Radiation-Hardened Electronics Market: Global Industry Analysis, Trends, Market Size and Forecasts up to 2024

  • ID: 4538147
  • Report
  • Region: Global
  • 100 pages
  • Infinium Global Research
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FEATURED COMPANIES

  • BAE Systems PLC
  • Honeywell Aerospace
  • Intersil Corporation
  • Microchip Technology Inc.
  • Microelectronics NV
  • Microsemi Corp.
  • MORE
The report on global radiation-hardened electronics market provides qualitative and quantitative analysis for the period of 2016 to 2024. The report predicts the global radiation-hardened electronics market to grow with a CAGR of 3.5% over the period of 2018 - 2024. The study on radiation-hardened electronics market covers the analysis of the leading geographies such as North America, Europe, Asia-Pacific, and RoW for the period of 2016 to 2024.

The report on radiation-hardened electronics market is a comprehensive study and presentation of drivers, restraints, opportunities, demand factors, market size, forecasts, and trends in the global radiation-hardened electronics market over the period of 2016 to 2024. Moreover, the report is collective presentation of primary and secondary research findings.

Porter’s five forces model in the report provides insights into the competitive rivalry, supplier and buyer positions in the market and opportunities for the new entrants in the global radiation-hardened electronics market over the period of 2016 - 2024. Further, the Growth Matrix given in the report brings an insight on the investment areas that existing or new market players can consider.

Research Methodology

Primary Research

Primary research involves extensive interviews and analysis of the opinions provided by the primary respondents. The primary research starts with identifying and approaching the primary respondents, the primary respondents are approached through:

1. Key Opinion Leaders associated
2. Internal and External subject matter experts
3. Professionals and participants from LinkedIn, Hoovers, Factiva and Bloggers

Primary research respondents typically include:

1. Executives working with leading companies in the market under review
2. Product/brand/marketing managers
3. CXO level executives
4. Regional/zonal/ country managers
5. Vice President level executives.

Secondary Research

Secondary research involves extensive exploring through the secondary sources of information available in both public domain and paid sources. Each research study is based on over 500 hours of secondary research accompanied by primary research.

The information obtained through the secondary sources is validated through the crosscheck on various data sources.

The secondary sources of the data typically include:
  • Company reports and publications
  • Government/institutional publications
  • Trade and associations’ journals
  • Websites and publications by research agencies
  • Databases such as WTO, OECD, World Bank, and among others.
Segments Covered

The report segments the global radiation-hardened electronics market on the basis of manufacturing technique, component and application

Global Radiation-Hardened Electronics Market by Manufacturing Technique
  • Radiation Hardening by Design (RHBD)
  • Radiation Hardening by Process (RHBP)
Global Radiation-Hardened Electronics Market by Component
  • ASIC
  • Power Management
  • Logic
  • FPGA
  • Memory
Global Radiation-Hardened Electronics Market by Application
  • Aerospace & Defense
  • Space (Satellite)
  • Nuclear Power Plant
Global Radiation-Hardened Electronics Market by Regions
  • North America
  • Europe
  • Asia-Pacific
  • RoW
Companies Profiled in the report
  • Xilinx, Inc.
  • Microchip Technology Inc.
  • Maxwell Technologies, Inc.
  • Intersil Corporation
  • Linear Technology Corporation
  • BAE Systems PLC
  • Microsemi Corp.
  • Microelectronics NV
  • Honeywell Aerospace
  • Texas Instruments, Inc.
How this report delivers?

1. Comprehensive analysis of global as well as regional markets of radiation-hardened electronics market.

2. Complete coverage of all the segments in radiation-hardened electronics market to analyze the trends, developments in the global market and forecast of market size up to 2024.

3. Comprehensive analysis of the companies operating in global radiation-hardened electronics market. The company profile includes analysis of product portfolio, revenue, SWOT analysis and latest developments of the company.

4. Growth Matrix presents analysis of the product segments and geographies that market players should focus to invest, consolidate, expand and/or diversify.
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • BAE Systems PLC
  • Honeywell Aerospace
  • Intersil Corporation
  • Microchip Technology Inc.
  • Microelectronics NV
  • Microsemi Corp.
  • MORE
1. Preface
1.1 Report Description
1.2 Research Methods
1.3 Research Approaches

2. Executive Summary

3. Global Radiation-Hardened Electronics Market Overview
3.1 Introduction
3.2 Market Dynamics
3.2.1 Drivers
3.2.2 Restraints
3.2.3 Opportunities
3.3 Porter’s Five Forces Analysis
3.4 Growth Matrix Analysis
3.5 Competitive Landscape in the Global Radiation-Hardened Electronics Market

4. Global Radiation-Hardened Electronics Market by Manufacturing Technique 2018-2024
4.1 Radiation Hardening by Design (RHBD)
4.2 Radiation Hardening by Process (RHBP)

5. Global Radiation-Hardened Electronics Market by Component 2018-2024
5.1 ASIC
5.2 Power Management
5.3 Logic
5.4 FPGA
5.5 Memory

6. Global Radiation-Hardened Electronics Market by Application 2018-2024
6.1 Aerospace & Defense
6.2 Space (Satellite)
6.3 Nuclear Power Plant

7. Global Radiation-Hardened Electronics Market by Regions 2018-2024
7.1 North America
7.1.1 North America Radiation-Hardened Electronics Market by Manufacturing Technique
7.1.2 North America Radiation-Hardened Electronics Market by Component
7.1.3 North America Radiation-Hardened Electronics Market by Application
7.1.4 North America Radiation-Hardened Electronics Market by Country
7.2 Europe
7.2.1 Europe Radiation-Hardened Electronics Market by Manufacturing Technique
7.2.2 Europe Radiation-Hardened Electronics Market by Component
7.2.3 Europe Radiation-Hardened Electronics Market by Application
7.2.4 Europe Radiation-Hardened Electronics Market by Country
7.3 Asia-Pacific
7.3.1 Asia-Pacific Radiation-Hardened Electronics Market by Manufacturing Technique
7.3.2 Asia-Pacific Radiation-Hardened Electronics Market by Component
7.3.3 Asia-Pacific Radiation-Hardened Electronics Market by Application
7.3.4 Asia-Pacific Radiation-Hardened Electronics Market by Country
7.4 RoW
7.4.1 RoW Radiation-Hardened Electronics Market by Manufacturing Technique
7.4.2 RoW Radiation-Hardened Electronics Market by Component
7.4.3 RoW Radiation-Hardened Electronics Market by Application
7.4.4 RoW Radiation-Hardened Electronics Market by Sub-region

8. Companies Covered
8.1 Xilinx, Inc.
8.2 Microchip Technology Inc.
8.3 Maxwell Technologies, Inc.
8.4 Intersil Corporation
8.5 Linear Technology Corporation
8.6 BAE Systems PLC
8.7 Microsemi Corp.
8.8 Microelectronics NV
8.9 Honeywell Aerospace
8.10 Texas Instruments, Inc
Note: Product cover images may vary from those shown
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  • Xilinx, Inc.
  • Microchip Technology Inc.
  • Maxwell Technologies, Inc.
  • Intersil Corporation
  • Linear Technology Corporation
  • BAE Systems PLC
  • Microsemi Corp.
  • Microelectronics NV
  • Honeywell Aerospace
  • Texas Instruments, Inc.
Note: Product cover images may vary from those shown
5 of 4
Note: Product cover images may vary from those shown
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