MEMS inkjet printheads are benefiting from growing interest in industrial printing for textiles, labels or decoration. A huge compound annual growth rate (CAGR) of 18% for the next five years is expected for commercial and industrial MEMS printheads, reaching more than $200M revenue in 2023.
The publisher has long experience in printhead reverse costing studies, with more than 15 custom analyses. Today we are using our competency to simultaneously release two reports on Epson and Xaar printheads.
The 1201 printhead is the first MEMS inkjet die from Xaar for industrial printers. The printhead integrates a large MEMS die, with area exceeding 400mm². Each printhead can print one, two or four colors thanks to their 1280 nozzles. The density is therefore 300dpi for four colors and 600dpi for two colors.
This reverse costing study provides insight into technological data, manu-facturing cost, and selling price of the MEMS inkjet manufactured by Ricoh and the 1201 printhead supplied by Xaar.
The MEMS inkjet uses two silicon substrates to manufacture the inlet and the pressure chamber. The nozzles are still manufactured in steel. The membrane of the pressure chamber is a very complex multilayer structure. The lead zirconate titanate (PZT) thin film actuator is manufactured above this, with its two electrodes showing complexity in material choice and in stacking structure. Significantly, exclusive deposition tech-nology developed by Ricoh uses less of the very expensive sol-gel PZT.
The MEMS inkjet die has four rows of nozzles interleaved on the die. The MEMS dies are assembled in the 1201 printhead with a flex to connect the MEMS to the printer. The four driver integrated circuits are directly assembled on the MEMS die.
This report includes a comparison between the Xaar 1201 and the Epson PrecisionCore printhead.
- Executive Summary
- Reverse Costing Methodology
2. Company Profile
3. Physical Analysis
- Printer Disassembly
- Print head views and dimensions
- Print head disassembly and cross-section
- Driver IC
- Die dimension
- CMOS process
- Inkjet Die
- Nozzles and inlet and outler
- Pressure chambers
- PZT actuator
4. Manufacturing Process
- Driver IC
- 1201 Inkjet Die and Printhead
5. Cost Analysis
- Accessing the BOM
- Driver Wafer and Die Cost
- Driver wafer and die cost
- Nozzle plate cost
- Flow path substrate cost
- Vibration plate cost
- Protection substrate cost
- Final assembly cost
- Component cost sensor die
- BOM Cost
- Material Cost Breakdown by Component Category
- Accessing the Added Value (AV) Cost
- Details of the Electronic Board AV Cost and the Housing AV Cost
- Manufacturing Cost Breakdown for 3M units
6. Selling Price