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Automotive Integrated Circuit Market by Type and Application - Global Opportunity Analysis and Industry Forecast, 2018-2025

  • ID: 4612810
  • Report
  • Region: Global
  • 259 pages
  • Allied Analytics LLP
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FEATURED COMPANIES

  • Infineon Technologies AG
  • Intel
  • NXP Semiconductors N.V
  • Qualcomm
  • Robert Bosch
  • ROHM CO. LTD.
  • MORE
Integrated circuit (IC) is a semiconductor device, which contains resistors, capacitors, and transistors. ICs, also known as chip or microchip, are used as microcontrollers in vehicles. Automotive ICs are customized for specific applications within the vehicle system.

The global automotive IC market registered a significant growth corresponding to the increase in vehicle production globally. According to the UK Motor Industry Report, there were 1.75 million vehicles produced in the UK in 2017, 1.67 million of which were passenger vehicles and 78,000 of which were commercial vehicles. Moreover, government’s industrial strategy for the automotive sector focused on the development of ultralow emission, connected, and autonomous vehicles, which fueled the growth of the market.

The Asia-Pacific region is expected to register substantial growth during the forecast period, owing to government incentives encouraging vehicle standards and increase in concerns associated with safety & security of passengers and vehicles in the region. However, complexity in the design of automotive ICs hinder the market growth. The design chain of automotive IC is extremely complex than those of mobile phones or electronic home appliances, such as televisions and remote controllers. This makes the designing of highly reliable automotive ICs a difficult task. On the contrary, reduction in prices of ICs and increase in demand for electronics in vehicles are expected to offer lucrative opportunities for the market.

The automotive IC market is segmented based on type, application, and region. Depending on type, the market is fragmented into monolithic integrated circuits and hybrid or multichip integrated circuits. The multichip ICs are further divided into digital ICs, analog ICs, and mixed signal ICs. The applications covered in the study include ADAS, In-vehicle networking, engine management system, transmission control system, and others. Region wise, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
Major players operating in the automotive IC market are Intel, Samsung, Robert Bosch, Qualcomm, Renesas Electronics Corporation, Infineon Technologies AG, STMicroelectronics N.V., ROHM CO. LTD., Texas Instruments, and NXP Semiconductors N.V.

These players focus on vital market strategies such as mergers, acquisitions, collaborations, and partnerships to strengthen their market reach, thereby retaining their position in the competitive market.

KEY BENEFITS FOR STAKEHOLDERS

This study includes the analytical depiction of the global automotive IC market along with current trends and future estimations to determine the imminent investment pockets.
The report presents information regarding key drivers, restraints, and opportunities.
The current market is quantitatively analyzed from 2017 to 2025 to highlight the financial competency of the industry.
Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the global industry.

KEY MARKET SEGMENTS

BY TYPE

Monolithic Integrated circuits
Hybrid Integrated circuits
Digital Integrated Circuits
Analog Integrated Circuits
Digital Signal Processor (DSP)

BY APPLICATION:

ADAS
In-vehicle Networking
Engine Management
Transmission Control System
Other
In-vehicle Communication
Battery Control System

BY REGION

North America
Europe
Asia-Pacific
LAMEA
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Infineon Technologies AG
  • Intel
  • NXP Semiconductors N.V
  • Qualcomm
  • Robert Bosch
  • ROHM CO. LTD.
  • MORE
CHAPTER 1: INTRODUCTION
1.1. REPORT DESCRIPTION
1.2. KEY MARKET SEGMENTS
1.3. RESEARCH METHODOLOGY
1.3.1. Secondary research
1.3.2. Primary research
1.3.3. Analyst tools & models

CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET OVERVIEW
3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top Winning Strategies
3.3. PORTER'S FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS, 2017
3.5. MARKET DYNAMICS
3.5.1. Drivers
3.5.1.1. Rapid electrification of automobiles
3.5.1.2. Emergence of internet of things (IoT) in integrated circuits
3.5.1.3. Growing adoption of sensors and real-time tracking system
3.5.2. Restraint
3.5.2.1. Design complexities of ICs
3.5.3. Opportunities
3.5.3.1. Surge in demand of intelligent transportation system

CHAPTER 4: GLOBAL AUTOMOTIVE IC MARKET, BY TYPE
4.1. OVERVIEW
4.2. MONOLITHIC INTEGRATED CIRCUITS
4.2.1. Key market trends and opportunities
4.2.2. Market size and forecast by region
4.2.3. Market analysis by country
4.3. HYBRID OR MULTICHIP INTEGRATED CIRCUIT
4.3.1. Key market trends and opportunities
4.3.2. Market size and forecast by region
4.3.3. Market size and forecast by type
4.3.3.1 Analog IC
4.3.3.1 Digital IC
4.3.3.1 Mixed IC
4.3.4. Market analysis by country

CHAPTER 5: GLOBAL AUTOMOTIVE IC MARKET, BY APPLICATION
5.1. OVERVIEW
5.2. ADVANCED DRIVER ASSISTANCE SYSTEM (ADAS)
5.2.1. Key market trends and opportunities
5.2.2. Market size and forecast by region
5.2.3. Market analysis by country
5.3. IN-VEHICLE NETWORKING
5.3.1. Key market trends and opportunities
5.3.2. Market size and forecast by region
5.3.3. Market analysis by country
5.4. ENGINE MANAGEMENT
5.4.1. Key market trends and opportunities
5.4.2. Market size and forecast by region
5.4.3. Market analysis by country
5.5. TRANSMISSION CONTROL SYSTEM
5.5.1. Key market trends and opportunities
5.5.2. Market size and forecast by region
5.5.3. Market analysis by country
5.6. OTHERS
5.6.1. Key market trends and opportunities
5.6.2. Market size and forecast by region
5.6.3. Market analysis by country

CHAPTER 6: GLOBAL AUTOMOTIVE IC MARKET, BY REGION
6.1. OVERVIEW
6.2. NORTH AMERICA
6.2.1. Key market trends and opportunities.
6.2.2. Market size and forecast, by product type
6.2.3. Market size and forecast by application
6.2.4. Market analysis by country
6.2.4.1. U.S.
6.2.4.1.1. Market size and forecast, by type
6.2.4.1.2. Market size and forecast, by application
6.2.4.2. Canada
6.2.4.2.1. Market size and forecast, by type
6.2.4.2.2. Market size and forecast, by application
6.2.4.3. Mexico
6.2.4.3.1. Market size and forecast, by type
6.2.4.3.2. Market size and forecast, by application
6.3. EUROPE
6.3.1. Key market trends
6.3.2. Market size and forecast by type
6.3.3. Market size and forecast by application
6.3.4. Market analysis by country
6.3.4.1. UK
6.3.4.1.1. Market size and forecast, by type
6.3.4.1.2. Market size and forecast, by application
6.3.4.2. Germany
6.3.4.2.1. Market size and forecast, by type
6.3.4.2.2. Market size and forecast, by application
6.3.4.3. France
6.3.4.3.1. Market size and forecast, by type
6.3.4.3.2. Market size and forecast, by application
6.3.4.4. Rest of Europe
6.3.4.4.1. Market size and forecast, by type
6.3.4.4.2. Market size and forecast, by application
6.4. ASIA-PACIFIC
6.4.1. Key market trends and opportunities
6.4.2. Market size and forecast by type
6.4.3. Market size and forecast by application
6.4.4. Market analysis by country
6.4.4.1. China
6.4.4.1.1. Market size and forecast, by type
6.4.4.1.2. Market size and forecast, by application
6.4.4.2. India
6.4.4.2.1. Market size and forecast, by type
6.4.4.2.2. Market size and forecast, by application
6.4.4.3. Japan
6.4.4.3.1. Market size and forecast, by type
6.4.4.3.2. Market size and forecast, by application
6.4.4.4. South Korea
6.4.4.4.1. Market size and forecast, by type
6.4.4.4.2. Market size and forecast, by application
6.4.4.5. Rest of Asia-Pacific
6.4.4.5.1. Market size and forecast, by type
6.4.4.5.2. Market size and forecast, by application
6.5. LAMEA
6.5.1. Key market trends and opportunities
6.5.2. Market size and forecast by type
6.5.3. Market size and forecast by application
6.5.4. Market analysis by Region
6.5.4.1. Latin America
6.5.4.1.1. Market size and forecast, by type
6.5.4.1.2. Market size and forecast, by application
6.5.4.2. Middle East
6.5.4.2.1. Market size and forecast, by type
6.5.4.2.2. Market size and forecast, by application
6.5.4.3. Africa
6.5.4.3.1. Market size and forecast, by type
6.5.4.3.2. Market size and forecast, by application

CHAPTER 7: COMPANY PROFILE
7.1. INTEL CORPORATION
7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Business performance
7.1.5. Key strategic moves and developments
7.2. SAMSUNG
7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Operating business segments
7.2.4. Business performance
7.2.5. Key strategic moves and developments
7.3. ROBERT BOSCH
7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Business performance
7.3.5. Key strategic moves and developments
7.4. QUALCOMM
7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Business performance
7.4.5. Key strategic moves and developments
7.5. RENESAS ELECTRONICS CORPORATION
7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Operating business segments
7.5.4. Product portfolio
7.5.5. Business performance
7.5.6. Key strategic moves and developments
7.6. INFINEON TECHNOLOGIES AG
7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments
7.7. STMICROELECTRONICS N.V.
7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Business performance
7.7.5. Key strategic moves and developments
7.8. ROHM SEMICONDUCTOR
7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Business performance
7.8.5. Key strategic moves and developments
7.9. TEXAS INSTRUMENTS
7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Product portfolio
7.9.5. Business performance
7.9.6. Key strategic moves and developments
7.10. NXP SEMICONDUCTORS N.V.
7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Product portfolio
7.10.4. Product portfolio
7.10.5. Business performance
7.10.6. Key strategic moves and developments
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Infineon Technologies AG
  • Intel
  • NXP Semiconductors N.V
  • Qualcomm
  • Robert Bosch
  • ROHM CO. LTD.
  • MORE
According to a recent report published titled, Automotive IC Market by Type and Application: Global Opportunity Analysis and Industry Forecast, 2018-2025, the global automotive IC market was valued at $43,240 million in 2017, and is projected to reach at $89,140 million by 2025, growing at a CAGR of 9.3% from 2018 to 2025.

At present, the North America region dominates the global automotive IC market, owing to increase in adoption of high-end vehicles in this region. Factors such as increase in vehicle production and improvement in vehicle standards with emerging technologies fuel the growth of the Asia-Pacific automotive IC market. Moreover, various technological advancements in electric vehicles have been in progress, owing to government initiatives, which propel the market growth. For instance, according to the Wall Street Jourl, Chi is close to filizing a $47 billion investment fund that would fince semiconductor research and chip start-up development, which is expected to assist in propelling the growth of the automotive IC market.

Key Findings of the Automotive IC Market:

In 2017, the engine magement segment generated the highest revenue in the global automotive IC market.
In 2017, the hybrid or multichip integrated circuit segment generated the highest revenue among the other IC types in the global automotive IC market.

The key players profiled in the report include Intel, Samsung, Robert Bosch, Qualcomm, Renesas Electronics Corporation, Infineon Technologies AG, STMicroelectronics N.V., ROHM CO. LTD., Texas Instruments, and NXP Semiconductors N.V.
Note: Product cover images may vary from those shown
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  • Intel
  • Samsung
  • Robert Bosch
  • Qualcomm
  • Renesas Electronics Corporation
  • Infineon Technologies AG
  • STMicroelectronics N.V.
  • ROHM CO. LTD.
  • Texas Instruments
  • NXP Semiconductors N.V
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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