Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
- Introduces the concepts of materials recycling and sustainability to electronic enclosures
- Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging
- Includes practical information on environmental considerations, shielding, standardization, materials selection, and more
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2. What determines success?
3. Environmental considerations
6. Materials Selection
7. Thermal Management
8. Product Design Aspects
9. Manufacturing Technologies
11. How to become the only solution in electronics enclosures
12. Future electronics enclosure fortunes
Formerly interim VP of Technology at Emerson (and previously Chief Engineer, Chairman of the CAE Committee, R&D Manager, and Principal Mechanical Engineer). Has also worked as Plastics Engineer, Engineering Manager and Materials Scientist at Celanese in their R. L. Mitchell Technical Center in Summit, New Jersey, USA. He developed new products for the aerospace & defence, automotive, medical, electrical and consumer products sectors while heading engineering for Aegis in Sydney, Australia. He has introduced a new product development methodology for creating Emerson's Electrical Enclosures enabling decreased manufacturing costs by 35% while increased value to customers resulting in doubling this business within 18 months. He integrated plastic flow, stress, vibration and thermal analysis with 3D CAD/CAM system thereby reducing design cycle (art-to-part) to 26 weeks. He established centre of excellence to create testing procedures for incoming polymer inspection (SPC, SQC) by implementing physical and thermal characterization of materials. He directed development of several proprietary electronics potting and encapsulations. He conceived and designed fully automatic coil manufacturing line with new coil winding equipment, precision stamping, robotic assembly, blow moulding, vertical insert injection moulding, marking, testing, and fully automatic packaging to increase productivity and thereby eliminate job losses to low cost countries.