Global PUR Adhesive in electronics market - Segmented by Product Type, Application and Geography - Trends and Forecasts 2017 - 2022

  • ID: 4390243
  • Report
  • Region: Global
  • 159 pages
  • Mordor Intelligence
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The global PUR adhesive in electronics market was valued at USD 796 million in 2015 and is expected to reach USD 1,202.2 million by 2020, showing a compound annual growth rate of 8.6%. The growing demand for electronic adhesives in the Asia-Pacific region is the major driving factor of the market.

The electronic adhesives market is anticipated to show high growth rate in the coming years. The market is technology-driven and there will be investments for the development of new technology and products. The electronic adhesives market is a part of electronic chemicals and materials industry, which is moving towards consolidation as the major electronic chemicals and materials companies are acquiring other local and foreign players.

It is anticipated that in future, as less of the drivers attention is required to steer the vehicle, the operator will be able to pursue other tasks or interests. Interiors will be designed to enable occupants to engage in work or leisure activities, which suggest the addition of even more electronics in the interior. Adhesives that improve screen clarity, reduce glare or help electronics survive the harsh automotive environment will be in demand as these worlds collide.

Market Dynamics of the Global PUR Adhesive in Electronics Market

Drivers:

Increasing demand from the automotive industry
Growing technological dominance
Growing demand from developing countries

Challenges

Volatility in feed stock price
Government regulations about limiting VOC emissions
Fluctuations of crude oil prices

Global PUR Adhesive in Electronics Market Segmentation

The report elucidates the situation of PUR adhesive globally and studies its markets by application (surface mounting, conformal coatings, wire tacking, potting and encapsulation) and by product type (electrically conductive adhesives, thermally conductive adhesives, UV curing adhesives and others). The market is further segmented by geography into North Americas, Europe, the Asia-Pacific (APAC) and the Rest of the World (ROW); wherein the market share of each region is analyzed. The Asia-Pacific has the largest market for PUR adhesive, followed by North America and Europe. The region is expected to continue its leading position and dominate the market by 2020, with advanced technological developments in the electronic adhesives market for end-users. Among these regions, the growth of the PUR adhesive market will be phenomenal in the Asia Pacific which will mainly be concentrated in China, India, Japan, and South Korea. The UV-curing adhesives, in terms of product types, are expected to experience the fastest growth in the coming years. However, electrically conductive and thermal conductive adhesives are the leaders and act as an alternative to tin-lead solders.

The longstanding trend toward miniaturization of electronics components has resulted in more use of adhesives for fastening. In addition, as the use of electronics grows in the automotive sector, the demand for adhesives in automotive-electronics is also growing. Overall, advances in technology and implementation of tighter safety standards are expected to grow the electronic adhesives market. The companies profiled in the PUR adhesive market report include:
  • 3M Corporation
Key Deliverables:

Analysis for the global PUR adhesive in electronics market, with region specific assessments and competition analysis on a global and regional scale.
Market definition along with the identification of key drivers and restraints.
Identification of factors instrumental in changing the market scenario, rising prospective opportunities, and identification of key companies that can influence this market on a global and regional scale.
Extensively researched competitive landscape section with profiles of major companies along with their market share.
Identification and analysis of the macro and micro factors that affect the global PUR adhesive in electronics market on both global and regional scale.
A comprehensive list of key market players along with the analysis of their current strategic interests and key financial information.
A wide-ranging knowledge and insights about the major players in this industry and the key strategies adopted by them to sustain and grow in the studied market.
Insights on the major countries/regions where this industry is growing and to also identify the regions that are still untapped.
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1. Introduction
1.1 Description
1.2 Research Methodology
2. Executive Summary
3. PUR Adhesives Market
3.1 Overview
3.2 Industry Value Chain Analysis
3.3 Industry Attractiveness Porters 5 Force Analysis
3.3.1 Bargaining Power of Suppliers
3.3.2 Bargaining Power of Consumers
3.3.3 Threat of New Entrants
3.3.4 Threat of Substitute Products and Services
3.3.5 Degree of Competition
4. Market Dynamics
4.1 Drivers
4.1.1 Increasing demand from automotive industry
4.1.2 Growing Technological Dominance
4.1.3 Growing demand from developing countries
4.2 Restraints
4.2.1 Volatility in raw material prices
4.2.2 Impulsive Market Conditions & Product Costs
4.3 Opportunities
4.3.1 Expansion and Acquisition of Local Businesses
5. Market Segmentation and Analysis
5.1 By Product Type
5.1.1 Electrically Conductive Adhesives
5.1.2 Thermally Conductive Adhesives
5.1.3 UV Curing Adhesives
5.1.4 Others
5.2 By Application
5.2.1 Surface mounting
5.2.2 Conformal coatings
5.2.3 Wire tacking
5.2.4 Potting
5.2.5 Encapsulation
6. Regional Market Analysis (Market size, growth and forecast)
6.1 Asia-Pacific
6.1.1 China
6.1.2 India
6.1.3 Japan
6.1.4 South Korea
6.1.5 Rest of Asia-Pacific
6.2 North America
6.2.1 United States
6.2.2 Canada
6.2.3 Mexico
6.2.4 Rest of North America
6.3 Europe
6.3.1 Germany
6.3.2 United Kingdom
6.3.3 Italy
6.3.4 France
6.3.5 Rest of Europe
6.4 ROW
6.4.1 Brazil
6.4.2 Others
7. Competitive Landscape
7.1 Mergers & Acquisitions
7.2 Joint Ventures, Collaborations and Agreements
7.3 Market Share Analysis
7.4 Strategies Adopted by Leading Players
8. Company Profiles (Overview, Products & Services, Financials, Recent Developments)
8.1 3M
8.2 Adhesive Technologies, Inc.
8.3 Alent Plc
8.4 Ashland, Inc.
8.5 Avery Dennison Corporation
8.6 BASF SE
8.7 Beardow & Adams (Adhesives) Ltd.
8.8 Bostik SA
8.9 BÃœHNEN
8.10 Dow Chemicals Co.
8.11 Dymax
8.12 Evonik
8.13 H.B. Fuller
8.14 Henkel AG & Co. KGaA
8.15 Hitachi Chemical Co. Ltd.
8.16 Huntsman Corporation
8.17 Indium Corporation
8.18 Jowat AG
8.19 Kyocera Chemical Corporation
8.20 L.D. Davis
8.21 LG Chemical Ltd.
8.22 Mitsui Chemicals, Inc.
8.23 Nordson
8.24 Sika AG
9. Disclaimer
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