Global Advanced Packaging Market - By Type, Product, Application, Region - Market Size, Demand Forecasts, Industry Trends and Updates (2016-2022)

  • ID: 4391389
  • Report
  • Region: Global
  • 132 pages
  • Oristep Consulting
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until Dec 31st 2018
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FEATURED COMPANIES

  • Amkor
  • Chipbond
  • Freshpoint
  • LINPAC
  • NFM
  • Sealed Air
  • MORE
Advanced Packaging means implementing advanced technologies and design modifications to conventional packaging formats to increase its effectiveness. Advanced packaging market is increasing momentum mainly because of increasing population and growing demand for quality and safe packaged foods with longer shelf life in Food and Beverages Industry (F&B). Advanced packaging helps consumers to know about the product information, updates on nutrient values, condition and expiry of the products etc.

Supply-Demand Scenario:

The global market for advanced packaging was USD 26.67 billion and is estimated to grow at a CAGR of 7.15% during the forecast period to reach USD 40.37 billion by 2020. The market is continuously growing with the aim to improve functionalities of packaging solutions, reducing manufacturing costs and environment friendly.

Packaging by Type:

The Intelligent Technology Packaging solutions are anticipated to hold highest share in the upcoming years because of improved technological advancements with Printed Electronics and RFID tags etc. Modified Atmosphere Packaging held the largest market share previously. Innovations in packaging ensure the consumer engagement and market growth.

Packaging by Region:

The market in APAC region is said to witness the rapid growth in advanced packaging mainly in Japan and Australia with its application in fresh meat, fish, poultry, beer packaging, processed food etc during the forecast period. India, China and New Zealand are the key emerging markets in the industry while North America has the biggest share in the Market.

Challenges:
The expensive raw materials are the major constraints for market growth. This leads to higher procurement costs for the market vendors. Also, the cost of R&D involved in packaging solutions is quite high. Testing of solutions is elaborate, time-consuming and expensive.
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor
  • Chipbond
  • Freshpoint
  • LINPAC
  • NFM
  • Sealed Air
  • MORE
1. Research Methodology

2. Executive Summary

3. Market Overview
  • Definition
  • Industry Value Chain Analysis
  • Porter's 5 Forces
  • Regulations
4. Market Dynamics
  • Introduction
  • Drivers
  • Constraints
  • Opportunities
5. Global Advanced Packaging market Segmentation, Forecasts and Trends - By Revenue

6. By Type
  • Intelligent Technology
  • Active Technology
  • Modified Atmosphere
  • Others
7. By Product
  • 3.0 DIC
  • FO SIP
  • FO WLP
  • 3D WLP
  • WLCSP
  • 2.5D
  • Filp Chip
8. By Application
  • Analog & Mixed Signal
  • Wireless Connectivity
  • Optoelectronic
  • MEMS & Sensor
  • Misc Logic and Memory
9. By Region
  • North America
  • US
  • Canada
  • Europe
  • UK
  • France
  • Germany
  • Italy
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Others
  • Middle East and Africa
  • United Arab Emirates
  • Saudi Arabia
  • South Africa
  • Others
10. Vendor Market Share Analysis

11. Company Profiles
  • Freshpoint
  • Multisorb
  • ASE
  • Amkor
  • PakSense
  • Chipbond
  • STS
  • Sealed Air
  • JCET
  • SPIL
  • Stats Chippac
  • Huatian
  • NFM
  • Carsem
  • Maxwell Chase
  • LINPAC
  • J-Devices
  • UTAC
  • Chipmos
  • PTI
  • Walton
  • Unisem
  • Desiccare
  • OSE
  • AOI
  • Formosa
  • NEPES
12. Industry Structure
  • Industry M&As, Consolidations
  • Investment Opportunities
  • Global Advanced Packaging market - Road Ahead
  • Tables
  • Disclaimer
Note: Product cover images may vary from those shown
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  • Freshpoint
  • Multisorb
  • ASE
  • Amkor
  • PakSense
  • Chipbond
  • STS
  • Sealed Air
  • JCET
  • SPIL
  • Stats Chippac
  • Huatian
  • NFM
  • Carsem
  • Maxwell Chase
  • LINPAC
  • J-Devices
  • UTAC
  • Chipmos
  • PTI
  • Walton
  • Unisem
  • Desiccare
  • OSE
  • AOI
  • Formosa
  • NEPES
Note: Product cover images may vary from those shown
5 of 4
Note: Product cover images may vary from those shown
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