+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

PRINTER FRIENDLY

UnitedSiC UJN1205K 1200V SiC JFET Complete Teardown Report

  • ID: 4576750
  • Report
  • June 2018
  • Region: Global
  • 74 Pages
  • System Plus Consulting
1 of 2

Silicon carbide-based device penetration is expanding in industrial applications. JFET is one of them. UnitedSiC offers two types of medium-voltage (1200V) SiC JFETs, with the UJN1205K achieving the highest current (38A).

This JFET  is marketed as the ideal solution for circuit protection because of its ability to handle peak temperatures and  limit current by a rapid decrease due to self-heating. The device also offers a low on-resistance of 45m?, but a very high current density of 4.08 A/mm2 at 25°C,  thanks in large part to its trench structure with special openings for contacts.

UnitedSiC employs in its JFET structure a unique angled implantation process to improve threshold voltage control, and a silicide for both gate and source contact to boost  contact resistance.

Owing to its design, the device’s cost is very competitive regarding its special steps.

Also, the packaging is optimized for cost-savings.

This report presents a deep technology analysis of the UJN1205K device, assembled in a TO247 package. Also included is a  production cost analysis, and comparisons with its JFET counterpart from SemiSouth. This comparison highlights the differences in the design technology choices and the electrical/geometrical parameters.

Note: Product cover images may vary from those shown
2 of 2

1. Introduction

  • Executive Summary
  • Reverse Costing Methodology
  • Glossary
  • SiC Power Device Market

2. Company Profile

  • UnitedSiC
  • Portfolio
  • Supply Chain

3. Physical Analysis

  • Physical Analysis – Summary
  • Package Analysis
    • Package opening
    • Package cross-section
  • JFET Die
    • JFET die view and dimensions
    • JFET delayering and main blocs
    • JFET die process
    • JFET die cross-section
    • JFET die process characteristics

4. Manufacturing Process

  • JFET Die Front-End Process
  • JFET Fabrication Unit
  • Packaging Process and Fabrication Unit

5. Cost Analysis

  • Summary of the Cost Analysis
  • Yields Explanation and Hypotheses
  • JFET Die
    • JFET die front-end cost
    • JFET die probe test, thinning and dicing
    • JFET die wafer cost
    • JFET die cost
  • Complete Device
    • Assembled components cost
    • Assembly summary
    • Component cost

6. Sales Price

7. Comparison of JFETs from UnitedSiC  and SemiSouth

8. Company Services

Note: Product cover images may vary from those shown
3 of 2

Loading
LOADING...

Adroll
adroll