Global Interface IP Market 2018-2022

  • ID: 4538704
  • Report
  • Region: Global
  • 146 pages
  • TechNavio
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FEATURED COMPANIES

  • Arm
  • Cadence Design Systems
  • eSilicon
  • Rambus
  • Synopsys
  • MORE
About Interface IP

Semiconductor intellectual properties (SIPs) are considered as the building blocks or reusable design core components of a chip design layout. Interface intellectual properties (IPs deal with the design and ii development of interfaces such as universal serial bus (USB), peripheral component interconnect express (PCIe), and serial advanced technology attachment (SATA). These interfaces enable wired connectivity between electronic devices, storage, and networking infrastructure.

The analysts forecast the global interface IP market's CAGR is expected to be more than 11%, however, the market's growth momentum will decelerate owing to a decrease in the year over year growth.

Covered in this report

The report covers the present scenario and the growth prospects of the global interface IP market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
  • Americas
  • APAC
  • EMEA
The report, Global Interface IP Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Arm
  • Cadence Design Systems
  • eSilicon
  • Rambus
  • Synopsys
Market drivers
  • Increase in the demand for modern SoC chips
  • For a full, detailed list, view the full report
Market challenges
  • Heavy investments driven by the complexity of IP core designs
  • For a full, detailed list, view the full report
Market trends
  • Proliferation of wireless technologies
  • For a full, detailed list, view the full report
Key questions answered in this report
  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
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Note: Product cover images may vary from those shown
2 of 5

FEATURED COMPANIES

  • Arm
  • Cadence Design Systems
  • eSilicon
  • Rambus
  • Synopsys
  • MORE
PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE
  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis
PART 05: BUSINESS MODELS

PART 06: MARKET SIZING
  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022
PART 07: FIVE FORCES ANALYSIS
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition
PART 08: MARKET SEGMENTATION BY TYPE
  • Segmentation by type
  • Comparison by type
  • USB - Market size and forecast 2017-2022
  • DDRn - Market size and forecast 2017-2022
  • PCIe - Market size and forecast 2017-2022
  • Ethernet - Market size and forecast 2017-2022
  • MIPI - Market size and forecast 2017-2022
  • Others - Market size and forecast 2017-2022
  • Market opportunity by type
PART 09: CUSTOMER LANDSCAPE

PART 10: MARKET SEGMENTATION BY END-USER
  • Segmentation by end-user
  • Comparison by end-user
  • Fabless semiconductor companies - Market size and forecast 2017-2022
  • IDMs - Market size and forecast 2017-2022
  • Foundries - Market size and forecast 2017-2022
  • Market opportunity by end-user
PART 11: REGIONAL LANDSCAPE
  • Geographical segmentation
  • Regional comparison
  • Americas - Market size and forecast 2017-2022
  • APAC - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Key leading countries
  • Market opportunity
PART 12: DECISION FRAMEWORK

PART 13: DRIVERS AND CHALLENGES
  • Market drivers
  • Market challenges
PART 14: MARKET TRENDS
  • Proliferation of wireless technologies
  • Decrease in the lithography wavelength
  • Emergence of the IoT
  • Growth of in-vehicle networks
PART 15: VENDOR LANDSCAPE
  • Overview
  • Landscape disruption
  • Competitive scenario
PART 16: VENDOR ANALYSIS
  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Arm
  • Cadence Design Systems
  • eSilicon
  • Rambus
  • Synopsys
PART 17: APPENDIX
  • List of abbreviations
List of Exhibits
Exhibit 01: Semiconductor IP ecosystem
Exhibit 02: Parent market
Exhibit 03: Global semiconductor IP market
Exhibit 04: Market characteristics
Exhibit 05: Market segments
Exhibit 06: Licenses offered by semiconductor IP vendors
Exhibit 07: Market definition - Inclusions and exclusions checklist
Exhibit 08: Market size 2017
Exhibit 09: Validation techniques employed for market sizing 2017
Exhibit 10: Global interface IP market - Market size and forecast 2017-2022 ($ mn)
Exhibit 11: Global interface IP market - Year-over-year growth 2018-2022 (%)
Exhibit 12: Five forces analysis 2017
Exhibit 13: Five forces analysis 2022
Exhibit 14: Bargaining power of buyers
Exhibit 15: Bargaining power of suppliers
Exhibit 16: Threat of new entrants
Exhibit 17: Threat of substitutes
Exhibit 18: Threat of rivalry
Exhibit 19: Market condition - Five forces 2017
Exhibit 20: Global interface IP market by type - Market share 2017-2022 (%)
Exhibit 21: Comparison by type
Exhibit 22: USB - Market size and forecast 2017-2022 ($ mn)
Exhibit 23: USB - Year-over-year growth 2018-2022 (%)
Exhibit 24: DDRn - Market size and forecast 2017-2022 ($ mn)
Exhibit 25: DDRn - Year-over-year growth 2018-2022 (%)
Exhibit 26: PCIe - Market size and forecast 2017-2022 ($ mn)
Exhibit 27: PCIe - Year-over-year growth 2018-2022 (%)
Exhibit 28: Ethernet - Market size and forecast 2017-2022 ($ mn)
Exhibit 29: Ethernet - Year-over-year growth 2018-2022 (%)
Exhibit 30: MIPI - Market size and forecast 2017-2022 ($ mn)
Exhibit 31: MIPI - Year-over-year growth 2018-2022 (%)
Exhibit 32: Others - Market size and forecast 2017-2022 ($ mn)
Exhibit 33: Others - Year-over-year growth 2018-2022 (%)
Exhibit 34: Market opportunity by type
Exhibit 35: Customer landscape
Exhibit 36: Global interface IP market by end-user - Market share 2017-2022 (%)
Exhibit 37: Comparison by end-user
Exhibit 38: Fabless semiconductor companies - Market size and forecast 2017-2022 ($ mn)
Exhibit 39: Fabless semiconductor companies - Year-over-year growth 2018-2022 (%)
Exhibit 40: IDMs - Market size and forecast 2017-2022 ($ mn)
Exhibit 41: IDMs - Year-over-year growth 2018-2022 (%)
Exhibit 42: Foundries - Market size and forecast 2017-2022 ($ mn)
Exhibit 43: Foundries - Year-over-year growth 2018-2022 (%)
Exhibit 44: Market opportunity by end-user
Exhibit 45: Global interface IP market by geography - Market share 2017-2022 (%)
Exhibit 46: Regional comparison
Exhibit 47: Americas - Market size and forecast 2017-2022 ($ mn)
Exhibit 48: Americas - Year-over-year growth 2018-2022 (%)
Exhibit 49: APAC - Market size and forecast 2017-2022 ($ mn)
Exhibit 50: APAC - Year-over-year growth 2018-2022 (%)
Exhibit 51: EMEA - Market size and forecast 2017-2022 ($ mn)
Exhibit 52: EMEA - Year-over-year growth 2018-2022 (%)
Exhibit 53: Key leading countries
Exhibit 54: Market opportunity
Exhibit 55: Global smartphone shipments 2017-2022 (millions)
Exhibit 56: Global tablet shipments 2017-2022 (millions)
Exhibit 57: Global connected device market shipments 2017-2022 (millions)
Exhibit 58: IP configurability spectrum
Exhibit 59: Comparison of wireless technologies
Exhibit 60: Node transition in the semiconductor industry
Exhibit 61: Vendor landscape
Exhibit 62: Landscape disruption
Exhibit 63: Parameters of competition in the global interface IP market
Exhibit 64: Vendor share in the global interface IP market 2017
Exhibit 65: Vendors covered
Exhibit 66: Vendor classification
Exhibit 67: Market positioning of vendors
Exhibit 68: Arm - Overview
Exhibit 69: Arm - Business segments
Exhibit 70: Arm - Organizational developments
Exhibit 71: Arm - Geographic focus
Exhibit 72: Arm - Segment focus
Exhibit 73: Arm - Key offerings
Exhibit 74: Cadence Design Systems - Overview
Exhibit 75: Cadence Design Systems - Business segments
Exhibit 76: Cadence Design Systems - Organizational developments
Exhibit 77: Cadence Design Systems - Geographic focus
Exhibit 78: Cadence Design Systems - Segment focus
Exhibit 79: Cadence Design Systems - Key offerings
Exhibit 80: eSilicon - Overview
Exhibit 81: eSilicon - Organizational developments
Exhibit 82: eSilicon - Geographic focus
Exhibit 83: eSilicon - Key offerings
Exhibit 84: Rambus - Overview
Exhibit 85: Rambus - Business segments
Exhibit 86: Rambus - Organizational developments
Exhibit 87: Rambus - Geographic focus
Exhibit 88: Rambus - Segment focus
Exhibit 89: Rambus - Key offerings
Exhibit 90: Synopsys - Overview
Exhibit 91: Synopsys- Business segments
Exhibit 92: Synopsys - Organizational developments
Exhibit 93: Synopsys - Geographic focus
Exhibit 94: Synopsys - Segment focus
Exhibit 95: Synopsys - Key offerings
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FEATURED COMPANIES

  • Arm
  • Cadence Design Systems
  • eSilicon
  • Rambus
  • Synopsys
  • MORE
New Report Released: - Global Interface IP Market 2018-2022

The author of the report recognizes the following companies as the key players in the global interface IP market: Arm, Cadence Design Systems, eSilicon, Rambus, and Synopsys.

Commenting on the report, an analyst from the research team said: “One trend in the market is proliferation of wireless technologies. The growing proliferation of wireless technologies will drive the growth of the interface IP market till the end of 2022. Continuous evolution of IoT has resulted in the adoption of Internet Protocol version 6 (IPv6).”

According to the report, one driver in the market is increase in the demand for modern SoC chips. Manufacturers in the market are developing the SoC technology to fulfill the growing requirement to embed more functions on a single IC. The system-on-chip (SoC) technology offers numerous advantages such as high-on-chip frequencies, a strong density of functions, reliability, and reasonable unit costs.

Further, the report states that one challenge in the market is heavy investments driven by the complexity of IP core designs. The designs and development costs of semiconductor IPs are getting increasingly complex and expensive. This is because semiconductor IP vendors need to invest additional time and money to develop complex algorithms for addressing the growing needs of customers.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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  • Arm
  • Cadence Design Systems
  • eSilicon
  • Rambus
  • Synopsys
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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