES PTE. LTD.
11.10 Powertech Technology
12. Competitive Landscape
12.1 Market Share Analysis
12.2 Analysis of Development Trends
12.3 Oppurtunities for Investments in Flip Chip Technology
13. Future of the Flip Chip Technology