This Microelectronics TOE profiles developments in data storage, silicon chips, multi-chip circuits, and transceivers. Innovations include silicon chip using asynchronous resilience, transceiver using local oscillator phase shifting approach, software-defined block storage featuring elastic NVMe, multi-chip circuits integrated using a placement technology, and FPGA platform that delivers high power and efficiency
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Table of Contents
1. Innovations in Data Storage, Multi-chip Circuits, Silicon Chips, Wearables, and Transceivers
- Silicon Chip Using Asynchronous Resilience
- Transceiver Using Local Oscillator Phase Shifting Approach
- Software-defined Block Storage Featuring Elastic NVMe
- Multi-chip Circuits Integrated Using a Placement Technology
- FPGA Platform that Delivers High Power and Efficiency
- Industry Contacts