This Microelectronics TOE profiles developments in silicon photonics, flexible electronics, and vertical cavity surface emitting laser. Innovations include micro-optical switches for optical communication applications, printing of flexible circuits using electrohydrodynamic printing, active matrix backplanes for micro-LED applications, VCSEL technology for emerging applications, and optimized VCSEL solution for consumer electronics.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Table of Contents
Innovations in Silicon Photonics, Flexible Electronics, and Vertical Cavity Surface Emitting Laser
- Micro-optical Switches for Optical Communication Applications
- Printing of Flexible Circuits Using Electrohydrodynamic Printing
- Active Matrix Backplanes for Micro-LED Applications
- VCSEL Technology for Emerging Applications
- Optimized VCSEL Solution for Consumer Electronics
- Industry Contacts
