Global Semiconductor Packaging Materials Market 2017-2021

  • ID: 4427338
  • Report
  • Region: Global
  • 136 pages
  • TechNavio
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FEATURED COMPANIES

  • Amkor Technology
  • ASM Pacific Technology
  • BASF
  • DuPont
  • Henkel
  • Hitachi Chemical
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

About Semiconductor Packaging Materials

Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties. Excessive heat in the integrated circuit is dissipation through attached heat spreaders. Semiconductor packaging components vary in dimensions and functionality and are mainly organic substrates, bonding wires, encapsulation resins, lead frames, thermal interface materials, die attach materials, and solder balls. The key customers of these packaging materials are the electronics industry, automotive sector, fabless semiconductor companies, packaging material suppliers, and packaging subcontractors.

The analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 5.27% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for 2017-2021. To calculate the market size, the report considers the revenue generated by vendors through the sales of semiconductor packaging materials which are organic substrates, lead frames, bonding wires, encapsulation resins, die attach materials, solder balls, thermal interface materials, and WLP dielectrics.

The market is divided into the following segments based on geography:
  • Americas
  • APAC
  • EMEA
The report, Global Semiconductor Packaging Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the Key vendors operating in this market.

Key vendors
  • Amkor Technology
  • DuPont
  • Henkel
  • Honeywell
  • Kyocera
  • Toppan Printing
Other prominent vendors
  • Hitachi Chemical
  • ASM Pacific Technology
  • BASF
  • Beijing Kehua New Chemical Technology
Market drivers
  • Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT
  • For a full, detailed list, view the full report
Market challenges
  • Capital-intensive market
  • For a full, detailed list, view the full report
Market Trends
  • Increase in adoption of flip-chip, Sip, lead-free packaging solutions
  • For a full, detailed list, view the full report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.
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Note: Product cover images may vary from those shown
2 of 5

FEATURED COMPANIES

  • Amkor Technology
  • ASM Pacific Technology
  • BASF
  • DuPont
  • Henkel
  • Hitachi Chemical
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: INTRODUCTION
  • Market outline
PART 05: MARKET LANDSCAPE
  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis
PART 06: MARKET SIZING
  • Market definition
  • Market sizing 2016
  • Market size and forecast 2016-2021
PART 07: FIVE FORCES ANALYSIS
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition
PART 08: CUSTOMER LANDSCAPE

PART 09: MARKET SEGMENTATION BY MATERIAL TYPE
  • Segmentation by material type
  • Organic substrates – Market size and forecast 2016-2021
  • Lead frames – Market size and forecast 2016-2021
  • Bonding wires – Market size and forecast 2016-2021
  • Others – Market size and forecast 2016-2021
  • Market opportunity by type of materials
PART 10: REGIONAL LANDSCAPE
  • Geographical segmentation
  • APAC – Market size and forecast 2016-2021
  • Americas – Market size and forecast 2016-2021
  • EMEA – Market size and forecast 2016-2021
  • Market opportunity
PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES
  • Market drivers
  • Market challenges
PART 13: MARKET TRENDS
  • Increase in adoption of flip-chip, Sip, lead-free packaging solutions
  • Growing preference of SMT (surface mount technology) over older through-hole technology and surge in popularity of redistributed chip packaging
  • Surge in adoption of semiconductor ICs for automobiles and shift toward copper as bonding wire material
PART 14: VENDOR LANDSCAPE
  • Competitive scenario
PART 15: VENDOR ANALYSIS
  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Amkor Technology
  • DuPont
  • Henkel
  • Honeywell
  • Kyocera
  • Toppan Printing
PART 16: APPENDIX
  • List of abbreviations
List of Exhibits
Exhibit 01: Steps in back-end chip formation
Exhibit 02: Roadmap of semiconductor packaging
Exhibit 03: Old supply chain of semiconductor IC packaging industry
Exhibit 04: New supply chain of semiconductor IC packaging industry
Exhibit 05: Related market
Exhibit 06: Semiconductor packaging materials technologies
Exhibit 07: Global semiconductor packaging materials market overview
Exhibit 08: Market characteristics
Exhibit 09: Market segments
Exhibit 10: Market definition - Inclusions and exclusions checklist
Exhibit 11: Market size 2016
Exhibit 12: Validation techniques employed for market sizing 2016
Exhibit 13: Global semiconductor packaging materials – Market size and forecast 2016-2021 ($ billions)
Exhibit 14: Global semiconductor packaging materials market– Year-over-year growth 2017-2021 (%)
Exhibit 15: Five forces analysis 2016
Exhibit 16: Five forces analysis 2021
Exhibit 17: Bargaining power of buyers
Exhibit 18: Bargaining power of suppliers
Exhibit 19: Threat of new entrants
Exhibit 20: Threat of substitutes
Exhibit 21: Threat of rivalry
Exhibit 22: Market condition in 2016 - Five forces
Exhibit 23: Customer landscape
Exhibit 24: Global semiconductor packaging materials by market type 2016-2021 (%)
Exhibit 25: Comparison by end-user
Exhibit 26: Organic substrates – Market size and forecast 2016-2021 ($ billions)
Exhibit 27: Organic substrates – Year-over-year growth 2017-2021 (%)
Exhibit 28: Lead frames – Market size and forecast 2016-2021 ($ billions)
Exhibit 29: Lead frames – Year-over-year growth 2017-2021 (%)
Exhibit 30: Bonding wires – Market size and forecast 2016-2021 ($ billions)
Exhibit 31: Bonding wires – Year over year growth 2017-2021 (%)
Exhibit 32: Others – Market size and forecast 2016-2021 ($ billions)
Exhibit 33: Others – Year-over-year growth 2017-2021 (%)
Exhibit 34: Market opportunity by material type
Exhibit 35: Global semiconductor packaging materials market share by geography 2016-2021 (%)
Exhibit 36: Regional comparison
Exhibit 37: APAC – Market size and forecast 2016-2021 ($ billions)
Exhibit 38: APAC – Year-over-year growth 2017-2021 (%)
Exhibit 39: Top 3 countries in Americas
Exhibit 40: Americas – Market size and forecast 2016-2021 ($ billions)
Exhibit 41: Americas – Year-over-year growth 2017-2021 (%)
Exhibit 42: Top 3 countries in EMEA
Exhibit 43: EMEA – Market size and forecast 2016-2021 ($ billions)
Exhibit 44: EMEA – Year-over-year growth 2017-2021 (%)
Exhibit 45: Top 3 countries in APAC
Exhibit 46: Vendor classification
Exhibit 47: Market positioning of vendors
Exhibit 48: Amkor Technology overview
Exhibit 49: Amkor Technology – Business segments
Exhibit 50: Amkor Technology– Organizational developments
Exhibit 51: Amkor Technology– Geographic focus
Exhibit 52: Amkor Technology – Business segment focus
Exhibit 53: Amkor Technology – Key application packaging products
Exhibit 54: DuPont overview
Exhibit 55: DuPont – Business segments
Exhibit 56: Dupont – Organizational developments
Exhibit 57: Dupont – Geographic focus
Exhibit 58: Dupont – Segment focus
Exhibit 59: Dupont – Key offerings
Exhibit 60: Henkel overview
Exhibit 61: Henkel – Business segments
Exhibit 62: Henkel – Organizational developments
Exhibit 63: Henkel – Geographic focus
Exhibit 64: Henkel – Segment focus
Exhibit 65: Henkel – Key offerings
Exhibit 66: Honeywell overview
Exhibit 67: Honeywell – Business segments
Exhibit 68: Honeywell – Organizational developments
Exhibit 69: Honeywell – Geographic focus
Exhibit 70: Honeywell – Segment focus
Exhibit 71: Honeywell – Key offerings
Exhibit 72: Kyocera overview
Exhibit 73: Kyocera – Business segments
Exhibit 74: Kyocera – Organizational developments
Exhibit 75: Kyocera – Geographic focus
Exhibit 76: Kyocera – Segment focus
Exhibit 77: Kyocera – Key offerings
Exhibit 78: Toppan Printing overview
Exhibit 79: Toppan Printing – Business segments
Exhibit 80: Toppan Printing – Organizational developments
Exhibit 81: Toppan Printing – Geographic focus
Exhibit 82: Toppan Printing – Segment focus
Exhibit 83: Toppan Printing – Key offerings
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FEATURED COMPANIES

  • Amkor Technology
  • ASM Pacific Technology
  • BASF
  • DuPont
  • Henkel
  • Hitachi Chemical
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

New Report Released: – Global Semiconductor Packaging Materials Market 2017-2021

The author of the report recognizes the following companies as the key players in the global semiconductor packaging materials market: Amkor Technology, DuPont, Henkel, Honeywell, Kyocera, and Toppan Printing

Other Prominent Vendors in the market are: Hitachi Chemical, ASM Pacific Technology, BASF, and Beijing Kehua New Chemical Technology.

Commenting on the report, an analyst from the research team said: “The latest trend gaining momentum in the market is Increase in adoption of flip-chip, Sip, lead-free packaging solutions. To meet certain international standards of compliance, the lead-free packaging is gaining popularity and is set to continue during the forecast period. The RoHS was adopted by the European Union to control the use of hazardous substances in the packaging of electrical and electronic devices. This has been done to address the issue of consumer electronics waste disposal. Companies have started opting for lead-free packaging. In lead frame packages, the post plate is built of matte tin and pre-plate with nickel-palladium-silver alloys as lead substitutes.”

According to the report, one of the major drivers for this market is Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT. There is an increasing drive toward the mobility of electronic devices, worldwide. To be portable and cost-effective, they need to be lightweight and small. This trend toward the adoption of smaller form factors has called for innovative developments in the semiconductor packaging materials. Packaging technologies such as SiP, PoP, Flip-chip, and WLP is driving the development of new material solutions. For instance, a conductive bump is soldered on top of the flipped chip in flip-chip packaging, that acts as an interconnect with the lead frame or substrate. It ensures high system density and improved performance in miniaturized packages. With increasing functionalities required from the small device, the SiP technology is employed as it packs in ICs of different functionalities along with other passive components such as connectors and filters.

Further, the report states that one of the major factors hindering the growth of this market is Capital-intensive market. In the microelectronics industry, the semiconductor fabrication plant, commonly called a fab or sometimes foundry, is a factory where devices such as ICs are manufactured. Since a number of expensive devices are in operation in the fabs house, the estimated cost of building a new fab is in the range of $2 billion to $10billion. For instance, TSMC invested more than $9 billion in its Fab15 300 mm wafer manufacturing facility in Taiwan.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

  • Amkor Technology
  • DuPont
  • Henkel
  • Honeywell
  • Kyocera
  • Toppan Printing
  • Hitachi Chemical
  • ASM Pacific Technology
  • BASF
  • Beijing Kehua New Chemical Technology
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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