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Ainstein T-79: Automotive 79GHz Short Range Radar Complete Teardown Report

  • ID: 4662699
  • Report
  • Region: Global
  • 57 Pages
  • System Plus Consulting
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With this New Short-Range Radar Generation, Ainstein has Significantly Decreased the Volume and Manufacturing Cost of the Sensor Compared to Competitor Solutions

FEATURED COMPANIES

The Ainstein T-79 is designed for Advanced Driver Assistance Systems (ADAS) applications, like warning or assisted braking functions, blind spot monitoring, lane change assist and rear crossing traffic alerts.

It is based on 79GHz technology and contains six planar antennas, four for reception and two for transmission. The sensor has a field of view of ±45° in azimuth and a maximum range of 55m.

Resulting from a collaboration with Texas Instruments (TI), the system integrates only one electronic board, equipped with a TI CMOS single-chip millimeter wave (mmWave) sensor. This monolithic microwave integrated circuit (MMIC) features six channels, again that’s four receivers and two transmitters, along with a microcontroller unit (MCU) and a digital signal processor (DSP) all on the same chip. The enables ultra-low unit cost and power consumption of 4.2W.

The electronic board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate, and is equipped with planar antennas.

With this new short-range radar generation, Ainstein has significantly decreased the volume and manufacturing cost of the sensor compared to competitor solutions. The report contains a comparison with Delphi’s 76/77GHz Blind Spot Radar.

Based on a complete teardown analysis of the Ainstein radar, this report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.

Note: Product cover images may vary from those shown
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FEATURED COMPANIES

1. Overview/Introduction

  • Executive Summary
  • Company Profile
  • Reverse Costing Methodology

2. Physical Analysis

  • Global View of the Radar
  • Views and Dimensions of the Radar
  • Radar Opening
  • Electronic Board
  • Global View
  • High Definition Photo
  • Component Markings and Identification
  • Block Diagram
  • RF Chipset

3. Cost Analysis

  • Board Cross Section and EDX Analysis
  • PCB Cost
  • BOM Cost – Electronic Board
  • BOM Cost – Housing
  • Material Cost Breakdown
  • Accessing the Added Value (AV) cost
  • Electronic Board Manufacturing Flow
  • Details of the Housing Assembly
  • Added Value Cost Breakdown
  • Manufacturing Cost Breakdown
  • Comparison with Delphi BSD Radar

4. Estimated Price Analysis

  • Estimation of the Selling Price
Note: Product cover images may vary from those shown
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  • Ainstein
  • Delphi
Note: Product cover images may vary from those shown
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