Global Electronics Adhesives Market - Segmented by Product Type, Chemistry Used and Geography - Trends and Forecasts 2017 - 2022

  • ID: 4390400
  • Report
  • Region: Global
  • 188 pages
  • Mordor Intelligence
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The global electronics adhesives market is estimated to be USD 4097.11 million in 2016, and is expected to reach USD 5,610.76 million in 2021, at a CAGR of 6.49%. The growing demand for electronic adhesives in the Asia-Pacific region is the major driving factor of the market.

Electronic adhesives are widely used in the manufacture and assembly of electronic circuits and products. They are mostly used in bonding the surface-mount components, wire tacking, and encapsulating components. They help in the miniaturization of electronics components and the longstanding trend of reducing the size of electronics is driving this market. In addition, the demand for these adhesives is increasing with the growing use of electronics in the automotive sector.

The market is further divided based on the product type into electrically conductive, thermal conductive, UV curing and others. The UV-curing adhesives segment is expected to experience the fastest growth during the forecast period, owing to their solvent-free and environment-friendly characteristics. Electrically conductive adhesives account for the highest share in the market, in terms of revenue, closely followed by thermally conductive adhesives.

The most popular chemistries used in electronic adhesives are acrylics, epoxies, silicones, polyurethanes and others. Epoxies are the extensively used chemistries in the manufacturing of electronic adhesives, due to their excellent chemical, water, and heat resistant properties.

The market has been further divided into Asia-pacific, North America, South America, Europe and Middle-East & African regions. Asia-Pacific region accounted for the highest share in the market, by revenue in 2015 and is expected to witness the highest CAGR during the forecast period. Growth is particularly high in countries like China and India because of a significant rise in the purchasing power of the population, resulting in augmented demand for consumer electronics and rapid growth of the electronics industry.

The market is technology-driven and the companies are increasingly investing in the development of new technology and products.

The major players in the market include:-
  • Henkel
  • H.B. Fuller
  • Dow Chemicals
  • 3M
  • Royal Adhesives and Sealants
Key Deliverables:

Market analysis for the global electronics adhesives market, with region specific assessments and competition analysis on global and regional scales.
Market definition along with the identification of factors instrumental in changing the market scenario and prospective opportunities.
Extensively researched competitive landscape section with profiles of major companies along with their market share.
Identification and analysis of the macro and micro factors that affect the global electronics adhesives market on both global and regional scale.
A comprehensive list of key market players along with the analysis of their current strategic interests and key financial information.
Insights on the major countries/regions where this industry is growing and also to identify the regions that are still untapped.
Note: Product cover images may vary from those shown
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1. Introduction
1.1 Description
1.2 Research Methodology
1.3 Scope of the Report
2. Executive Summary
3. Market Insights
3.1 Current Market Scenario
3.2 Industry Value Chain Analysis
3.3 Industry Attractiveness – Porter’s 5 Force Analysis
3.3.1 Bargaining Power of Suppliers
3.3.2 Bargaining Power of Consumers
3.3.3 Threat of New Entrants
3.3.4 Threat of Substitute Products and Services
3.3.5 Degree of Competition
4. Market Dynamics
4.1 Drivers
4.1.1 Increasing use of electronics in Automotive
4.1.2 Growing demand for miniaturized, lightweight and transparent electronics
4.1.3 Increasing demand from electronics industry in Asia-Pacific region
4.2 Restraints
4.2.1 Volatility in Availability and Price of Raw Material
4.2.2 Incompatible electronic and thermally conductive properties of these adhesives in some applications
4.3 Opportunities
4.3.1 Expansion and Acquisition of Local Businesses
4.3.2 Development of new products & applications
5. Market Segmentation and Analysis
5.1 By Material Type
5.1.1 Acrylics
5.1.2 Epoxies
5.1.3 Polyurethanes
5.1.4 Silicones
5.1.5 Others
5.2 By Product Type
5.2.1 Electrically Conductive Adhesives
5.2.2 Thermally Conductive Adhesives
5.2.3 UV Curing Adhesives
5.2.4 Others
5.3 By Application
5.3.1 Surface mounting
5.3.2 Conformal coatings
5.3.3 Wire tacking
5.3.4 Potting & Encapsulation
6. Regional Market Analysis (Market size, growth and forecast)
6.1 Asia-Pacific
6.1.1 China
6.1.2 India
6.1.3 Japan
6.1.4 South Korea
6.1.5 ASEAN
6.1.6 Taiwan
6.1.7 Rest of Asia-Pacific
6.2 North America
6.2.1 United States
6.2.2 Canada
6.2.3 Mexico
6.2.4 Rest of North America
6.3 Europe
6.3.1 Germany
6.3.2 United Kingdom
6.3.3 Italy
6.3.4 France
6.3.5 Rest of Europe
6.4 South America
6.4.1 Brazil
6.4.2 Argentina
6.4.5 Rest of South America
6.5 Middle-East and Africa
6.5.1 Saudi Arabia
6.5.2 South Africa
6.5.3 Rest of Middle-East and Africa
7. Competitive Landscape
7.1 Mergers & Acquisitions
7.2 Joint Ventures, Collaborations and Agreements
7.3 Market Share Analysis
7.4 Strategies Adopted by Leading Players
8. Company Profiles (Overview, Products & Services, Financials, Recent Developments)
8.2 Covestro
8.3 3M Company
8.4 Bostik Sa
8.5 Avery Dennison Corporation
8.6 Dow Chemical Company
8.7 Royal Adhesives and Sealants
8.8 Sika Ag
8.9 Ashland Inc.
8.10 ITW Performance Polymers (Illinois Tool Works Inc.)
8.11 H.B. Fuller Company
8.12 RPM International Inc.
8.13 Adhesives Research Inc.
8.14 Beardow & Adams (Adhesives) Ltd
8.15 Chemence Inc.
8.16 Henkel
8.17 Huntsman Corporation
8.18 Pidilite Industries
8.19 Mapei Spa
8.20 Super Glue Corporation
8.21 Heng Ying Adhesive Co., Ltd
8.22 Ninghai Dingcheng Adhesive Co., Ltd.
8.23 American Biltrite, Inc.
9. Disclaimer
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown