Electronic Enclosures, Housings and Packages. Woodhead Publishing Series in Electronic and Optical Materials

  • ID: 4519311
  • Book
  • 592 Pages
  • Elsevier Science and Technology
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Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from the encasement perspective. It addresses enclosures and their applications for industrial electronics as well as LED lighting solutions for stationary as well as mobile markets.

Electronic Enclosures, Housings and Packages first introduces its readers to fundamental concepts and establish its focus by defining dimensions of success in electrical enclosures. This is followed by environmental considerations, shielding, standardisation, materials selection, thermal management, product design principles, manufacturing techniques, and sustainability. In its closing chapters the book is focused on the business fundamentals by outlining successful technical propositions and potential future directions that would lead to actionable insights benefitting materials scientists and engineers, product developers, additive suppliers and moulders.

  • Introduces the concepts of materials recycling and sustainability to electronic enclosures
  • Provides thorough coverage of all technical aspects related to the design and manufacturing of electronic packaging
  • Includes practical information on environmental considerations, shielding, standardization, materials selection, and more
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1. The least you should know about electronics enclosures
2. What determines success?
3. Environmental considerations
4. Shielding
5. Standardisation
6. Materials Selection
7. Thermal Management
8. Product Design Aspects
9. Manufacturing Technologies
10. Sustainability
11. How to become the only solution in electronics enclosures
12. Future electronics enclosure fortunes
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Suli, Frank
Formerly interim VP of Technology at Emerson (and previously Chief Engineer, Chairman of the CAE Committee, R&D Manager, and Principal Mechanical Engineer). Has also worked as Plastics Engineer, Engineering Manager and Materials Scientist at Celanese in their R. L. Mitchell Technical Center in Summit, New Jersey, USA. He developed new products for the aerospace & defence, automotive, medical, electrical and consumer products sectors while heading engineering for Aegis in Sydney, Australia. He has introduced a new product development methodology for creating Emerson's Electrical Enclosures enabling decreased manufacturing costs by 35% while increased value to customers resulting in doubling this business within 18 months. He integrated plastic flow, stress, vibration and thermal analysis with 3D CAD/CAM system thereby reducing design cycle (art-to-part) to 26 weeks. He established centre of excellence to create testing procedures for incoming polymer inspection (SPC, SQC) by implementing physical and thermal characterization of materials. He directed development of several proprietary electronics potting and encapsulations. He conceived and designed fully automatic coil manufacturing line with new coil winding equipment, precision stamping, robotic assembly, blow moulding, vertical insert injection moulding, marking, testing, and fully automatic packaging to increase productivity and thereby eliminate job losses to low cost countries.
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