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Recap and Outlook for The Worldwide Wafer Foundry Industry in 2018

  • Report

  • 24 Pages
  • August 2018
  • Region: Global
  • Market Intelligence & Consulting Institute (MIC)
  • ID: 4607694

The global wafer foundry industry is highly concentrated with the top-five players taking up about 76% of the total shipments. The increasing share of orders released by IDMs and the proliferation of emerging application ICs such as CPUs, GPUs, FPGAs, and ASICs have been major growth factors to drive the industry's growth over the years. In addition, the rise of automotive electronics, IoT, and 5G applications have also boosted the demand for fingerprint sensor ICs, driver ICs, GPS ICs, and RF ICs. Hence, the market is expected to continue the steady growth this year.

This report reviews the industry's development in 2017 and provides a future outlook for 2018 and beyond. Also included are development highlights of major players: TSMC, GlobalFoundries, UMC, Samsung, and SMIC.

List of Topics:

  • Development of the worldwide and Taiwanese wafer foundry industries, touching on their status of quo and their shipment value for the period 2015-2018
  • Chinese foundries' advanced process developments and developers and inventors of next generation memories such as MRAM, PCRAM, ReRAM FeRAM, and XPoint
  • Latest development of major players such as TSMC, GlobalFoundries, UMC, Samsung, and SMIC and includes global foundries' rankings for the period 2014-2017

Samples

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Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Adesto
  • AMD
  • Apple
  • Avalanche Tech
  • Bitfury
  • Bitmain
  • Canaan
  • Celis
  • Crossbar
  • Cypress
  • EverSpin
  • Faraday Technology
  • Fujitsu
  • GlobalFoundries
  • HiSilicon
  • HuaHong
  • IBM
  • MediaTek
  • Micron
  • NXP
  • Panasonic
  • Powerchip
  • Qualcomm
  • Rohm
  • Samsung
  • SK Hynix
  • SMIC
  • Sony
  • Spin Transfer
  • Telechips
  • TI
  • Toshiba
  • TowerJazz
  • TSMC
  • UMC
  • USCXM
  • VIS
  • WD
  • Winbond

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases

Methodology

  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis

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