This issue of Microelectronics TOE covers recent developments in semiconductor, wearable, and data storage technologies. Innovations include chipset for mobile artificial intelligence computing, RFID-enabled wearable technology for the construction industry, wearable suitable for blood oxygen monitoring and touchless payment, wearable technology for monitoring real-time heat stress, and efficient data center caching by using Flash memory.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
1. Innovations in Semiconductor, Wearable, and Data Storage Technologies
1.1 Chipset for Mobile Artificial Intelligence Computing
1.2 RFID Enabled Wearable Technology for the Construction Industry
1.3 Wearable suitable for blood oxygen monitoring and touchless payment
1.4 Wearable Technology for Monitoring Real-time Heat Stress
1.5 Efficient Data Center Caching by Using Flash Memory
2. Industry Contacts