This Microelectronics TOE profiles developments in silicon photonics, radio frequency transformers, nanoparticles, and 3D chips. Silica-based variable optical attenuator arrays, optical integration using silicon photonics integration platform, radio frequency transformers with 3D nested architecture, carbon nanotubes incorporated with gadolinium, and a multi-jet cooler for 3D chips are profiled in the TOE.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Table of Contents
1. Innovations in Silicon Photonics, Radio Frequency Transformers, Nanoparticles, and 3D Chips
Silica-based Variable Optical Attenuator Arrays
Optical Integration Using Silicon Photonics Technology Platform
Radio Frequency Transformers with 3D Nested Architecture
Carbon Nanotubes Incorporated with Gadolinium
Multi-jet Cooler for 3D Chips