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Advancements in Semiconductor Technologies and E-textiles

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  • 15 Pages
  • September 2018
  • Region: Global
  • Frost & Sullivan
  • ID: 4661742

This Microelectronics TOE profiles advancements in semiconductor technologies, short wave infrared cameras for semiconductor inspection, and smart textiles. A smart textile solution for astronauts to monitor health conditions, smart textile technology for athletes, C-V2X chipset for commercial sampling of connected vehicles, an integrated circuit camera to detect early-staged defects in semiconductor chipset, and an AI-based system-on-chip for mobile computing are in focus in this TOE.

The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

Table of Contents

1. Innovations in Semiconductor Technologies and E-textiles

  • Smart Textile Technology for Athletes
  • Smart Textile Solution for Astronauts to Monitor Health Conditions
  • Integrated Circuit Camera to Detect Early-stage Defects in Semiconductor Chipsets
  • C-V2X Chipset for Commercial Sampling of Connected Vehicles
  • AI-based System-on-chip for Mobile Computing
  • Industry Contacts